Effect of sintering atmosphere on the shear properties of pressureless sintered silver joint

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

Sintered silver is a possible replacement for high performance and Pb free die attach materials in power modules and traditional microelectronic packages because of its high melting temperature, high thermal conductivity and good thermo-mechanical properties. However, reliable sintered silver joints can only be easily formed on Ag or Au plated surfaces during pressure sintering. Here we present the initial results of two pressure-less Ag pastes (i.e. micron-sized flakes and nanoparticles) that can sinter on copper (Cu). These sintered Ag joints exceeded the minimum die shear strength as per MIL-STD883E; nano-Ag preferred the N2-5%H2 environment to produce die shear strength of 17 MPa on the H2 cleaned Cu while micron-Ag joint produced die shear strength of 14 MPa on the Cu substrate when sintered in ambient air. Fractography of sintered nano-Ag joints showed that the silver particles have necked to different degrees in N2 and N2-5%H2. Heavy oxidation caused by ambient air sintering prevented bonding of nano-Ag on the Cu oxide, resulting in a flat fratography. Similar flat fractograph was also visible for micron-Ag sintered in N2 atmosphere because of residual binders prevented the sintering on the Cu substrate. In the presence of ambient air, the oxidative combustion of the binders and capping agents de-oxidized the Cu substrate to allow sintering onto the Cu. Cross section of this micron-Ag joint on Cu substrate confirmed the joint formation in ambient air during pressureless sintering. These results showed that different binders and capping agents influence the sintering properties differently to produce reliable sintered Ag joints.

Original languageEnglish
Title of host publicationProceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium
PublisherInstitute of Electrical and Electronics Engineers Inc.
Volume2015-June
ISBN (Print)9781479982097
DOIs
Publication statusPublished - 12 Jun 2015
Event2014 36th IEEE International Electronics Manufacturing Technology Conference, IEMT 2014 - Johor, Malaysia
Duration: 11 Nov 201413 Nov 2014

Other

Other2014 36th IEEE International Electronics Manufacturing Technology Conference, IEMT 2014
CountryMalaysia
CityJohor
Period11/11/1413/11/14

Fingerprint

Silver
Sintering
Shear strength
Binders
Substrates
Air
Fractography
Microelectronics
Melting point
Thermal conductivity
Nanoparticles
Copper
Oxidation
Mechanical properties
Oxides

Keywords

  • lead-free die attach
  • low-temperature sintering
  • nano-silver
  • sintered silver

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering

Cite this

Chua, S. T., Siow, K. S., & Jalar @ Jalil, A. (2015). Effect of sintering atmosphere on the shear properties of pressureless sintered silver joint. In Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium (Vol. 2015-June). [7123119] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IEMT.2014.7123119

Effect of sintering atmosphere on the shear properties of pressureless sintered silver joint. / Chua, S. T.; Siow, Kim Shyong; Jalar @ Jalil, Azman.

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium. Vol. 2015-June Institute of Electrical and Electronics Engineers Inc., 2015. 7123119.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Chua, ST, Siow, KS & Jalar @ Jalil, A 2015, Effect of sintering atmosphere on the shear properties of pressureless sintered silver joint. in Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium. vol. 2015-June, 7123119, Institute of Electrical and Electronics Engineers Inc., 2014 36th IEEE International Electronics Manufacturing Technology Conference, IEMT 2014, Johor, Malaysia, 11/11/14. https://doi.org/10.1109/IEMT.2014.7123119
Chua ST, Siow KS, Jalar @ Jalil A. Effect of sintering atmosphere on the shear properties of pressureless sintered silver joint. In Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium. Vol. 2015-June. Institute of Electrical and Electronics Engineers Inc. 2015. 7123119 https://doi.org/10.1109/IEMT.2014.7123119
Chua, S. T. ; Siow, Kim Shyong ; Jalar @ Jalil, Azman. / Effect of sintering atmosphere on the shear properties of pressureless sintered silver joint. Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium. Vol. 2015-June Institute of Electrical and Electronics Engineers Inc., 2015.
@inproceedings{75127986225a49f381c98b6e3b4fb5a2,
title = "Effect of sintering atmosphere on the shear properties of pressureless sintered silver joint",
abstract = "Sintered silver is a possible replacement for high performance and Pb free die attach materials in power modules and traditional microelectronic packages because of its high melting temperature, high thermal conductivity and good thermo-mechanical properties. However, reliable sintered silver joints can only be easily formed on Ag or Au plated surfaces during pressure sintering. Here we present the initial results of two pressure-less Ag pastes (i.e. micron-sized flakes and nanoparticles) that can sinter on copper (Cu). These sintered Ag joints exceeded the minimum die shear strength as per MIL-STD883E; nano-Ag preferred the N2-5{\%}H2 environment to produce die shear strength of 17 MPa on the H2 cleaned Cu while micron-Ag joint produced die shear strength of 14 MPa on the Cu substrate when sintered in ambient air. Fractography of sintered nano-Ag joints showed that the silver particles have necked to different degrees in N2 and N2-5{\%}H2. Heavy oxidation caused by ambient air sintering prevented bonding of nano-Ag on the Cu oxide, resulting in a flat fratography. Similar flat fractograph was also visible for micron-Ag sintered in N2 atmosphere because of residual binders prevented the sintering on the Cu substrate. In the presence of ambient air, the oxidative combustion of the binders and capping agents de-oxidized the Cu substrate to allow sintering onto the Cu. Cross section of this micron-Ag joint on Cu substrate confirmed the joint formation in ambient air during pressureless sintering. These results showed that different binders and capping agents influence the sintering properties differently to produce reliable sintered Ag joints.",
keywords = "lead-free die attach, low-temperature sintering, nano-silver, sintered silver",
author = "Chua, {S. T.} and Siow, {Kim Shyong} and {Jalar @ Jalil}, Azman",
year = "2015",
month = "6",
day = "12",
doi = "10.1109/IEMT.2014.7123119",
language = "English",
isbn = "9781479982097",
volume = "2015-June",
booktitle = "Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium",
publisher = "Institute of Electrical and Electronics Engineers Inc.",

