Effect of curing profile to eliminate the voids/black dots formation in underfill epoxy for Hi-CTE flip chip packaging

Zainudin Kornain, Azman Jalar @ Jalil, Rozaidi Rasid, Fong Chee Seng

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Void formation in underfill is considered as failure in flip chip manufacturing process. Void formation possibly caused by several factors such as poor soldering and flux residue during die attach process, void entrapment due moisture contamination, dispense pattern process and setting up the curing process. This paper presents the comparison of single step and two steps curing profile towards the void and black dots formation in underfill for Hi-CTE Flip Chip Ceramic Ball Grid Array Package (FC-CBGA). Statistic analysis was conducted to analyze how different factors such as wafer lot, sawing technique, underfill fillet height and curing profile recipe were affected the formation of voids and black dots. A C-Mode Scanning Aqoustic Microscopy (C-SAM) was used to scan the total count of voids and black dots. It was shown that the 2 steps curing profile provided solution for void elimination and black dots in underfill after curing process.

Original languageEnglish
Pages (from-to)374-379
Number of pages6
JournalWorld Academy of Science, Engineering and Technology
Volume59
Publication statusPublished - Nov 2009

Fingerprint

Curing
Packaging
Sawing
Ball grid arrays
Soldering
Microscopic examination
Contamination
Moisture
Statistics
Fluxes
Scanning

Keywords

  • Black dots formation
  • Curing profile
  • Fc-cbga
  • Underfill
  • Void formation

ASJC Scopus subject areas

  • Engineering(all)

Cite this

@article{95cfba5b3c3e40329bf8a3e3c018a6bd,
title = "Effect of curing profile to eliminate the voids/black dots formation in underfill epoxy for Hi-CTE flip chip packaging",
abstract = "Void formation in underfill is considered as failure in flip chip manufacturing process. Void formation possibly caused by several factors such as poor soldering and flux residue during die attach process, void entrapment due moisture contamination, dispense pattern process and setting up the curing process. This paper presents the comparison of single step and two steps curing profile towards the void and black dots formation in underfill for Hi-CTE Flip Chip Ceramic Ball Grid Array Package (FC-CBGA). Statistic analysis was conducted to analyze how different factors such as wafer lot, sawing technique, underfill fillet height and curing profile recipe were affected the formation of voids and black dots. A C-Mode Scanning Aqoustic Microscopy (C-SAM) was used to scan the total count of voids and black dots. It was shown that the 2 steps curing profile provided solution for void elimination and black dots in underfill after curing process.",
keywords = "Black dots formation, Curing profile, Fc-cbga, Underfill, Void formation",
author = "Zainudin Kornain and {Jalar @ Jalil}, Azman and Rozaidi Rasid and Seng, {Fong Chee}",
year = "2009",
month = "11",
language = "English",
volume = "59",
pages = "374--379",
journal = "World Academy of Science, Engineering and Technology",
issn = "2010-376X",
publisher = "World Academy of Science Engineering and Technology",

}

TY - JOUR

T1 - Effect of curing profile to eliminate the voids/black dots formation in underfill epoxy for Hi-CTE flip chip packaging

AU - Kornain, Zainudin

AU - Jalar @ Jalil, Azman

AU - Rasid, Rozaidi

AU - Seng, Fong Chee

PY - 2009/11

Y1 - 2009/11

N2 - Void formation in underfill is considered as failure in flip chip manufacturing process. Void formation possibly caused by several factors such as poor soldering and flux residue during die attach process, void entrapment due moisture contamination, dispense pattern process and setting up the curing process. This paper presents the comparison of single step and two steps curing profile towards the void and black dots formation in underfill for Hi-CTE Flip Chip Ceramic Ball Grid Array Package (FC-CBGA). Statistic analysis was conducted to analyze how different factors such as wafer lot, sawing technique, underfill fillet height and curing profile recipe were affected the formation of voids and black dots. A C-Mode Scanning Aqoustic Microscopy (C-SAM) was used to scan the total count of voids and black dots. It was shown that the 2 steps curing profile provided solution for void elimination and black dots in underfill after curing process.

AB - Void formation in underfill is considered as failure in flip chip manufacturing process. Void formation possibly caused by several factors such as poor soldering and flux residue during die attach process, void entrapment due moisture contamination, dispense pattern process and setting up the curing process. This paper presents the comparison of single step and two steps curing profile towards the void and black dots formation in underfill for Hi-CTE Flip Chip Ceramic Ball Grid Array Package (FC-CBGA). Statistic analysis was conducted to analyze how different factors such as wafer lot, sawing technique, underfill fillet height and curing profile recipe were affected the formation of voids and black dots. A C-Mode Scanning Aqoustic Microscopy (C-SAM) was used to scan the total count of voids and black dots. It was shown that the 2 steps curing profile provided solution for void elimination and black dots in underfill after curing process.

KW - Black dots formation

KW - Curing profile

KW - Fc-cbga

KW - Underfill

KW - Void formation

UR - http://www.scopus.com/inward/record.url?scp=78651587977&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=78651587977&partnerID=8YFLogxK

M3 - Article

AN - SCOPUS:78651587977

VL - 59

SP - 374

EP - 379

JO - World Academy of Science, Engineering and Technology

JF - World Academy of Science, Engineering and Technology

SN - 2010-376X

ER -