Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA)

Zainudin Kornain, Nowshad Amin, Azman Jalar @ Jalil, Ang Ye Cheah, Ibrahim Ahmad

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Electrically conductive adhesive (ECA) is a popular alternative to replace lead solder interconnect material in most areas of electronic packaging. ECA mainly consists of an organic/polymeric binder matrix and metal filler. These composite materials provide both physical adhesion and electrical conductivity. Compared to the solder technology, ECA offers numerous advantages, such as environmental friendliness, lower processing temperature, fewer processing steps (reducing processing cost), and especially, the fine pitch capability attributed to the availability of small sized conductive fillers. Here, 70-nm sized silver particle filler (Ag) has been used to study the effect to electrical conductivity of ECA after surface treatment. Upon surface treatment of silver with silane-based coupling agent, the treated silver filled epoxy system demonstrated incredible improvement in electrical properties. The current conductivity (DC) for treated filler was 4.01 S/cm compared with untreated filler with 4.54E-03 S/cm for 5%w filler loading. Morphological studies using light microscopy micrographs have shown perceptible enhancement in filler dispersivity after treatment.

Original languageEnglish
Title of host publicationIEEE International Conference on Semiconductor Electronics, Proceedings, ICSE
Pages549-553
Number of pages5
DOIs
Publication statusPublished - 2008
Event2008 IEEE International Conference on Semiconductor Electronics, ICSE 2008 - Johor Bahru, Johor
Duration: 25 Nov 200827 Nov 2008

Other

Other2008 IEEE International Conference on Semiconductor Electronics, ICSE 2008
CityJohor Bahru, Johor
Period25/11/0827/11/08

Fingerprint

Silver
Fillers
Adhesives
Nanoparticles
Soldering alloys
Surface treatment
Processing
Silanes
Filler metals
Electronics packaging
Coupling agents
Optical microscopy
Binders
Electric Conductivity
Electric properties
Adhesion
Lead
Availability
Composite materials
Costs

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Kornain, Z., Amin, N., Jalar @ Jalil, A., Cheah, A. Y., & Ahmad, I. (2008). Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA). In IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE (pp. 549-553). [4770385] https://doi.org/10.1109/SMELEC.2008.4770385

Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA). / Kornain, Zainudin; Amin, Nowshad; Jalar @ Jalil, Azman; Cheah, Ang Ye; Ahmad, Ibrahim.

IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE. 2008. p. 549-553 4770385.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kornain, Z, Amin, N, Jalar @ Jalil, A, Cheah, AY & Ahmad, I 2008, Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA). in IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE., 4770385, pp. 549-553, 2008 IEEE International Conference on Semiconductor Electronics, ICSE 2008, Johor Bahru, Johor, 25/11/08. https://doi.org/10.1109/SMELEC.2008.4770385
Kornain Z, Amin N, Jalar @ Jalil A, Cheah AY, Ahmad I. Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA). In IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE. 2008. p. 549-553. 4770385 https://doi.org/10.1109/SMELEC.2008.4770385
Kornain, Zainudin ; Amin, Nowshad ; Jalar @ Jalil, Azman ; Cheah, Ang Ye ; Ahmad, Ibrahim. / Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA). IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE. 2008. pp. 549-553
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