Electrochemical migration behaviours of low silver content solder alloy SAC 0307 on printed circuit boards (PCBs) in NaCl solution

Norinsan Kamil Othman, Koh Yunn Teng, Azman Jalar @ Jalil, Fakhrozi Che Ani, Zamri Samsudin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

Electrochemical migration (ECM) of solder joining can result in the growth of a metal deposit with dendrite structure from cathode to anode. In electronic device, this phenomenon potentially leads to the incompetence or failure of whole devices. In this paper, the ECM behaviour of printed circuit boards (PCBs) with SAC 0307, one of the low-cost lead-free solder alloys with less silver content, has been studied. The corrosion behaviour of SAC 0307 has been investigated by using sodium chloride solution in different concentrations which is between 0.01 M to 1.0 M as a medium. A Water Drop Test (WDT) was carried out and the time-to-failure of each sample has been recorded. After WDT test, the dendrite phase was identified using Variable Pressure Scanning Electron Microscope (VPSEM) with Energy Dispersive X-ray Spectroscopy (EDX) and X-ray Photoelectron Spectroscopy (XPS) to investigate its surface morphology and corrosion products. As results, it has been found that the corrosion susceptibility of SAC 0307 is greatly influenced by the concentration of the medium solution used. The voltage drop occurred was due to the dendrite grew at the cathode electrode on the PCBs and expanded to the anode electrode, indicating a significant effect of aggressive behaviour of the medium used. The rate of the dendrite growth was affected by the concentration of the medium used. The main element found in the dendrites on the SAC 0307 on PCBs was Tin as it is more mobile than Cu.

Original languageEnglish
Title of host publicationMaterials Science Forum
PublisherTrans Tech Publications Ltd
Pages3-12
Number of pages10
Volume846
ISBN (Print)9783038357520
DOIs
Publication statusPublished - 2016
Event28th Regional Conference on Solid State Science and Technology, RCSSST 2014 - Cameron Highlands, Pahang, Malaysia
Duration: 25 Nov 201427 Nov 2014

Publication series

NameMaterials Science Forum
Volume846
ISSN (Print)02555476

Other

Other28th Regional Conference on Solid State Science and Technology, RCSSST 2014
CountryMalaysia
CityCameron Highlands, Pahang
Period25/11/1427/11/14

Fingerprint

printed circuits
circuit boards
dendrites
solders
Silver
Printed circuit boards
Soldering alloys
silver
Corrosion
drop tests
Anodes
Cathodes
corrosion
Electrodes
Dendrites (metallography)
Water
Sodium chloride
Sodium Chloride
anodes
Joining

Keywords

  • Corrosion
  • Dendrite
  • Electrochemical migration
  • Printed circuit board
  • SAC 0307

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanical Engineering
  • Mechanics of Materials

Cite this

Othman, N. K., Teng, K. Y., Jalar @ Jalil, A., Ani, F. C., & Samsudin, Z. (2016). Electrochemical migration behaviours of low silver content solder alloy SAC 0307 on printed circuit boards (PCBs) in NaCl solution. In Materials Science Forum (Vol. 846, pp. 3-12). (Materials Science Forum; Vol. 846). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/MSF.846.3

Electrochemical migration behaviours of low silver content solder alloy SAC 0307 on printed circuit boards (PCBs) in NaCl solution. / Othman, Norinsan Kamil; Teng, Koh Yunn; Jalar @ Jalil, Azman; Ani, Fakhrozi Che; Samsudin, Zamri.

Materials Science Forum. Vol. 846 Trans Tech Publications Ltd, 2016. p. 3-12 (Materials Science Forum; Vol. 846).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Othman, NK, Teng, KY, Jalar @ Jalil, A, Ani, FC & Samsudin, Z 2016, Electrochemical migration behaviours of low silver content solder alloy SAC 0307 on printed circuit boards (PCBs) in NaCl solution. in Materials Science Forum. vol. 846, Materials Science Forum, vol. 846, Trans Tech Publications Ltd, pp. 3-12, 28th Regional Conference on Solid State Science and Technology, RCSSST 2014, Cameron Highlands, Pahang, Malaysia, 25/11/14. https://doi.org/10.4028/www.scientific.net/MSF.846.3
Othman NK, Teng KY, Jalar @ Jalil A, Ani FC, Samsudin Z. Electrochemical migration behaviours of low silver content solder alloy SAC 0307 on printed circuit boards (PCBs) in NaCl solution. In Materials Science Forum. Vol. 846. Trans Tech Publications Ltd. 2016. p. 3-12. (Materials Science Forum). https://doi.org/10.4028/www.scientific.net/MSF.846.3
Othman, Norinsan Kamil ; Teng, Koh Yunn ; Jalar @ Jalil, Azman ; Ani, Fakhrozi Che ; Samsudin, Zamri. / Electrochemical migration behaviours of low silver content solder alloy SAC 0307 on printed circuit boards (PCBs) in NaCl solution. Materials Science Forum. Vol. 846 Trans Tech Publications Ltd, 2016. pp. 3-12 (Materials Science Forum).
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