Effect of laminated wafer toward dicing process and alternative double pass sawing method to reduce chipping

Hoh Huey Jiun, Ibrahim Ahmad, Azman Jalar @ Jalil, Ghazali Omar

Research output: Contribution to journalArticle

21 Citations (Scopus)

Abstract

Thin wafers of 100-μm thickness laminated with die-attach film (DAF) was diced using a standard sawing process and revealed a low chipping crack resistance. Wafers laminated with conductive DAF shows greater chipping compared to nonconductive DAF and bare silicon wafer. It was found through scanning electron microscopy (SEM) micrographs, energy dispersive X-ray (EDX) analysis, and atomic force microscopy (AFM) that silver fillers in the conductive DAF was the cause of excessive blade loading which resulted in bad chipping quality. To reduce chipping/cracking induced by sawing, an alternative double-pass sawing method was developed and is explained in the paper. The methodology of this study discusses a double-pass method, where the first pass dice through the wafer and varied the percentage of DAF thickness cut. Best results were achieved when dicing through the wafer and 0% of DAF, followed by a full separation in the second pass. Approximately 80% of chipping reduction compared to conventional single pass.

Original languageEnglish
Pages (from-to)17-24
Number of pages8
JournalIEEE Transactions on Electronics Packaging Manufacturing
Volume29
Issue number1
DOIs
Publication statusPublished - Jan 2006

Fingerprint

Sawing
Energy dispersive X ray analysis
Silicon wafers
Film thickness
Fillers
Atomic force microscopy
Silver
Cracks
Scanning electron microscopy

Keywords

  • Blade overloading
  • Die-attach film
  • Double-pass saw process
  • Laminated wafer
  • Lateral crack

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering

Cite this

Effect of laminated wafer toward dicing process and alternative double pass sawing method to reduce chipping. / Jiun, Hoh Huey; Ahmad, Ibrahim; Jalar @ Jalil, Azman; Omar, Ghazali.

In: IEEE Transactions on Electronics Packaging Manufacturing, Vol. 29, No. 1, 01.2006, p. 17-24.

Research output: Contribution to journalArticle

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