Effect of different S AC based nanoparticles types on the reflow soldering process of miniaturized component using discrete phase model simulation

M. A.Fatah M. Mukhtar, A. Abas, M. S. Haslinda, F. Che Ani, Azman Jalar @ Jalil, A. A. Saad, M. Z. Abdullah, R. Ismail

Research output: Contribution to journalArticle

Abstract

The wetting formation and nanoparticles dispersion on adding nanoparticles to the lead free solder Sn-3.0Ag-0.5Cu (SAC305) is methodically investigated using Discrete Phase Model (DPM) simulation and applied on a 01005 capacitor component. Different types of nanoparticles, namely titanium dioxide (TiO2), nickle oxide (NiO) and Iron (III) oxide (Fe2O3) with varying weight percentages, 0.01wt%, 0.05wt% and 0.15wt% that is doped in SAC305 are used. The study of two-way interactions between multiphase volume of fluid (VOF) and discrete phase model (DPM) shows excellent capability in tracking the dispersed nanoparticles immersed in the wetted molten solder. In this study, real reflow profile temperature setup will be used to mimic the conventional reflow process. Based on the findings, the fillet height managed to achieve the minimum required height set by IPC standards. As the concentration of the nanoparticles doped in the molten solder increases, higher time is required for the wetting process. In general, the doped NiO nanoparticles at 0.05wt% has the lowest wetting time compared to other cases. The study of the instantaneous nanoparticles trajectory tracking was also conducted on a 3D model and 2D cross sectional view to identify the exact movement of the particles. Additionally, it was also observed that the velocity and pressure distribution increases as the weight percentage of the nanoparticles increases.

Original languageEnglish
Pages (from-to)1683-1696
Number of pages14
JournalJournal of Applied Fluid Mechanics
Volume12
Issue number5
DOIs
Publication statusPublished - 1 Jan 2019

Fingerprint

soldering
Soldering
alternating current
Nanoparticles
nanoparticles
solders
simulation
wetting
Wetting
Soldering alloys
oxides
Molten materials
fillets
Oxides
Velocity distribution
Iron oxides
pressure distribution
titanium oxides
Pressure distribution
temperature profiles

Keywords

  • Discrete phase model
  • Nanocomposite solder paste
  • Nanoparticle
  • Numerical simulation
  • SAC305

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Effect of different S AC based nanoparticles types on the reflow soldering process of miniaturized component using discrete phase model simulation. / Mukhtar, M. A.Fatah M.; Abas, A.; Haslinda, M. S.; Che Ani, F.; Jalar @ Jalil, Azman; Saad, A. A.; Abdullah, M. Z.; Ismail, R.

In: Journal of Applied Fluid Mechanics, Vol. 12, No. 5, 01.01.2019, p. 1683-1696.

Research output: Contribution to journalArticle

Mukhtar, M. A.Fatah M. ; Abas, A. ; Haslinda, M. S. ; Che Ani, F. ; Jalar @ Jalil, Azman ; Saad, A. A. ; Abdullah, M. Z. ; Ismail, R. / Effect of different S AC based nanoparticles types on the reflow soldering process of miniaturized component using discrete phase model simulation. In: Journal of Applied Fluid Mechanics. 2019 ; Vol. 12, No. 5. pp. 1683-1696.
@article{c69253f018be42c1a9e88750dbd5dae0,
title = "Effect of different S AC based nanoparticles types on the reflow soldering process of miniaturized component using discrete phase model simulation",
abstract = "The wetting formation and nanoparticles dispersion on adding nanoparticles to the lead free solder Sn-3.0Ag-0.5Cu (SAC305) is methodically investigated using Discrete Phase Model (DPM) simulation and applied on a 01005 capacitor component. Different types of nanoparticles, namely titanium dioxide (TiO2), nickle oxide (NiO) and Iron (III) oxide (Fe2O3) with varying weight percentages, 0.01wt{\%}, 0.05wt{\%} and 0.15wt{\%} that is doped in SAC305 are used. The study of two-way interactions between multiphase volume of fluid (VOF) and discrete phase model (DPM) shows excellent capability in tracking the dispersed nanoparticles immersed in the wetted molten solder. In this study, real reflow profile temperature setup will be used to mimic the conventional reflow process. Based on the findings, the fillet height managed to achieve the minimum required height set by IPC standards. As the concentration of the nanoparticles doped in the molten solder increases, higher time is required for the wetting process. In general, the doped NiO nanoparticles at 0.05wt{\%} has the lowest wetting time compared to other cases. The study of the instantaneous nanoparticles trajectory tracking was also conducted on a 3D model and 2D cross sectional view to identify the exact movement of the particles. Additionally, it was also observed that the velocity and pressure distribution increases as the weight percentage of the nanoparticles increases.",
keywords = "Discrete phase model, Nanocomposite solder paste, Nanoparticle, Numerical simulation, SAC305",
author = "Mukhtar, {M. A.Fatah M.} and A. Abas and Haslinda, {M. S.} and {Che Ani}, F. and {Jalar @ Jalil}, Azman and Saad, {A. A.} and Abdullah, {M. Z.} and R. Ismail",
year = "2019",
month = "1",
day = "1",
doi = "10.29252/JAFM.12.05.29553",
language = "English",
volume = "12",
pages = "1683--1696",
journal = "Journal of Applied Fluid Mechanics",
issn = "1735-3572",
publisher = "Isfahan University of Technology",
number = "5",

