Kesan pigmen pewarna terhadap pertumbuhan sebatian antara logam sambungan pateri Sn-3.0Ag-0.5Cu

Translated title of the contribution: Effect of coloured pigment on intermetallic compound growth of Sn-3.0Ag-0.5Cu solder joint

Azman Jalar @ Jalil, Maria Abu Bakar, Roslina Ismail, Najib Saedi Ibrahim, Mohd Ariffin Ambak

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

The colouration of solder paste opens up a space for technology requirements for the identification, marking, standardization, testing and evaluation processes of the solder inconnection. Two types of colour pigments, green (G) and glow in the dark (GD) are used to study the effect of coloured solder on stability of solder joint Sn-3.0Ag-0.5Cu (SAC 305). Colourless solder paste is used as a control sample to compare the results of the study. The isothermal aging test is used to observe the growth of intermetallic compound (IMC). GD colour pigment with a percentage of 5% has shown growth stability with the lowest changes of IMC growth, 5.6 µm for coloured solder joint as compared to other higher colour pigment percentage with higher changes of IMC growth up to 9 µm after subjected to isothermal aging at 150°C for 1000 h. However, IMC growth stability with the use of coloured solder paste is lesser than the colourless solder paste. Therefore, the addition of colour pigments should be considered on the stability of the microstructure and the growth of the IMC layer so that it will not affect the solder joint quality and reliability.

Original languageMalay
Pages (from-to)1005-1010
Number of pages6
JournalSains Malaysiana
Volume47
Issue number5
DOIs
Publication statusPublished - 1 May 2018

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Pigments
Soldering alloys
Intermetallics
Color
Aging of materials
Standardization
Microstructure
Testing

ASJC Scopus subject areas

  • General

Cite this

Kesan pigmen pewarna terhadap pertumbuhan sebatian antara logam sambungan pateri Sn-3.0Ag-0.5Cu. / Jalar @ Jalil, Azman; Bakar, Maria Abu; Ismail, Roslina; Ibrahim, Najib Saedi; Ambak, Mohd Ariffin.

In: Sains Malaysiana, Vol. 47, No. 5, 01.05.2018, p. 1005-1010.

Research output: Contribution to journalArticle

Jalar @ Jalil, Azman ; Bakar, Maria Abu ; Ismail, Roslina ; Ibrahim, Najib Saedi ; Ambak, Mohd Ariffin. / Kesan pigmen pewarna terhadap pertumbuhan sebatian antara logam sambungan pateri Sn-3.0Ag-0.5Cu. In: Sains Malaysiana. 2018 ; Vol. 47, No. 5. pp. 1005-1010.
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