Effect of applied load in the nanoindentation of gold ball bonds

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

We have analyzed the effects of nanoindentation at applied loads of 10 mN and 20 mN on the micromechanical properties of gold (Au) ball bonds with and without cracks. The depth profile and the plastic zone size for each indentation were determined to identify the substrate effect and its relationship with the observed micromechanical properties. The substrate effect occurred for indentations at 20 mN applied load, but did not occur near cracks for either 10 mN or 20 mN loads. Because of the substrate effect and the presence of cracks, the average hardness or yield strength decreased for indentations on Au ball bonds. Therefore, to minimize the substrate effect, an applied load of 10 mN is best for characterizing Au ball bonds.

Original languageEnglish
Pages (from-to)1063-1072
Number of pages10
JournalJournal of Electronic Materials
Volume42
Issue number6
DOIs
Publication statusPublished - Jun 2013

Fingerprint

Nanoindentation
nanoindentation
Gold
balls
Indentation
gold
indentation
Substrates
Cracks
cracks
Yield stress
yield strength
Hardness
Plastics
hardness
plastics
profiles

Keywords

  • applied load
  • Au ball bond
  • bonding ability
  • Nanoindentation
  • substrate effect

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Materials Chemistry

Cite this

Effect of applied load in the nanoindentation of gold ball bonds. / Zulkifli, Muhammad Nubli; Jalar @ Jalil, Azman; Abdullah, Shahrum; Abdul Rahman, Irman; Othman, Norinsan Kamil.

In: Journal of Electronic Materials, Vol. 42, No. 6, 06.2013, p. 1063-1072.

Research output: Contribution to journalArticle

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