Effects of thermal cycling on the mechanical properties of gold wire bonding

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The mechanical properties of gold wire bonding are subjected to thermal cycling (TC) test has been investigated. Gold wire bonding was experienced to temperature cycle of (-65) °C to 150 °C for 10, 100, and 1000 cycles. In order to determine the mechanical properties of gold wire, nanoindentation test was performed. A constant load nanoindentation test was carried out at the center of the gold wire to investigate hardness and reduced modulus. The load-depth curve for the thermal cycled gold wire bond displayed apparent discontinuities during loading as compared to the as-received gold wire bond. The hardness value has increased after the gold wire bond subjected to thermal cycle whilst, the hardness value has decreased with the increment of the TC cycle number. For reduced modulus, the values increased with increase of the TC cycle number. The decrease in the hardness value is in line with theoretical grain size coarsening following thermal treatment. These nanoindentation results are important in assessing the strength of gold wire bond after exposure to the thermal cycles.

Original languageEnglish
Title of host publicationIEEE International Conference on Semiconductor Electronics, Proceedings, ICSE
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages521-524
Number of pages4
ISBN (Print)9781479957606
DOIs
Publication statusPublished - 10 Oct 2014
Event11th IEEE International Conference on Semiconductor Electronics, ICSE 2014 - Kuala Lumpur
Duration: 27 Aug 201429 Aug 2014

Other

Other11th IEEE International Conference on Semiconductor Electronics, ICSE 2014
CityKuala Lumpur
Period27/8/1429/8/14

Fingerprint

Thermal cycling
Gold
Wire
Mechanical properties
Nanoindentation
Hardness
Coarsening
Loads (forces)
Heat treatment
Hot Temperature

Keywords

  • gold wire
  • micromechanical properties
  • nanoindentation
  • thermal cycle

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Yusoff, W. Y. W., Jalar @ Jalil, A., Othman, N. K., & Abdul Rahman, I. (2014). Effects of thermal cycling on the mechanical properties of gold wire bonding. In IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE (pp. 521-524). [6920913] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SMELEC.2014.6920913

Effects of thermal cycling on the mechanical properties of gold wire bonding. / Yusoff, Wan Yusmawati Wan; Jalar @ Jalil, Azman; Othman, Norinsan Kamil; Abdul Rahman, Irman.

IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE. Institute of Electrical and Electronics Engineers Inc., 2014. p. 521-524 6920913.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Yusoff, WYW, Jalar @ Jalil, A, Othman, NK & Abdul Rahman, I 2014, Effects of thermal cycling on the mechanical properties of gold wire bonding. in IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE., 6920913, Institute of Electrical and Electronics Engineers Inc., pp. 521-524, 11th IEEE International Conference on Semiconductor Electronics, ICSE 2014, Kuala Lumpur, 27/8/14. https://doi.org/10.1109/SMELEC.2014.6920913
Yusoff WYW, Jalar @ Jalil A, Othman NK, Abdul Rahman I. Effects of thermal cycling on the mechanical properties of gold wire bonding. In IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE. Institute of Electrical and Electronics Engineers Inc. 2014. p. 521-524. 6920913 https://doi.org/10.1109/SMELEC.2014.6920913
Yusoff, Wan Yusmawati Wan ; Jalar @ Jalil, Azman ; Othman, Norinsan Kamil ; Abdul Rahman, Irman. / Effects of thermal cycling on the mechanical properties of gold wire bonding. IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE. Institute of Electrical and Electronics Engineers Inc., 2014. pp. 521-524
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