Effects of PCB thickness on adjustable fountain wave soldering

M. S Abdul Aziz, M. Z. Abdullah, C. Y. Khor, Azman Jalar @ Jalil, M. A. Bakar, W. Y W Yusoff, F. Che Ani, Nobe Yan, M. Zhou, C. Cheok

Research output: Contribution to journalArticle

Abstract

This study investigates the effects of printed circuit board (PCB) thickness on adjustable fountain and conventional wave soldering. The pin-through-hole (PTH) vertical fill is examined with three PCBs of different thicknesses (i.e., 1.6, 3.1, and 6.0 mm) soldered through adjustable fountain and conventional wave soldering at conveyor angles of 0 and 6. The vertical fill of each PCB is the focus. The PTH solder profile is inspected with a non-destructive X-ray computed tomography scanning machine. The percentages of the PTH vertical fill of both soldering processes are also estimated and compared. The aspect ratio of the PCB is also investigated. Experimental results reveal that adjustable fountain wave soldering yields better vertical fill than conventional wave soldering. The vertical fill level of adjustable fountain wave soldering is 100%, 90%, and 50% for the 1.6, 3.1, and 6.0 mm PCB thickness, respectively. FLUENT simulation is conducted for the vertical fill of the solder profile. Simulation and experimental results show that the PTH solder profiles of the two soldering processes are almost identical. The effect of PCB thickness on PTH voiding is also discussed.

Original languageEnglish
Pages (from-to)2197-2220
Number of pages24
JournalSadhana - Academy Proceedings in Engineering Sciences
Volume40
Issue number7
DOIs
Publication statusPublished - 1 Oct 2015

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fill
tomography
simulation
fountain
effect
PCB

Keywords

  • adjustable fountain wave soldering
  • Pin through hole (PTH)
  • printed circuit board (PCB); vertical fill; simulation
  • wave soldering

ASJC Scopus subject areas

  • General

Cite this

Aziz, M. S. A., Abdullah, M. Z., Khor, C. Y., Jalar @ Jalil, A., Bakar, M. A., Yusoff, W. Y. W., ... Cheok, C. (2015). Effects of PCB thickness on adjustable fountain wave soldering. Sadhana - Academy Proceedings in Engineering Sciences, 40(7), 2197-2220. https://doi.org/10.1007/s12046-015-0409-z

Effects of PCB thickness on adjustable fountain wave soldering. / Aziz, M. S Abdul; Abdullah, M. Z.; Khor, C. Y.; Jalar @ Jalil, Azman; Bakar, M. A.; Yusoff, W. Y W; Ani, F. Che; Yan, Nobe; Zhou, M.; Cheok, C.

In: Sadhana - Academy Proceedings in Engineering Sciences, Vol. 40, No. 7, 01.10.2015, p. 2197-2220.

Research output: Contribution to journalArticle

Aziz, MSA, Abdullah, MZ, Khor, CY, Jalar @ Jalil, A, Bakar, MA, Yusoff, WYW, Ani, FC, Yan, N, Zhou, M & Cheok, C 2015, 'Effects of PCB thickness on adjustable fountain wave soldering', Sadhana - Academy Proceedings in Engineering Sciences, vol. 40, no. 7, pp. 2197-2220. https://doi.org/10.1007/s12046-015-0409-z
Aziz, M. S Abdul ; Abdullah, M. Z. ; Khor, C. Y. ; Jalar @ Jalil, Azman ; Bakar, M. A. ; Yusoff, W. Y W ; Ani, F. Che ; Yan, Nobe ; Zhou, M. ; Cheok, C. / Effects of PCB thickness on adjustable fountain wave soldering. In: Sadhana - Academy Proceedings in Engineering Sciences. 2015 ; Vol. 40, No. 7. pp. 2197-2220.
@article{74ae21533dfe4280984e56de604f49db,
title = "Effects of PCB thickness on adjustable fountain wave soldering",
abstract = "This study investigates the effects of printed circuit board (PCB) thickness on adjustable fountain and conventional wave soldering. The pin-through-hole (PTH) vertical fill is examined with three PCBs of different thicknesses (i.e., 1.6, 3.1, and 6.0 mm) soldered through adjustable fountain and conventional wave soldering at conveyor angles of 0∘ and 6∘. The vertical fill of each PCB is the focus. The PTH solder profile is inspected with a non-destructive X-ray computed tomography scanning machine. The percentages of the PTH vertical fill of both soldering processes are also estimated and compared. The aspect ratio of the PCB is also investigated. Experimental results reveal that adjustable fountain wave soldering yields better vertical fill than conventional wave soldering. The vertical fill level of adjustable fountain wave soldering is 100{\%}, 90{\%}, and 50{\%} for the 1.6, 3.1, and 6.0 mm PCB thickness, respectively. FLUENT simulation is conducted for the vertical fill of the solder profile. Simulation and experimental results show that the PTH solder profiles of the two soldering processes are almost identical. The effect of PCB thickness on PTH voiding is also discussed.",
keywords = "adjustable fountain wave soldering, Pin through hole (PTH), printed circuit board (PCB); vertical fill; simulation, wave soldering",
author = "Aziz, {M. S Abdul} and Abdullah, {M. Z.} and Khor, {C. Y.} and {Jalar @ Jalil}, Azman and Bakar, {M. A.} and Yusoff, {W. Y W} and Ani, {F. Che} and Nobe Yan and M. Zhou and C. Cheok",
year = "2015",
month = "10",
day = "1",
doi = "10.1007/s12046-015-0409-z",
language = "English",
volume = "40",
pages = "2197--2220",
journal = "Sadhana - Academy Proceedings in Engineering Sciences",
issn = "0256-2499",
publisher = "Springer India",
number = "7",

