Effect of hook location for ultra fine pitch wirebonding pull testing method

F. Harun, Azman Jalar @ Jalil, Shahrum Abdullah, M. F M Yunoh

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Over the years the methods for checking bonding quality during volume production still remains the same. These inspection methods like ball shear to test the first bond quality and wire pull to test the second bond integrity and quality have proven to be acceptable and achievable for many current industrial needs. However, driven by the relentless pursuit of dimensional reduction in wire bonding technology which calls for reduction in wire diameter, these conventional methods may not be sufficient. The interaction between machine, bonding tools, materials and the different categories of failure modes and mechanism during this quality test has become much more sensitive. The intent of this paper is to study and define the different categories of failure modes during 2nd bond test for ultra fine gold wire from 15 micron diameter up to 50 micron diameter. Therefore, lifted stitch or lifted 2nd bond which is a failure description known to be a 'reject' before can be re-visited. Analysis found that the two different test locations revealed that test location B or placing the hook as near possible to the leads where the 2nd bond was bonded is the better method to test the 2nd bond strength and performance as compared to the earlier bond pull method (location A).

Original languageEnglish
Title of host publicationKey Engineering Materials
Pages1279-1283
Number of pages5
Volume462-463
DOIs
Publication statusPublished - 2011
Event8th International Conference on Fracture and Strength of Solids 2010, FEOFS2010 - Kuala Lumpur
Duration: 7 Jun 20109 Jun 2010

Publication series

NameKey Engineering Materials
Volume462-463
ISSN (Print)10139826

Other

Other8th International Conference on Fracture and Strength of Solids 2010, FEOFS2010
CityKuala Lumpur
Period7/6/109/6/10

Fingerprint

Hooks
Wire
Testing
Failure modes
Gold
Inspection

Keywords

  • 2 bond failure mechanism
  • 2 bond strength
  • 2 bond test method
  • Wire bond

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Harun, F., Jalar @ Jalil, A., Abdullah, S., & Yunoh, M. F. M. (2011). Effect of hook location for ultra fine pitch wirebonding pull testing method. In Key Engineering Materials (Vol. 462-463, pp. 1279-1283). (Key Engineering Materials; Vol. 462-463). https://doi.org/10.4028/www.scientific.net/KEM.462-463.1279

Effect of hook location for ultra fine pitch wirebonding pull testing method. / Harun, F.; Jalar @ Jalil, Azman; Abdullah, Shahrum; Yunoh, M. F M.

Key Engineering Materials. Vol. 462-463 2011. p. 1279-1283 (Key Engineering Materials; Vol. 462-463).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Harun, F, Jalar @ Jalil, A, Abdullah, S & Yunoh, MFM 2011, Effect of hook location for ultra fine pitch wirebonding pull testing method. in Key Engineering Materials. vol. 462-463, Key Engineering Materials, vol. 462-463, pp. 1279-1283, 8th International Conference on Fracture and Strength of Solids 2010, FEOFS2010, Kuala Lumpur, 7/6/10. https://doi.org/10.4028/www.scientific.net/KEM.462-463.1279
Harun F, Jalar @ Jalil A, Abdullah S, Yunoh MFM. Effect of hook location for ultra fine pitch wirebonding pull testing method. In Key Engineering Materials. Vol. 462-463. 2011. p. 1279-1283. (Key Engineering Materials). https://doi.org/10.4028/www.scientific.net/KEM.462-463.1279
Harun, F. ; Jalar @ Jalil, Azman ; Abdullah, Shahrum ; Yunoh, M. F M. / Effect of hook location for ultra fine pitch wirebonding pull testing method. Key Engineering Materials. Vol. 462-463 2011. pp. 1279-1283 (Key Engineering Materials).
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