Dynamic behavior of condenser microphone under the influence of squeeze film damping

Siti Aisyah Zawawi, Azrul Azlan Hamzah, Reena Sri Selvarajan, Burhanuddin Yeop Majlis, Faisal Mohd-Yasin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper investigates the effect of squeeze film damping on a micromechanical structure that oscillates due to the pressure distribution on moveable top plate that pair with perforated backplate. The damping characteristics are analytically evaluated to establish the optimum design that increase dynamics performance. The squeezed film damping governing equation, the Reynolds equation, is the fundamental equation of this work. The damping coefficient, air gap damping and viscous damping are calculated by using Skvor's formula. The size of perforation holes and air gap thickness that influencing the squeeze film damping were studied. Analytical solution with various holes structure are summarized. Overall, the 3μm of hole radius, 50μm of holes center-to-center distance and 4μm of air gap thickness were found to be the best in order to reduce squeeze film damping in capacitive microphone.

Original languageEnglish
Title of host publication2018 IEEE International Conference on Semiconductor Electronics, ICSE 2018 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages104-108
Number of pages5
Volume2018-August
ISBN (Electronic)9781538652831
DOIs
Publication statusPublished - 3 Oct 2018
Event13th IEEE International Conference on Semiconductor Electronics, ICSE 2018 - Kuala Lumpur, Malaysia
Duration: 15 Aug 201817 Aug 2018

Other

Other13th IEEE International Conference on Semiconductor Electronics, ICSE 2018
CountryMalaysia
CityKuala Lumpur
Period15/8/1817/8/18

Fingerprint

Microphones
Damping
Air
Reynolds equation
Pressure distribution

Keywords

  • perforated structure
  • squeeze film damping
  • viscous damping

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Zawawi, S. A., Hamzah, A. A., Selvarajan, R. S., Yeop Majlis, B., & Mohd-Yasin, F. (2018). Dynamic behavior of condenser microphone under the influence of squeeze film damping. In 2018 IEEE International Conference on Semiconductor Electronics, ICSE 2018 - Proceedings (Vol. 2018-August, pp. 104-108). [8481244] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SMELEC.2018.8481244

Dynamic behavior of condenser microphone under the influence of squeeze film damping. / Zawawi, Siti Aisyah; Hamzah, Azrul Azlan; Selvarajan, Reena Sri; Yeop Majlis, Burhanuddin; Mohd-Yasin, Faisal.

2018 IEEE International Conference on Semiconductor Electronics, ICSE 2018 - Proceedings. Vol. 2018-August Institute of Electrical and Electronics Engineers Inc., 2018. p. 104-108 8481244.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Zawawi, SA, Hamzah, AA, Selvarajan, RS, Yeop Majlis, B & Mohd-Yasin, F 2018, Dynamic behavior of condenser microphone under the influence of squeeze film damping. in 2018 IEEE International Conference on Semiconductor Electronics, ICSE 2018 - Proceedings. vol. 2018-August, 8481244, Institute of Electrical and Electronics Engineers Inc., pp. 104-108, 13th IEEE International Conference on Semiconductor Electronics, ICSE 2018, Kuala Lumpur, Malaysia, 15/8/18. https://doi.org/10.1109/SMELEC.2018.8481244
Zawawi SA, Hamzah AA, Selvarajan RS, Yeop Majlis B, Mohd-Yasin F. Dynamic behavior of condenser microphone under the influence of squeeze film damping. In 2018 IEEE International Conference on Semiconductor Electronics, ICSE 2018 - Proceedings. Vol. 2018-August. Institute of Electrical and Electronics Engineers Inc. 2018. p. 104-108. 8481244 https://doi.org/10.1109/SMELEC.2018.8481244
Zawawi, Siti Aisyah ; Hamzah, Azrul Azlan ; Selvarajan, Reena Sri ; Yeop Majlis, Burhanuddin ; Mohd-Yasin, Faisal. / Dynamic behavior of condenser microphone under the influence of squeeze film damping. 2018 IEEE International Conference on Semiconductor Electronics, ICSE 2018 - Proceedings. Vol. 2018-August Institute of Electrical and Electronics Engineers Inc., 2018. pp. 104-108
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