Kesan gelombang kejutan terhadap sifat mikromekanik sambungan pateri SAC 0307/ENiG menggunakan pendekatan pelekukan nano

Translated title of the contribution: Effect of shock wave on micromechanical properties of SAC 0307/ENiG Solder joint using nanoindentation approach

Maria Abu Bakar, Azman Jalar @ Jalil, Wan Yusmawati Wan Yusoff, Nur Shafiqa Safee, Ariffin Ismail, Norliza Ismail, Emee Marina Salleh, Najib Saedi Ibrahim

Research output: Contribution to journalArticle

Abstract

Reliability and durability of electronic packaging for electronic equipment in military application is beyond commercial applicability. The reliability of a solder joint is a key point in assessing the performance of electronic packaging. Commercial or conventional reliability testing such as JEDEC (Solid State Technology Association) standard is unable to fulfill the electronic packaging requirement for military standards. This study reported the response of SAC 0307 solder joint on printed circuit board (PCB) with ENiG surface finish (electroless nickel immersion gold) towards shock waves resulting from an open-field blast test. Micromechanical properties changes were investigated using nanoindentation approach. The solder joints were exposed to shock wave test using different doses of Emulex, 700 g and 1500 g, respectively. The solder joint’s hardness has decreased 29% from 141 MPa to 100 MPa after subjected to shock wave using 1500 g Emulex. The shock wave has led to the changes in micromechanical properties of the solder joints in terms of softening behaviour i.e. the decreasing of hardness and reduced modulus values. However, no cracks were observed between solder-substrate indicate that the solder joint is not fail and remains strong after subjected to high shock wave, despite the significant reduction in micromechanical properties.

Original languageMalay
Pages (from-to)1273-1279
Number of pages7
JournalSains Malaysiana
Volume48
Issue number6
DOIs
Publication statusPublished - 1 Jan 2019

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Nanoindentation
Shock waves
Soldering alloys
Electronics packaging
Hardness
Military applications
Printed circuit boards
Durability
Electronic equipment
Gold
Nickel
Cracks
Testing
Substrates

ASJC Scopus subject areas

  • General

Cite this

Kesan gelombang kejutan terhadap sifat mikromekanik sambungan pateri SAC 0307/ENiG menggunakan pendekatan pelekukan nano. / Bakar, Maria Abu; Jalar @ Jalil, Azman; Wan Yusoff, Wan Yusmawati; Safee, Nur Shafiqa; Ismail, Ariffin; Ismail, Norliza; Salleh, Emee Marina; Ibrahim, Najib Saedi.

In: Sains Malaysiana, Vol. 48, No. 6, 01.01.2019, p. 1273-1279.

Research output: Contribution to journalArticle

Bakar, Maria Abu ; Jalar @ Jalil, Azman ; Wan Yusoff, Wan Yusmawati ; Safee, Nur Shafiqa ; Ismail, Ariffin ; Ismail, Norliza ; Salleh, Emee Marina ; Ibrahim, Najib Saedi. / Kesan gelombang kejutan terhadap sifat mikromekanik sambungan pateri SAC 0307/ENiG menggunakan pendekatan pelekukan nano. In: Sains Malaysiana. 2019 ; Vol. 48, No. 6. pp. 1273-1279.
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