}

TY - GEN

T1 - Effect of sintering atmosphere on the shear properties of pressureless sintered silver joint

AU - Chua, S. T.

AU - Siow, Kim Shyong

AU - Jalar @ Jalil, Azman

PY - 2015/6/12

Y1 - 2015/6/12

N2 - Sintered silver is a possible replacement for high performance and Pb free die attach materials in power modules and traditional microelectronic packages because of its high melting temperature, high thermal conductivity and good thermo-mechanical properties. However, reliable sintered silver joints can only be easily formed on Ag or Au plated surfaces during pressure sintering. Here we present the initial results of two pressure-less Ag pastes (i.e. micron-sized flakes and nanoparticles) that can sinter on copper (Cu). These sintered Ag joints exceeded the minimum die shear strength as per MIL-STD883E; nano-Ag preferred the N2-5%H2 environment to produce die shear strength of 17 MPa on the H2 cleaned Cu while micron-Ag joint produced die shear strength of 14 MPa on the Cu substrate when sintered in ambient air. Fractography of sintered nano-Ag joints showed that the silver particles have necked to different degrees in N2 and N2-5%H2. Heavy oxidation caused by ambient air sintering prevented bonding of nano-Ag on the Cu oxide, resulting in a flat fratography. Similar flat fractograph was also visible for micron-Ag sintered in N2 atmosphere because of residual binders prevented the sintering on the Cu substrate. In the presence of ambient air, the oxidative combustion of the binders and capping agents de-oxidized the Cu substrate to allow sintering onto the Cu. Cross section of this micron-Ag joint on Cu substrate confirmed the joint formation in ambient air during pressureless sintering. These results showed that different binders and capping agents influence the sintering properties differently to produce reliable sintered Ag joints.

AB - Sintered silver is a possible replacement for high performance and Pb free die attach materials in power modules and traditional microelectronic packages because of its high melting temperature, high thermal conductivity and good thermo-mechanical properties. However, reliable sintered silver joints can only be easily formed on Ag or Au plated surfaces during pressure sintering. Here we present the initial results of two pressure-less Ag pastes (i.e. micron-sized flakes and nanoparticles) that can sinter on copper (Cu). These sintered Ag joints exceeded the minimum die shear strength as per MIL-STD883E; nano-Ag preferred the N2-5%H2 environment to produce die shear strength of 17 MPa on the H2 cleaned Cu while micron-Ag joint produced die shear strength of 14 MPa on the Cu substrate when sintered in ambient air. Fractography of sintered nano-Ag joints showed that the silver particles have necked to different degrees in N2 and N2-5%H2. Heavy oxidation caused by ambient air sintering prevented bonding of nano-Ag on the Cu oxide, resulting in a flat fratography. Similar flat fractograph was also visible for micron-Ag sintered in N2 atmosphere because of residual binders prevented the sintering on the Cu substrate. In the presence of ambient air, the oxidative combustion of the binders and capping agents de-oxidized the Cu substrate to allow sintering onto the Cu. Cross section of this micron-Ag joint on Cu substrate confirmed the joint formation in ambient air during pressureless sintering. These results showed that different binders and capping agents influence the sintering properties differently to produce reliable sintered Ag joints.

KW - lead-free die attach

KW - low-temperature sintering

KW - nano-silver

KW - sintered silver

UR - http://www.scopus.com/inward/record.url?scp=84944339093&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84944339093&partnerID=8YFLogxK

U2 - 10.1109/IEMT.2014.7123119

DO - 10.1109/IEMT.2014.7123119

M3 - Conference contribution

SN - 9781479982097

VL - 2015-June

BT - Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

PB - Institute of Electrical and Electronics Engineers Inc.

ER -