}

TY - JOUR

T1 - Effects of PCB thickness on adjustable fountain wave soldering

AU - Aziz, M. S Abdul

AU - Abdullah, M. Z.

AU - Khor, C. Y.

AU - Jalar @ Jalil, Azman

AU - Bakar, M. A.

AU - Yusoff, W. Y W

AU - Ani, F. Che

AU - Yan, Nobe

AU - Zhou, M.

AU - Cheok, C.

PY - 2015/10/1

Y1 - 2015/10/1

N2 - This study investigates the effects of printed circuit board (PCB) thickness on adjustable fountain and conventional wave soldering. The pin-through-hole (PTH) vertical fill is examined with three PCBs of different thicknesses (i.e., 1.6, 3.1, and 6.0 mm) soldered through adjustable fountain and conventional wave soldering at conveyor angles of 0∘ and 6∘. The vertical fill of each PCB is the focus. The PTH solder profile is inspected with a non-destructive X-ray computed tomography scanning machine. The percentages of the PTH vertical fill of both soldering processes are also estimated and compared. The aspect ratio of the PCB is also investigated. Experimental results reveal that adjustable fountain wave soldering yields better vertical fill than conventional wave soldering. The vertical fill level of adjustable fountain wave soldering is 100%, 90%, and 50% for the 1.6, 3.1, and 6.0 mm PCB thickness, respectively. FLUENT simulation is conducted for the vertical fill of the solder profile. Simulation and experimental results show that the PTH solder profiles of the two soldering processes are almost identical. The effect of PCB thickness on PTH voiding is also discussed.

AB - This study investigates the effects of printed circuit board (PCB) thickness on adjustable fountain and conventional wave soldering. The pin-through-hole (PTH) vertical fill is examined with three PCBs of different thicknesses (i.e., 1.6, 3.1, and 6.0 mm) soldered through adjustable fountain and conventional wave soldering at conveyor angles of 0∘ and 6∘. The vertical fill of each PCB is the focus. The PTH solder profile is inspected with a non-destructive X-ray computed tomography scanning machine. The percentages of the PTH vertical fill of both soldering processes are also estimated and compared. The aspect ratio of the PCB is also investigated. Experimental results reveal that adjustable fountain wave soldering yields better vertical fill than conventional wave soldering. The vertical fill level of adjustable fountain wave soldering is 100%, 90%, and 50% for the 1.6, 3.1, and 6.0 mm PCB thickness, respectively. FLUENT simulation is conducted for the vertical fill of the solder profile. Simulation and experimental results show that the PTH solder profiles of the two soldering processes are almost identical. The effect of PCB thickness on PTH voiding is also discussed.

KW - adjustable fountain wave soldering

KW - Pin through hole (PTH)

KW - printed circuit board (PCB); vertical fill; simulation

KW - wave soldering

UR - http://www.scopus.com/inward/record.url?scp=84952975287&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84952975287&partnerID=8YFLogxK

U2 - 10.1007/s12046-015-0409-z

DO - 10.1007/s12046-015-0409-z

M3 - Article

VL - 40

SP - 2197

EP - 2220

JO - Sadhana - Academy Proceedings in Engineering Sciences

JF - Sadhana - Academy Proceedings in Engineering Sciences

SN - 0256-2499

IS - 7

ER -