Effect of phosphorus and nickel on electrochemical migration of Sn-3Ag-0.7Cu solder paste in simulated body fluid

Norinsan Kamil Othman, Emee Marina Salleh, C. Sarveswaran, F. Che Ani

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Electrochemical migration (ECM) behaviour of Sn-3Ag-0.7Cu and Sn-3Ag-0.7Cu-0.03P- 0.005Ni solder alloys were investigated using simulated body fluid (SBF) solution. In electronic devices, ECM phenomenon potentially leads to incompetence or failure of the whole devices. According to water drop test (WDT), mean-time-to-failure (MTTF) of commercially used Sn-3Ag-0.7Cu solder alloy was prolonged with addition of phosphorus (P) and nickel (Ni) as alloying elements. According to microstructure of each solder paste alloy which was observed using field emission scanning electron microscope (FESEM), dendrite structure in Sn-3Ag-0.7Cu-0.03P-0.005 Ni solder was lesser than in plain the Sn-3Ag-0.7Cu. This phenomenon suggested that presence of P and Ni retarded the growth of dendritic thus improved its corrosion resistance. Therefore, Sn-3Ag-0.7Cu -0.03P- 0.005Ni possessed a good corrosion resistance in SBF medium.

Original languageEnglish
Title of host publicationElectronic Packaging Interconnect Technology
PublisherTrans Tech Publications Ltd
Pages61-65
Number of pages5
ISBN (Print)9783035713244
DOIs
Publication statusPublished - 1 Jan 2018
EventElectronic Packaging Interconnect Technology Symposium, EPITS 2017 - Fukuoka, Japan
Duration: 1 Nov 20172 Nov 2017

Publication series

NameSolid State Phenomena
Volume273 SSP
ISSN (Electronic)1662-9779

Other

OtherElectronic Packaging Interconnect Technology Symposium, EPITS 2017
CountryJapan
CityFukuoka
Period1/11/172/11/17

Fingerprint

body fluids
Body fluids
solders
Ointments
Nickel
Soldering alloys
Phosphorus
phosphorus
nickel
corrosion resistance
Corrosion resistance
drop tests
dendrites
Alloying elements
plains
Field emission
alloying
field emission
Electron microscopes
electron microscopes

Keywords

  • Corrosion
  • Electrochemical migration
  • Lead free solder
  • Sn-3Ag-0.7Cu
  • Water drop test

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • Materials Science(all)
  • Condensed Matter Physics

Cite this

Othman, N. K., Salleh, E. M., Sarveswaran, C., & Che Ani, F. (2018). Effect of phosphorus and nickel on electrochemical migration of Sn-3Ag-0.7Cu solder paste in simulated body fluid. In Electronic Packaging Interconnect Technology (pp. 61-65). (Solid State Phenomena; Vol. 273 SSP). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/SSP.273.61

Effect of phosphorus and nickel on electrochemical migration of Sn-3Ag-0.7Cu solder paste in simulated body fluid. / Othman, Norinsan Kamil; Salleh, Emee Marina; Sarveswaran, C.; Che Ani, F.

Electronic Packaging Interconnect Technology. Trans Tech Publications Ltd, 2018. p. 61-65 (Solid State Phenomena; Vol. 273 SSP).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Othman, NK, Salleh, EM, Sarveswaran, C & Che Ani, F 2018, Effect of phosphorus and nickel on electrochemical migration of Sn-3Ag-0.7Cu solder paste in simulated body fluid. in Electronic Packaging Interconnect Technology. Solid State Phenomena, vol. 273 SSP, Trans Tech Publications Ltd, pp. 61-65, Electronic Packaging Interconnect Technology Symposium, EPITS 2017, Fukuoka, Japan, 1/11/17. https://doi.org/10.4028/www.scientific.net/SSP.273.61
Othman NK, Salleh EM, Sarveswaran C, Che Ani F. Effect of phosphorus and nickel on electrochemical migration of Sn-3Ag-0.7Cu solder paste in simulated body fluid. In Electronic Packaging Interconnect Technology. Trans Tech Publications Ltd. 2018. p. 61-65. (Solid State Phenomena). https://doi.org/10.4028/www.scientific.net/SSP.273.61
Othman, Norinsan Kamil ; Salleh, Emee Marina ; Sarveswaran, C. ; Che Ani, F. / Effect of phosphorus and nickel on electrochemical migration of Sn-3Ag-0.7Cu solder paste in simulated body fluid. Electronic Packaging Interconnect Technology. Trans Tech Publications Ltd, 2018. pp. 61-65 (Solid State Phenomena).
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