Effects of sintering temperature on the physical and mechanical properties of injection-molded Copper/Graphene composite

N. N. Kadiman, M. O.A. Rashid, Norhamidi Muhamad, Abu Bakar Sulong

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

The low thermal resistance of graphene nanoplatelets (GNps), which results in high thermal conductivity, is a promising behavior for thermal management applications, such as heat sinks, in electronic devices. In this study, a Cu/GNps composite was produced by powder injection molding (PIM). A suitable sintering temperature in PIM process is essential to be obtained with the intention of achieving the optimum physical and mechanical properties of the Cu/GNps composite. Therefore, the effects of the sintering temperature on the mechanical and physical properties of Cu/ GNps were investigated. The Cu/GNps composite was prepared with a binder system, and later, such a system was removed during the debinding prior to sintering. The effects of sintering temperatures of 950°C, 1000°C and 1050°C on the physical and mechanical properties of Cu/GNps were examined. It was found that the highest density and tensile strength were obtained when the Cu/GNPs was sintered at 950°C.

Original languageEnglish
Pages (from-to)49-60
Number of pages12
JournalJournal of Advanced Manufacturing Technology
Volume12
Issue number1
Publication statusPublished - 1 Jan 2018

Fingerprint

Sintering
Graphene
Physical property
Copper
Mechanical Properties
Injection
Physical properties
Composite
Mechanical properties
Composite materials
Injection Molding
Powder
Injection molding
Temperature
Thermal Management
Powders
Thermal Resistance
Tensile Strength
Heat sinks
Thermal Conductivity

Keywords

  • Copper
  • GNps
  • Graphene
  • Powder Injection Moulding
  • Sinterin

ASJC Scopus subject areas

  • Software
  • Automotive Engineering
  • Hardware and Architecture
  • Computer Networks and Communications
  • Control and Optimization
  • Industrial and Manufacturing Engineering
  • Management of Technology and Innovation

Cite this

@article{4ff37ecac15b4109921c0b4f056eb779,
title = "Effects of sintering temperature on the physical and mechanical properties of injection-molded Copper/Graphene composite",
abstract = "The low thermal resistance of graphene nanoplatelets (GNps), which results in high thermal conductivity, is a promising behavior for thermal management applications, such as heat sinks, in electronic devices. In this study, a Cu/GNps composite was produced by powder injection molding (PIM). A suitable sintering temperature in PIM process is essential to be obtained with the intention of achieving the optimum physical and mechanical properties of the Cu/GNps composite. Therefore, the effects of the sintering temperature on the mechanical and physical properties of Cu/ GNps were investigated. The Cu/GNps composite was prepared with a binder system, and later, such a system was removed during the debinding prior to sintering. The effects of sintering temperatures of 950°C, 1000°C and 1050°C on the physical and mechanical properties of Cu/GNps were examined. It was found that the highest density and tensile strength were obtained when the Cu/GNPs was sintered at 950°C.",
keywords = "Copper, GNps, Graphene, Powder Injection Moulding, Sinterin",
author = "Kadiman, {N. N.} and Rashid, {M. O.A.} and Norhamidi Muhamad and Sulong, {Abu Bakar}",
year = "2018",
month = "1",
day = "1",
language = "English",
volume = "12",
pages = "49--60",
journal = "Journal of Advanced Manufacturing Technology",
issn = "1985-3157",
publisher = "Penerbit Universiti Teknikal Malaysia Melaka",
number = "1",

}

TY - JOUR

T1 - Effects of sintering temperature on the physical and mechanical properties of injection-molded Copper/Graphene composite

AU - Kadiman, N. N.

AU - Rashid, M. O.A.

AU - Muhamad, Norhamidi

AU - Sulong, Abu Bakar

PY - 2018/1/1

Y1 - 2018/1/1

N2 - The low thermal resistance of graphene nanoplatelets (GNps), which results in high thermal conductivity, is a promising behavior for thermal management applications, such as heat sinks, in electronic devices. In this study, a Cu/GNps composite was produced by powder injection molding (PIM). A suitable sintering temperature in PIM process is essential to be obtained with the intention of achieving the optimum physical and mechanical properties of the Cu/GNps composite. Therefore, the effects of the sintering temperature on the mechanical and physical properties of Cu/ GNps were investigated. The Cu/GNps composite was prepared with a binder system, and later, such a system was removed during the debinding prior to sintering. The effects of sintering temperatures of 950°C, 1000°C and 1050°C on the physical and mechanical properties of Cu/GNps were examined. It was found that the highest density and tensile strength were obtained when the Cu/GNPs was sintered at 950°C.

AB - The low thermal resistance of graphene nanoplatelets (GNps), which results in high thermal conductivity, is a promising behavior for thermal management applications, such as heat sinks, in electronic devices. In this study, a Cu/GNps composite was produced by powder injection molding (PIM). A suitable sintering temperature in PIM process is essential to be obtained with the intention of achieving the optimum physical and mechanical properties of the Cu/GNps composite. Therefore, the effects of the sintering temperature on the mechanical and physical properties of Cu/ GNps were investigated. The Cu/GNps composite was prepared with a binder system, and later, such a system was removed during the debinding prior to sintering. The effects of sintering temperatures of 950°C, 1000°C and 1050°C on the physical and mechanical properties of Cu/GNps were examined. It was found that the highest density and tensile strength were obtained when the Cu/GNPs was sintered at 950°C.

KW - Copper

KW - GNps

KW - Graphene

KW - Powder Injection Moulding

KW - Sinterin

UR - http://www.scopus.com/inward/record.url?scp=85054606335&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85054606335&partnerID=8YFLogxK

M3 - Article

AN - SCOPUS:85054606335

VL - 12

SP - 49

EP - 60

JO - Journal of Advanced Manufacturing Technology

JF - Journal of Advanced Manufacturing Technology

SN - 1985-3157

IS - 1

ER -