Effect of wire diameter and hook location on second bond failure modes

Fuaida Harun, Roslina Ismail, Azman Jalar @ Jalil, Shahrum Abdullah

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

Purpose - This paper aims to analyze the effect of Au wire size and location of hook during wire pulling test to identify the variation of results obtained.

Design/methodology/approach - Two hook locations, namely, location A and location B were used to analyze the effect of hook location. Location A was the same as the hook location required by MIL-STD-883E standard, whereas location B was located near to the second bond. The correlation between new purposed failure modes and MIL-STD-883E standard was developed to reflect on the pull strength with the physical failure.

Findings - It was observed that fine pitch Au wire has higher variation and lower process capability of pull strength. Au wire pulled by the hook at location B provides a more representative result compared to that at location A. Fifty per cent or more of Au remnant is required to be considered as a good and reliable Au wedge bond based on the new purposed failure modes.

Originality/value - The evaluation of gold (Au) wedge bond requires a new proper wire pulling test method. This is due to the large variation obtained from the application of current practice of wire pulling test.

Original languageEnglish
Pages (from-to)32-36
Number of pages5
JournalMicroelectronics International
Volume32
Issue number1
DOIs
Publication statusPublished - 5 Jan 2015

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hooks
Hooks
failure modes
Failure modes
wire
Wire
pulling
wedges
Gold
methodology
gold

Keywords

  • Microelectronics packaging
  • Second bond
  • Wire bonding
  • Wire pulling test

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics

Cite this

Effect of wire diameter and hook location on second bond failure modes. / Harun, Fuaida; Ismail, Roslina; Jalar @ Jalil, Azman; Abdullah, Shahrum.

In: Microelectronics International, Vol. 32, No. 1, 05.01.2015, p. 32-36.

Research output: Contribution to journalArticle

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N2 - Purpose - This paper aims to analyze the effect of Au wire size and location of hook during wire pulling test to identify the variation of results obtained.Design/methodology/approach - Two hook locations, namely, location A and location B were used to analyze the effect of hook location. Location A was the same as the hook location required by MIL-STD-883E standard, whereas location B was located near to the second bond. The correlation between new purposed failure modes and MIL-STD-883E standard was developed to reflect on the pull strength with the physical failure.Findings - It was observed that fine pitch Au wire has higher variation and lower process capability of pull strength. Au wire pulled by the hook at location B provides a more representative result compared to that at location A. Fifty per cent or more of Au remnant is required to be considered as a good and reliable Au wedge bond based on the new purposed failure modes.Originality/value - The evaluation of gold (Au) wedge bond requires a new proper wire pulling test method. This is due to the large variation obtained from the application of current practice of wire pulling test.

AB - Purpose - This paper aims to analyze the effect of Au wire size and location of hook during wire pulling test to identify the variation of results obtained.Design/methodology/approach - Two hook locations, namely, location A and location B were used to analyze the effect of hook location. Location A was the same as the hook location required by MIL-STD-883E standard, whereas location B was located near to the second bond. The correlation between new purposed failure modes and MIL-STD-883E standard was developed to reflect on the pull strength with the physical failure.Findings - It was observed that fine pitch Au wire has higher variation and lower process capability of pull strength. Au wire pulled by the hook at location B provides a more representative result compared to that at location A. Fifty per cent or more of Au remnant is required to be considered as a good and reliable Au wedge bond based on the new purposed failure modes.Originality/value - The evaluation of gold (Au) wedge bond requires a new proper wire pulling test method. This is due to the large variation obtained from the application of current practice of wire pulling test.

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