}

TY - JOUR

T1 - Effect of different S AC based nanoparticles types on the reflow soldering process of miniaturized component using discrete phase model simulation

AU - Mukhtar, M. A.Fatah M.

AU - Abas, A.

AU - Haslinda, M. S.

AU - Che Ani, F.

AU - Jalar @ Jalil, Azman

AU - Saad, A. A.

AU - Abdullah, M. Z.

AU - Ismail, R.

PY - 2019/1/1

Y1 - 2019/1/1

N2 - The wetting formation and nanoparticles dispersion on adding nanoparticles to the lead free solder Sn-3.0Ag-0.5Cu (SAC305) is methodically investigated using Discrete Phase Model (DPM) simulation and applied on a 01005 capacitor component. Different types of nanoparticles, namely titanium dioxide (TiO2), nickle oxide (NiO) and Iron (III) oxide (Fe2O3) with varying weight percentages, 0.01wt%, 0.05wt% and 0.15wt% that is doped in SAC305 are used. The study of two-way interactions between multiphase volume of fluid (VOF) and discrete phase model (DPM) shows excellent capability in tracking the dispersed nanoparticles immersed in the wetted molten solder. In this study, real reflow profile temperature setup will be used to mimic the conventional reflow process. Based on the findings, the fillet height managed to achieve the minimum required height set by IPC standards. As the concentration of the nanoparticles doped in the molten solder increases, higher time is required for the wetting process. In general, the doped NiO nanoparticles at 0.05wt% has the lowest wetting time compared to other cases. The study of the instantaneous nanoparticles trajectory tracking was also conducted on a 3D model and 2D cross sectional view to identify the exact movement of the particles. Additionally, it was also observed that the velocity and pressure distribution increases as the weight percentage of the nanoparticles increases.

AB - The wetting formation and nanoparticles dispersion on adding nanoparticles to the lead free solder Sn-3.0Ag-0.5Cu (SAC305) is methodically investigated using Discrete Phase Model (DPM) simulation and applied on a 01005 capacitor component. Different types of nanoparticles, namely titanium dioxide (TiO2), nickle oxide (NiO) and Iron (III) oxide (Fe2O3) with varying weight percentages, 0.01wt%, 0.05wt% and 0.15wt% that is doped in SAC305 are used. The study of two-way interactions between multiphase volume of fluid (VOF) and discrete phase model (DPM) shows excellent capability in tracking the dispersed nanoparticles immersed in the wetted molten solder. In this study, real reflow profile temperature setup will be used to mimic the conventional reflow process. Based on the findings, the fillet height managed to achieve the minimum required height set by IPC standards. As the concentration of the nanoparticles doped in the molten solder increases, higher time is required for the wetting process. In general, the doped NiO nanoparticles at 0.05wt% has the lowest wetting time compared to other cases. The study of the instantaneous nanoparticles trajectory tracking was also conducted on a 3D model and 2D cross sectional view to identify the exact movement of the particles. Additionally, it was also observed that the velocity and pressure distribution increases as the weight percentage of the nanoparticles increases.

KW - Discrete phase model

KW - Nanocomposite solder paste

KW - Nanoparticle

KW - Numerical simulation

KW - SAC305

UR - http://www.scopus.com/inward/record.url?scp=85071535518&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85071535518&partnerID=8YFLogxK

U2 - 10.29252/JAFM.12.05.29553

DO - 10.29252/JAFM.12.05.29553

M3 - Article

AN - SCOPUS:85071535518

VL - 12

SP - 1683

EP - 1696

JO - Journal of Applied Fluid Mechanics

JF - Journal of Applied Fluid Mechanics

SN - 1735-3572

IS - 5

ER -