Erratum

Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study(ASME J. Electron. Packag.(2016) 138:2(020804) 10.1115/1.4033069)

Kim Shyong Siow, Y. T. Lin

Research output: Contribution to journalComment/debate

4 Citations (Scopus)
Original languageEnglish
Article number037001
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume138
Issue number3
DOIs
Publication statusPublished - 1 Sep 2016

Fingerprint

Microelectronics
Packaging
Silver
Electrons

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Computer Science Applications
  • Mechanics of Materials

Cite this

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title = "Erratum: Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study(ASME J. Electron. Packag.(2016) 138:2(020804) 10.1115/1.4033069)",
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