Effects of molding parameters and addition of fillers on gate chip off formation during the degating process in transfer molding

Abu Bakar Sulong, Gan Tek Keong, Jaafar Sahari

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In the electronics packaging industry, Epoxy Mold Compound (EMC) polymer matrix is filled with fused silica (SiO2) to obtain the required roughness and hardness. Gate chip off, which occurs during the degating process in transfer molding is one of the common defects which contributes to the failure in the proper functioning of the package. During the degating process, surface contact between two solid bodies (degating blade and gate) generate a high shear stress on package, thus creating a high potential for the incidence of gate chip of. In this study, the influence of transfer molding parameters and size of fillers (normal and fine) on the gate chip off were investigated. The application of Design of Experiments (DOE) using regression model and Analysis of Variance (ANOVA) showed that molding parameters do not significantly influence the incidence of gate chip off. Numerical simulation was used to investigate effect of two filler sizes and molding parameters on the mold fill time, end pressure of fill and shear stress at the wall. The results showed there were no significant influences on mold fill time but the fine filler showed lower pressure at the end of fill and lower shear stress at the wall. Experimental results of two sizes if filler shown that fine filler mold compound exhibited in reduction of gate chip off formation, compared to normal filler mold compound. Smooth surface of fine mold compound lead to decrease of friction shear stress during degating is expected contribute to this finding.

Original languageEnglish
Title of host publicationKey Engineering Materials
Pages790-794
Number of pages5
Volume447 448
DOIs
Publication statusPublished - 2010
EventICoPE2010 and 13th ICPE International Conference on Precision Engineering -
Duration: 28 Jul 201030 Jul 2010

Publication series

NameKey Engineering Materials
Volume447 448
ISSN (Print)10139826

Other

OtherICoPE2010 and 13th ICPE International Conference on Precision Engineering
Period28/7/1030/7/10

Fingerprint

Transfer molding
Molding
Fillers
Shear stress
Lead compounds
Electronics packaging
Epoxy Compounds
Fused silica
Analysis of variance (ANOVA)
Polymer matrix
Design of experiments
Surface roughness
Hardness
Friction
Defects
Computer simulation

Keywords

  • Degating process
  • Polymer matrix composites
  • Rapid transfer molding

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Sulong, A. B., Keong, G. T., & Sahari, J. (2010). Effects of molding parameters and addition of fillers on gate chip off formation during the degating process in transfer molding. In Key Engineering Materials (Vol. 447 448, pp. 790-794). (Key Engineering Materials; Vol. 447 448). https://doi.org/10.4028/www.scientific.net/KEM.447-448.790

Effects of molding parameters and addition of fillers on gate chip off formation during the degating process in transfer molding. / Sulong, Abu Bakar; Keong, Gan Tek; Sahari, Jaafar.

Key Engineering Materials. Vol. 447 448 2010. p. 790-794 (Key Engineering Materials; Vol. 447 448).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Sulong, AB, Keong, GT & Sahari, J 2010, Effects of molding parameters and addition of fillers on gate chip off formation during the degating process in transfer molding. in Key Engineering Materials. vol. 447 448, Key Engineering Materials, vol. 447 448, pp. 790-794, ICoPE2010 and 13th ICPE International Conference on Precision Engineering, 28/7/10. https://doi.org/10.4028/www.scientific.net/KEM.447-448.790
Sulong, Abu Bakar ; Keong, Gan Tek ; Sahari, Jaafar. / Effects of molding parameters and addition of fillers on gate chip off formation during the degating process in transfer molding. Key Engineering Materials. Vol. 447 448 2010. pp. 790-794 (Key Engineering Materials).
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