Effect of moisture on underfill interfacial adhesion and packages flexural strength in flip chip packaging

Zulkarnain Endut, Ibrahim Ahmad, Azami Zaharim, Norazham Mohd Sukemi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

In this study, effect of various moisture condition on underfill interfacial adhesion loss were examined using C-SAM, 4-point flexural bend test, and cross sectional analysis. In addition, weight gain analysis was used to determine packages moisture absorption at preconditioning level. In order to understand mechanical properties degradation of underfill material, 4-point flexural bending test was used. Maximum flexure load to bend the FC packages was recorded. Failure mode then was categorized to 3 mode; mode 1 for die cracking, mode 2 for underfill cracking and mode 3 for the combination of mode 1 and mode 2. Selected units for every condition were cross sectioned and analyzed with their bend test graph to further understand FC packages breaking mechanisms. It was interesting to found that maximum flexure load was degraded after every moisture condition .The failure mode has changed from die cracking to underfill cracking. Furthermore, cross sectional analysis shows that underfill cracking failure mode has propagated from cohesive failure at fillet area to adhesive failure at underfill to substrate/die interfaces. As a conclusion, packages flexural strength degraded after moisture stressing with failure mode shows the underfill mechanical properties degradation is the one of the factor that degrades the flexure strength and decreases underfill interfacial adhesion.

Original languageEnglish
Title of host publicationProceedings of the Electronic Packaging Technology Conference, EPTC
Pages879-884
Number of pages6
DOIs
Publication statusPublished - 2006
Event2006 8th Electronics Packaging Technology Conference, EPTC -
Duration: 6 Dec 20068 Dec 2006

Other

Other2006 8th Electronics Packaging Technology Conference, EPTC
Period6/12/068/12/06

Fingerprint

Bending strength
Failure modes
Packaging
Moisture
Adhesion
Degradation
Mechanical properties
Bending tests
Adhesives
Substrates

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Endut, Z., Ahmad, I., Zaharim, A., & Sukemi, N. M. (2006). Effect of moisture on underfill interfacial adhesion and packages flexural strength in flip chip packaging. In Proceedings of the Electronic Packaging Technology Conference, EPTC (pp. 879-884). [4147357] https://doi.org/10.1109/EPTC.2006.342828

Effect of moisture on underfill interfacial adhesion and packages flexural strength in flip chip packaging. / Endut, Zulkarnain; Ahmad, Ibrahim; Zaharim, Azami; Sukemi, Norazham Mohd.

Proceedings of the Electronic Packaging Technology Conference, EPTC. 2006. p. 879-884 4147357.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Endut, Z, Ahmad, I, Zaharim, A & Sukemi, NM 2006, Effect of moisture on underfill interfacial adhesion and packages flexural strength in flip chip packaging. in Proceedings of the Electronic Packaging Technology Conference, EPTC., 4147357, pp. 879-884, 2006 8th Electronics Packaging Technology Conference, EPTC, 6/12/06. https://doi.org/10.1109/EPTC.2006.342828
Endut Z, Ahmad I, Zaharim A, Sukemi NM. Effect of moisture on underfill interfacial adhesion and packages flexural strength in flip chip packaging. In Proceedings of the Electronic Packaging Technology Conference, EPTC. 2006. p. 879-884. 4147357 https://doi.org/10.1109/EPTC.2006.342828
Endut, Zulkarnain ; Ahmad, Ibrahim ; Zaharim, Azami ; Sukemi, Norazham Mohd. / Effect of moisture on underfill interfacial adhesion and packages flexural strength in flip chip packaging. Proceedings of the Electronic Packaging Technology Conference, EPTC. 2006. pp. 879-884
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