Estimation of curing profile's parameters for Flip Chip packaging using DSC and TGA

Z. Kornain, Azman Jalar @ Jalil, Rozaidi Rasid, C. S. Foong, T. L. Wong

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents the method to estimate curing profile's parameters for curing process of Moisture Resistance Cyanate Ester (MRCE) based underfill used in Flip Chip Ceramic Ball Grid Array (FC-CBGA). The two steps curing profile was found to eliminate voids formation in underfill during curing process. The important parameters in two steps curing profile such as first fixed temperature and duration of second temperature rise were estimated by superimposed of cure initiation curve and weight percentage loss curve of underfill epoxy material. Differential Scanning Calorimeter (DSC) analysis was carried out to characterize the cure kinetics reaction of underfill epoxy and produced the cure initiation curve. Thermal Gravimetric Analysis (TGA) was performed to characterize the weight loss of underfill and produced the weight loss curve. It was estimated that the first fixed temperature and duration of second temperature rise for two steps curing profile were 100 oC and 60-80 minutes respectively. The simulation experiment was conducted to verify the profile and no voids formation observed along this curing process.

Original languageEnglish
Title of host publicationKey Engineering Materials
Pages950-955
Number of pages6
Volume467-469
DOIs
Publication statusPublished - 2011
Event2011 International Conference on Materials, Mechatronics and Automation, ICMMA 2011 - Melbourne, VIC
Duration: 15 Jan 201116 Jan 2011

Publication series

NameKey Engineering Materials
Volume467-469
ISSN (Print)10139826

Other

Other2011 International Conference on Materials, Mechatronics and Automation, ICMMA 2011
CityMelbourne, VIC
Period15/1/1116/1/11

Fingerprint

Gravimetric analysis
Calorimeters
Curing
Packaging
Scanning
Cyanates
Ball grid arrays
Temperature
Hot Temperature
Reaction kinetics
Esters
Moisture

Keywords

  • Curing profile
  • Flip-chip
  • Underfill
  • Voids formation

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Kornain, Z., Jalar @ Jalil, A., Rasid, R., Foong, C. S., & Wong, T. L. (2011). Estimation of curing profile's parameters for Flip Chip packaging using DSC and TGA. In Key Engineering Materials (Vol. 467-469, pp. 950-955). (Key Engineering Materials; Vol. 467-469). https://doi.org/10.4028/www.scientific.net/KEM.467-469.950

Estimation of curing profile's parameters for Flip Chip packaging using DSC and TGA. / Kornain, Z.; Jalar @ Jalil, Azman; Rasid, Rozaidi; Foong, C. S.; Wong, T. L.

Key Engineering Materials. Vol. 467-469 2011. p. 950-955 (Key Engineering Materials; Vol. 467-469).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kornain, Z, Jalar @ Jalil, A, Rasid, R, Foong, CS & Wong, TL 2011, Estimation of curing profile's parameters for Flip Chip packaging using DSC and TGA. in Key Engineering Materials. vol. 467-469, Key Engineering Materials, vol. 467-469, pp. 950-955, 2011 International Conference on Materials, Mechatronics and Automation, ICMMA 2011, Melbourne, VIC, 15/1/11. https://doi.org/10.4028/www.scientific.net/KEM.467-469.950
Kornain Z, Jalar @ Jalil A, Rasid R, Foong CS, Wong TL. Estimation of curing profile's parameters for Flip Chip packaging using DSC and TGA. In Key Engineering Materials. Vol. 467-469. 2011. p. 950-955. (Key Engineering Materials). https://doi.org/10.4028/www.scientific.net/KEM.467-469.950
Kornain, Z. ; Jalar @ Jalil, Azman ; Rasid, Rozaidi ; Foong, C. S. ; Wong, T. L. / Estimation of curing profile's parameters for Flip Chip packaging using DSC and TGA. Key Engineering Materials. Vol. 467-469 2011. pp. 950-955 (Key Engineering Materials).
@inproceedings{e5c19d90ad5c46c5a8410af95c1808d3,
title = "Estimation of curing profile's parameters for Flip Chip packaging using DSC and TGA",
abstract = "This paper presents the method to estimate curing profile's parameters for curing process of Moisture Resistance Cyanate Ester (MRCE) based underfill used in Flip Chip Ceramic Ball Grid Array (FC-CBGA). The two steps curing profile was found to eliminate voids formation in underfill during curing process. The important parameters in two steps curing profile such as first fixed temperature and duration of second temperature rise were estimated by superimposed of cure initiation curve and weight percentage loss curve of underfill epoxy material. Differential Scanning Calorimeter (DSC) analysis was carried out to characterize the cure kinetics reaction of underfill epoxy and produced the cure initiation curve. Thermal Gravimetric Analysis (TGA) was performed to characterize the weight loss of underfill and produced the weight loss curve. It was estimated that the first fixed temperature and duration of second temperature rise for two steps curing profile were 100 oC and 60-80 minutes respectively. The simulation experiment was conducted to verify the profile and no voids formation observed along this curing process.",
keywords = "Curing profile, Flip-chip, Underfill, Voids formation",
author = "Z. Kornain and {Jalar @ Jalil}, Azman and Rozaidi Rasid and Foong, {C. S.} and Wong, {T. L.}",
year = "2011",
doi = "10.4028/www.scientific.net/KEM.467-469.950",
language = "English",
isbn = "9783037850176",
volume = "467-469",
series = "Key Engineering Materials",
pages = "950--955",
booktitle = "Key Engineering Materials",

