Kesan teknik pengaktifan bermangkin berbeza terhadap prestasi terma penyebar haba cip balikan

Translated title of the contribution: Effects of different catalytic activation techniques on the thermal performance of flip chip heat spreader

Victor Lim, Nowshad Amin, C. S. Foong, Ibrahim Ahmad, Azami Zaharim, Rozaidi Rasid, Azman Jalar @ Jalil

Research output: Contribution to journalArticle

Abstract

This paper presents the effects of two different catalytic activation techniques on the thermal performance of flip chip heat spreaders. Electroless nickel plating is used as a plating technique as it can form a uniform thickness of nickel layer onto the copper substrate. Catalytic activation process needs to be done first to deposit some nickel atom onto copper substrate, so that the deposited nickel is able to catalyze the following reduction process. The two activation techniques investigated are galvanic initiation and thin nickel-copper strike. High temperature storage tests were ran to investigate the extent of intermetallic diffusion between the nickel and copper layers. Thermal diffusivity of these heat spreaders was studied using the Nano-flash apparatus. The results obtained showed that heat spreaders processed with thin nickel copper strike have lower thermal diffusivities (35-65 mm2 s -1) compared to those heat spreaders processed with galvanic-initiation (60-85 mm2 s-1). It is also discovered that the nickel-copper intermetallic layers of these heat spreaders grew thicker from 0.2 μm at initial time until 0.55 μm after high temperature storage of 168 hours. Nickelcopper intermetallic layers have lower thermal conductivity compared to pure copper, this further degrading the thermal diffusivity of these heat spreaders. As a conclusion, the galvanic initiation technique provides better thermal performance for heat spreaders used in semiconductor package.

Original languageUndefined/Unknown
Pages (from-to)181-190
Number of pages10
JournalSains Malaysiana
Volume40
Issue number2
Publication statusPublished - Feb 2011

Fingerprint

Spreaders
Chemical activation
Copper
Nickel
Thermal diffusivity
Intermetallics
Nickel deposits
Nickel plating
Hot Temperature
Electroless plating
Substrates
Plating
Thermal conductivity
Semiconductor materials
Atoms
Temperature

Keywords

  • Electroless nickel plating
  • Galvanic initiation
  • Heat spreader
  • Thin nickel-copper strike

ASJC Scopus subject areas

  • General

Cite this

Kesan teknik pengaktifan bermangkin berbeza terhadap prestasi terma penyebar haba cip balikan. / Lim, Victor; Amin, Nowshad; Foong, C. S.; Ahmad, Ibrahim; Zaharim, Azami; Rasid, Rozaidi; Jalar @ Jalil, Azman.

In: Sains Malaysiana, Vol. 40, No. 2, 02.2011, p. 181-190.

Research output: Contribution to journalArticle

@article{c896d583c2344853b16005ebbc456d1a,
title = "Kesan teknik pengaktifan bermangkin berbeza terhadap prestasi terma penyebar haba cip balikan",
abstract = "This paper presents the effects of two different catalytic activation techniques on the thermal performance of flip chip heat spreaders. Electroless nickel plating is used as a plating technique as it can form a uniform thickness of nickel layer onto the copper substrate. Catalytic activation process needs to be done first to deposit some nickel atom onto copper substrate, so that the deposited nickel is able to catalyze the following reduction process. The two activation techniques investigated are galvanic initiation and thin nickel-copper strike. High temperature storage tests were ran to investigate the extent of intermetallic diffusion between the nickel and copper layers. Thermal diffusivity of these heat spreaders was studied using the Nano-flash apparatus. The results obtained showed that heat spreaders processed with thin nickel copper strike have lower thermal diffusivities (35-65 mm2 s -1) compared to those heat spreaders processed with galvanic-initiation (60-85 mm2 s-1). It is also discovered that the nickel-copper intermetallic layers of these heat spreaders grew thicker from 0.2 μm at initial time until 0.55 μm after high temperature storage of 168 hours. Nickelcopper intermetallic layers have lower thermal conductivity compared to pure copper, this further degrading the thermal diffusivity of these heat spreaders. As a conclusion, the galvanic initiation technique provides better thermal performance for heat spreaders used in semiconductor package.",
keywords = "Electroless nickel plating, Galvanic initiation, Heat spreader, Thin nickel-copper strike",
author = "Victor Lim and Nowshad Amin and Foong, {C. S.} and Ibrahim Ahmad and Azami Zaharim and Rozaidi Rasid and {Jalar @ Jalil}, Azman",
year = "2011",
month = "2",
language = "Undefined/Unknown",
volume = "40",
pages = "181--190",
journal = "Sains Malaysiana",
issn = "0126-6039",
publisher = "Penerbit Universiti Kebangsaan Malaysia",
number = "2",

