Kelakuan Migrasi Elektrokimia Pateri SAC305 dalam Larutan Natrium Hidroksida pada Kepekatan yang Pelbagai

Translated title of the contribution: Electrochemical migration behaviour of SAC305 solder in various concentrations of sodium hydroxide solution

Research output: Contribution to journalArticle

Abstract

Miniaturization of the interconnection size in printed circuit board (PCB) leads to electrochemical migration (ECM) causing short circuit. ECM is a form of corrosion which significantly affects the corrosion reliability for most of the electronic equipment. Migration is a phenomenon in which the metallic ions are moving from one region to another region of metal, resulting in metal or alloy deposits at cathodic part. Hence, this study was performed in order to determine corrosion behaviour of SAC305 solder via water drop test (WDT) in various concentration of sodium hydroxide (NaOH) included 0.05M, 0.1M, 0.5M and 1.0M. The results showed that mean time to failure (MTTF) of SAC305 solder reduced when the samples were exposed to higher concentration of NaOH solution. Formation of dendrite was observed after SAC305 solder corroded due to ECM process which resulted in short circuit. Corrosion product such as Cu(OH)2 and SnO2 were formed after the solder was corroded. Tiny pitting was formed especially at high concentration of NaOH which was due to dissolution of Sn anode.

Original languageMalay
Pages (from-to)1867-1872
Number of pages6
JournalSains Malaysiana
Volume47
Issue number8
DOIs
Publication statusPublished - 1 Aug 2018

Fingerprint

Soldering alloys
Sodium
Corrosion
Short circuit currents
Pitting
Metals
Printed circuit boards
Anodes
Dissolution
Electronic equipment
Deposits
Ions
Water

ASJC Scopus subject areas

  • General

Cite this

Kelakuan Migrasi Elektrokimia Pateri SAC305 dalam Larutan Natrium Hidroksida pada Kepekatan yang Pelbagai. / Salleh, Emee Marina; Othman, Norinsan Kamil; Jalar @ Jalil, Azman.

In: Sains Malaysiana, Vol. 47, No. 8, 01.08.2018, p. 1867-1872.

Research output: Contribution to journalArticle

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abstract = "Miniaturization of the interconnection size in printed circuit board (PCB) leads to electrochemical migration (ECM) causing short circuit. ECM is a form of corrosion which significantly affects the corrosion reliability for most of the electronic equipment. Migration is a phenomenon in which the metallic ions are moving from one region to another region of metal, resulting in metal or alloy deposits at cathodic part. Hence, this study was performed in order to determine corrosion behaviour of SAC305 solder via water drop test (WDT) in various concentration of sodium hydroxide (NaOH) included 0.05M, 0.1M, 0.5M and 1.0M. The results showed that mean time to failure (MTTF) of SAC305 solder reduced when the samples were exposed to higher concentration of NaOH solution. Formation of dendrite was observed after SAC305 solder corroded due to ECM process which resulted in short circuit. Corrosion product such as Cu(OH)2 and SnO2 were formed after the solder was corroded. Tiny pitting was formed especially at high concentration of NaOH which was due to dissolution of Sn anode.",
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