Effect of reaction temperature on conversion and thermal properties of polyamide hot-melt adhesives

N. M. Ghasem, J. Heiderian, Wan Ramli Wan Daud

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

The work described in this paper aims at exploring the effect of reaction temperature, with and without a catalyst on the conversion and thermal properties of polyamide hot-melt adhesives. The polyamides were synthesized from C36 dimer acid and ethylenediamine; o-phosphoric acid was used as catalyst. The thermal properties investigated were glass transition temperature, melting point, heat of fusion, and molecular weight of the final products. Glass transition temperatures, heat of fusion, and melting point were found to increase with increasing molecular weight. Glass transition temperature was found to be in the range of 62-66°C; however, for noncatalytic reaction at 130°C, the final product was in liquid phase at room temperature and no glass transition temperature was detected. Results show that as the polymerization reaction temperature increases, the number average molecular weight increases. In the reaction, ethylenediamine and dimer acid should be taken in equivalent amounts to produce polyamides with high and desirable molecular weights. Excess of ethylenediamine will lead to low molecular weight products with the free amine group left unreacted. However, an extra amount of the ethylenediamine should be added initially to compensate for the evaporated loss of ethylene diamines. The excess amount should be equivalent to the amount that would evaporate during the preheating process. Parameters of the rate equations and the empirical parameters were determined with nonlinear regression analysis. The kinetic model was used to simulate experiments that were not included in the empirical parameter estimation. The comparison of the model predictions with the experimental data showed good agreement.

Original languageEnglish
Pages (from-to)599-608
Number of pages10
JournalAsia-Pacific Journal of Chemical Engineering
Volume2
Issue number6
DOIs
Publication statusPublished - Nov 2007
Externally publishedYes

Fingerprint

ethylenediamine
Hot melt adhesives
Nylons
Polyamides
Thermodynamic properties
Molecular weight
melt
glass
Dimers
temperature
Melting point
Fusion reactions
Temperature
Catalysts
acid
Acids
Diamines
Preheating
melting
Phosphoric acid

Keywords

  • Adhesive
  • Dimer acid
  • Ethylenediamine
  • Polyamide

ASJC Scopus subject areas

  • Chemical Engineering(all)
  • Renewable Energy, Sustainability and the Environment
  • Waste Management and Disposal

Cite this

Effect of reaction temperature on conversion and thermal properties of polyamide hot-melt adhesives. / Ghasem, N. M.; Heiderian, J.; Wan Daud, Wan Ramli.

In: Asia-Pacific Journal of Chemical Engineering, Vol. 2, No. 6, 11.2007, p. 599-608.

Research output: Contribution to journalArticle

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