}

TY - JOUR

T1 - Kesan teknik pengaktifan bermangkin berbeza terhadap prestasi terma penyebar haba cip balikan

AU - Lim, Victor

AU - Amin, Nowshad

AU - Foong, C. S.

AU - Ahmad, Ibrahim

AU - Zaharim, Azami

AU - Rasid, Rozaidi

AU - Jalar @ Jalil, Azman

PY - 2011/2

Y1 - 2011/2

N2 - This paper presents the effects of two different catalytic activation techniques on the thermal performance of flip chip heat spreaders. Electroless nickel plating is used as a plating technique as it can form a uniform thickness of nickel layer onto the copper substrate. Catalytic activation process needs to be done first to deposit some nickel atom onto copper substrate, so that the deposited nickel is able to catalyze the following reduction process. The two activation techniques investigated are galvanic initiation and thin nickel-copper strike. High temperature storage tests were ran to investigate the extent of intermetallic diffusion between the nickel and copper layers. Thermal diffusivity of these heat spreaders was studied using the Nano-flash apparatus. The results obtained showed that heat spreaders processed with thin nickel copper strike have lower thermal diffusivities (35-65 mm2 s -1) compared to those heat spreaders processed with galvanic-initiation (60-85 mm2 s-1). It is also discovered that the nickel-copper intermetallic layers of these heat spreaders grew thicker from 0.2 μm at initial time until 0.55 μm after high temperature storage of 168 hours. Nickelcopper intermetallic layers have lower thermal conductivity compared to pure copper, this further degrading the thermal diffusivity of these heat spreaders. As a conclusion, the galvanic initiation technique provides better thermal performance for heat spreaders used in semiconductor package.

AB - This paper presents the effects of two different catalytic activation techniques on the thermal performance of flip chip heat spreaders. Electroless nickel plating is used as a plating technique as it can form a uniform thickness of nickel layer onto the copper substrate. Catalytic activation process needs to be done first to deposit some nickel atom onto copper substrate, so that the deposited nickel is able to catalyze the following reduction process. The two activation techniques investigated are galvanic initiation and thin nickel-copper strike. High temperature storage tests were ran to investigate the extent of intermetallic diffusion between the nickel and copper layers. Thermal diffusivity of these heat spreaders was studied using the Nano-flash apparatus. The results obtained showed that heat spreaders processed with thin nickel copper strike have lower thermal diffusivities (35-65 mm2 s -1) compared to those heat spreaders processed with galvanic-initiation (60-85 mm2 s-1). It is also discovered that the nickel-copper intermetallic layers of these heat spreaders grew thicker from 0.2 μm at initial time until 0.55 μm after high temperature storage of 168 hours. Nickelcopper intermetallic layers have lower thermal conductivity compared to pure copper, this further degrading the thermal diffusivity of these heat spreaders. As a conclusion, the galvanic initiation technique provides better thermal performance for heat spreaders used in semiconductor package.

KW - Electroless nickel plating

KW - Galvanic initiation

KW - Heat spreader

KW - Thin nickel-copper strike

UR - http://www.scopus.com/inward/record.url?scp=79952682360&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=79952682360&partnerID=8YFLogxK

M3 - Article

VL - 40

SP - 181

EP - 190

JO - Sains Malaysiana

JF - Sains Malaysiana

SN - 0126-6039

IS - 2

ER -