Kesan penuaan sesuhu terhadap sifat mikro kekerasan pempaterian Sn-Ag-Cu/cnt/cu menggunakan pelekukan nano

Translated title of the contribution: Effect of isothermal aging on microhardness properties of Sn-Ag-Cu/CNT/Cu using nanoindentation

Norliza Ismail, Azman Jalar @ Jalil, Maria Abu Bakar, Roslina Ismail, Nur Shafiqa Safee, Ahmad Ghadafi Ismail, Najib Saedi Ibrahim

Research output: Contribution to journalArticle

Abstract

Effect of thermal aging towards hardness properties of Sn-3.0Ag-0.5Cu (SAC305) solder joint added with carbon nanotube (CNT) particles was investigated. Hardness properties indicate the strength of solder was determined by nanoindentation approach. SAC solder alloy was added with 0.03% weight percent of CNT to form SAC305-CNT solder paste. Printed solder paste on printed circuit board (PCB) with copper (Cu) surface finish underwent reflow soldering at peak temperature 260°C to form SAC305 and SAC305-CNT solder joint. Then, SAC305 and SAC305-CNT were exposed to thermal aging via high temperature storage test (HTS) at constant temperature 150°C for about 200, 400, 600, 800 and 1000 h. Solder joint samples after reflow and thermal aging were analysed using nanoindentation method to determine hardness properties. For microstructure analysis, samples were etched and images were captured via optical microscope. The results showed microhardness values decrease with increasing of aging time for both investigated solder joints. However, hardness values for SAC305-CNT solder joint was higher (~10-26%) compared to SAC305 solder joint without CNT. From nanoindentation test, localized microhardness properties of solder joint under isothermal aging have been attained. Trend of microhardness values obtained was parallel with the trend gained by using conventional hardness test.

Original languageMalay
Pages (from-to)1267-1272
Number of pages6
JournalSains Malaysiana
Volume48
Issue number6
DOIs
Publication statusPublished - 1 Jan 2019

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Nanoindentation
Soldering alloys
Microhardness
Carbon nanotubes
Aging of materials
Hardness
Thermal aging
Soldering
Printed circuit boards
Temperature
Microscopes
Copper
Microstructure

ASJC Scopus subject areas

  • General

Cite this

Kesan penuaan sesuhu terhadap sifat mikro kekerasan pempaterian Sn-Ag-Cu/cnt/cu menggunakan pelekukan nano. / Ismail, Norliza; Jalar @ Jalil, Azman; Bakar, Maria Abu; Ismail, Roslina; Safee, Nur Shafiqa; Ismail, Ahmad Ghadafi; Ibrahim, Najib Saedi.

In: Sains Malaysiana, Vol. 48, No. 6, 01.01.2019, p. 1267-1272.

Research output: Contribution to journalArticle

Ismail, Norliza ; Jalar @ Jalil, Azman ; Bakar, Maria Abu ; Ismail, Roslina ; Safee, Nur Shafiqa ; Ismail, Ahmad Ghadafi ; Ibrahim, Najib Saedi. / Kesan penuaan sesuhu terhadap sifat mikro kekerasan pempaterian Sn-Ag-Cu/cnt/cu menggunakan pelekukan nano. In: Sains Malaysiana. 2019 ; Vol. 48, No. 6. pp. 1267-1272.
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abstract = "Effect of thermal aging towards hardness properties of Sn-3.0Ag-0.5Cu (SAC305) solder joint added with carbon nanotube (CNT) particles was investigated. Hardness properties indicate the strength of solder was determined by nanoindentation approach. SAC solder alloy was added with 0.03{\%} weight percent of CNT to form SAC305-CNT solder paste. Printed solder paste on printed circuit board (PCB) with copper (Cu) surface finish underwent reflow soldering at peak temperature 260°C to form SAC305 and SAC305-CNT solder joint. Then, SAC305 and SAC305-CNT were exposed to thermal aging via high temperature storage test (HTS) at constant temperature 150°C for about 200, 400, 600, 800 and 1000 h. Solder joint samples after reflow and thermal aging were analysed using nanoindentation method to determine hardness properties. For microstructure analysis, samples were etched and images were captured via optical microscope. The results showed microhardness values decrease with increasing of aging time for both investigated solder joints. However, hardness values for SAC305-CNT solder joint was higher (~10-26{\%}) compared to SAC305 solder joint without CNT. From nanoindentation test, localized microhardness properties of solder joint under isothermal aging have been attained. Trend of microhardness values obtained was parallel with the trend gained by using conventional hardness test.",
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AU - Bakar, Maria Abu

AU - Ismail, Roslina

AU - Safee, Nur Shafiqa

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AB - Effect of thermal aging towards hardness properties of Sn-3.0Ag-0.5Cu (SAC305) solder joint added with carbon nanotube (CNT) particles was investigated. Hardness properties indicate the strength of solder was determined by nanoindentation approach. SAC solder alloy was added with 0.03% weight percent of CNT to form SAC305-CNT solder paste. Printed solder paste on printed circuit board (PCB) with copper (Cu) surface finish underwent reflow soldering at peak temperature 260°C to form SAC305 and SAC305-CNT solder joint. Then, SAC305 and SAC305-CNT were exposed to thermal aging via high temperature storage test (HTS) at constant temperature 150°C for about 200, 400, 600, 800 and 1000 h. Solder joint samples after reflow and thermal aging were analysed using nanoindentation method to determine hardness properties. For microstructure analysis, samples were etched and images were captured via optical microscope. The results showed microhardness values decrease with increasing of aging time for both investigated solder joints. However, hardness values for SAC305-CNT solder joint was higher (~10-26%) compared to SAC305 solder joint without CNT. From nanoindentation test, localized microhardness properties of solder joint under isothermal aging have been attained. Trend of microhardness values obtained was parallel with the trend gained by using conventional hardness test.

KW - Carbon nanotube

KW - Hardness

KW - Nanoindentation

KW - Sn-Ag-Cu

KW - Thermal aging

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