}

TY - GEN

T1 - Estimation of curing profile's parameters for Flip Chip packaging using DSC and TGA

AU - Kornain, Z.

AU - Jalar @ Jalil, Azman

AU - Rasid, Rozaidi

AU - Foong, C. S.

AU - Wong, T. L.

PY - 2011

Y1 - 2011

N2 - This paper presents the method to estimate curing profile's parameters for curing process of Moisture Resistance Cyanate Ester (MRCE) based underfill used in Flip Chip Ceramic Ball Grid Array (FC-CBGA). The two steps curing profile was found to eliminate voids formation in underfill during curing process. The important parameters in two steps curing profile such as first fixed temperature and duration of second temperature rise were estimated by superimposed of cure initiation curve and weight percentage loss curve of underfill epoxy material. Differential Scanning Calorimeter (DSC) analysis was carried out to characterize the cure kinetics reaction of underfill epoxy and produced the cure initiation curve. Thermal Gravimetric Analysis (TGA) was performed to characterize the weight loss of underfill and produced the weight loss curve. It was estimated that the first fixed temperature and duration of second temperature rise for two steps curing profile were 100 oC and 60-80 minutes respectively. The simulation experiment was conducted to verify the profile and no voids formation observed along this curing process.

AB - This paper presents the method to estimate curing profile's parameters for curing process of Moisture Resistance Cyanate Ester (MRCE) based underfill used in Flip Chip Ceramic Ball Grid Array (FC-CBGA). The two steps curing profile was found to eliminate voids formation in underfill during curing process. The important parameters in two steps curing profile such as first fixed temperature and duration of second temperature rise were estimated by superimposed of cure initiation curve and weight percentage loss curve of underfill epoxy material. Differential Scanning Calorimeter (DSC) analysis was carried out to characterize the cure kinetics reaction of underfill epoxy and produced the cure initiation curve. Thermal Gravimetric Analysis (TGA) was performed to characterize the weight loss of underfill and produced the weight loss curve. It was estimated that the first fixed temperature and duration of second temperature rise for two steps curing profile were 100 oC and 60-80 minutes respectively. The simulation experiment was conducted to verify the profile and no voids formation observed along this curing process.

KW - Curing profile

KW - Flip-chip

KW - Underfill

KW - Voids formation

UR - http://www.scopus.com/inward/record.url?scp=79952560132&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=79952560132&partnerID=8YFLogxK

U2 - 10.4028/www.scientific.net/KEM.467-469.950

DO - 10.4028/www.scientific.net/KEM.467-469.950

M3 - Conference contribution

AN - SCOPUS:79952560132

SN - 9783037850176

VL - 467-469

T3 - Key Engineering Materials

SP - 950

EP - 955

BT - Key Engineering Materials

ER -