Effect of gold concentration through a single dynamic wave soldering process

F. Che Ani, M. S. Abdul Aziz, Azman Jalar @ Jalil, M. Z. Abdullah, P. Rethinasamy

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Gold possesses a unique combination of properties of particular value in the construction and operation of electrical and electronic equipment. These properties include low electrical resistivity and contact resistance, ease of thermal compression and high resistance to mechanical wear. Most efficient use is by employing gold, usually in the electroplated form, either as an intermediate layer in certain microelectronic devices, or as a finishing on such components as connectors, terminations, and printed circuits. This paper presents a study of interaction between tin-lead solder and pin, which are associated with intermetallic compound (IMC) after undergoing dynamic wave soldering. The aim of the study was to determine the effect of IMC formation to joint reliability by verifying the gold concentration as IPC J-Standards guidelines of a minimum of 3 wt% [1] [2] In our case study, the gold pins (without pre-tinned) are actually inserted directly into PCB and passed through dynamic wave soldering using wave pallet. The surface scanning electron microscopy and energy dispersive x-ray were used to reveal the concentration of gold present in the IMC microstructure after undergoing wave soldering (inserted into PCB). It was found that no gold presence for a thin PCB (thickness: 0.0596in or 1.514mm) and small percentage of gold presence (less than a minimum of 3 wt %) for a thick PCB (thickness: 0.30in or 7.62mm). Therefore, a double hot dip process is not required prior to assembly process.

Original languageEnglish
Title of host publication14th International Conference on Electronic Materials and Packaging, EMAP 2012
DOIs
Publication statusPublished - 2012
Event14th International Conference on Electronic Materials and Packaging, EMAP 2012 - Lantau Island
Duration: 13 Dec 201216 Dec 2012

Other

Other14th International Conference on Electronic Materials and Packaging, EMAP 2012
CityLantau Island
Period13/12/1216/12/12

Fingerprint

Soldering
Gold
Polychlorinated Biphenyls
Polychlorinated biphenyls
Intermetallics
Printed circuits
Pallets
Tin
Contact resistance
Microelectronics
Soldering alloys
Compaction
Electronic equipment
Lead
Wear of materials
X rays
Microstructure
Scanning electron microscopy

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

Cite this

Che Ani, F., Abdul Aziz, M. S., Jalar @ Jalil, A., Abdullah, M. Z., & Rethinasamy, P. (2012). Effect of gold concentration through a single dynamic wave soldering process. In 14th International Conference on Electronic Materials and Packaging, EMAP 2012 [6507859] https://doi.org/10.1109/EMAP.2012.6507859

Effect of gold concentration through a single dynamic wave soldering process. / Che Ani, F.; Abdul Aziz, M. S.; Jalar @ Jalil, Azman; Abdullah, M. Z.; Rethinasamy, P.

14th International Conference on Electronic Materials and Packaging, EMAP 2012. 2012. 6507859.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Che Ani, F, Abdul Aziz, MS, Jalar @ Jalil, A, Abdullah, MZ & Rethinasamy, P 2012, Effect of gold concentration through a single dynamic wave soldering process. in 14th International Conference on Electronic Materials and Packaging, EMAP 2012., 6507859, 14th International Conference on Electronic Materials and Packaging, EMAP 2012, Lantau Island, 13/12/12. https://doi.org/10.1109/EMAP.2012.6507859
Che Ani F, Abdul Aziz MS, Jalar @ Jalil A, Abdullah MZ, Rethinasamy P. Effect of gold concentration through a single dynamic wave soldering process. In 14th International Conference on Electronic Materials and Packaging, EMAP 2012. 2012. 6507859 https://doi.org/10.1109/EMAP.2012.6507859
Che Ani, F. ; Abdul Aziz, M. S. ; Jalar @ Jalil, Azman ; Abdullah, M. Z. ; Rethinasamy, P. / Effect of gold concentration through a single dynamic wave soldering process. 14th International Conference on Electronic Materials and Packaging, EMAP 2012. 2012.
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