Effects of different die and epoxy thickness to the QFN package

Huda Abdullah, Muhd Fauzi Aminuddin Shazi Shaarani

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Quad Flat No-Lead or QFN is able to provide lighter, thinner and higher performance packaging requirement with its exposed pad and leads at the package bottom for better heat dissipation. However, QFN packages possess certain weaknesses. QFN package failures are related to crack and delaminating, such as die cracking, moulding compound and solder mask interfacial delaminating. From previous projects, the epoxy thickness and die thickness plays an important role in reducing failures in QFN package. The objective of this project is to observe the effects of die and epoxy thickness. The effects on QFN are measured in the die and lead frame part. Stress towards the die is also measured: including thermal, first principle and Von Misses stress. The structural optimization is based on the Finite Element Analysis (FEA). By using ANSYS 10.0, six models were constructed, where three models were built to analyse in thickness of epoxy, and another three to study the effects on die thickness. The effect was measured by the value stress (first principle stress and Von Misses stress) and thermal strain effect, which will lead to a result of how the dimensions of the packaging will give a better tolerance towards stress.

Original languageEnglish
Title of host publicationKey Engineering Materials
Pages943-948
Number of pages6
Volume462-463
DOIs
Publication statusPublished - 2011
Event8th International Conference on Fracture and Strength of Solids 2010, FEOFS2010 - Kuala Lumpur
Duration: 7 Jun 20109 Jun 2010

Publication series

NameKey Engineering Materials
Volume462-463
ISSN (Print)10139826

Other

Other8th International Conference on Fracture and Strength of Solids 2010, FEOFS2010
CityKuala Lumpur
Period7/6/109/6/10

Fingerprint

Packaging
Lead
Sheet molding compounds
Structural optimization
Heat losses
Soldering alloys
Masks
Cracks
Finite element method
Hot Temperature
Elvitegravir, Cobicistat, Emtricitabine, Tenofovir Disoproxil Fumarate Drug Combination

Keywords

  • ANSYS
  • FEA
  • Modulus of elasticity
  • QFN

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Abdullah, H., & Shaarani, M. F. A. S. (2011). Effects of different die and epoxy thickness to the QFN package. In Key Engineering Materials (Vol. 462-463, pp. 943-948). (Key Engineering Materials; Vol. 462-463). https://doi.org/10.4028/www.scientific.net/KEM.462-463.943

Effects of different die and epoxy thickness to the QFN package. / Abdullah, Huda; Shaarani, Muhd Fauzi Aminuddin Shazi.

Key Engineering Materials. Vol. 462-463 2011. p. 943-948 (Key Engineering Materials; Vol. 462-463).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abdullah, H & Shaarani, MFAS 2011, Effects of different die and epoxy thickness to the QFN package. in Key Engineering Materials. vol. 462-463, Key Engineering Materials, vol. 462-463, pp. 943-948, 8th International Conference on Fracture and Strength of Solids 2010, FEOFS2010, Kuala Lumpur, 7/6/10. https://doi.org/10.4028/www.scientific.net/KEM.462-463.943
Abdullah H, Shaarani MFAS. Effects of different die and epoxy thickness to the QFN package. In Key Engineering Materials. Vol. 462-463. 2011. p. 943-948. (Key Engineering Materials). https://doi.org/10.4028/www.scientific.net/KEM.462-463.943
Abdullah, Huda ; Shaarani, Muhd Fauzi Aminuddin Shazi. / Effects of different die and epoxy thickness to the QFN package. Key Engineering Materials. Vol. 462-463 2011. pp. 943-948 (Key Engineering Materials).
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