Durability assessment of quad flat no-lead package using signal analysis

M. F M Yunoh, Shahrum Abdullah, Azman Jalar @ Jalil, L. Abdullah, M. F. Abdullah

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This paper presents a methodology to determine the durability of Quad Flat No-Lead (QFN) package. The QFN package is useful for improving the reliability of the package. A mechanical fatigue test namely three points bending cyclic test and signal analysis were proposed in this paper. The three points bending cyclic test method is a test assembly that supports a specimen on two anvils or rollers, and symmetrically loads the specimen on the opposite surface with an anvil or roller using micro-tester machine. For strain signal collection, a strain gauge was connected to the dynamic data acquisition system, and it was used for each tested QFN package for determining the response of the captured cyclic strain signal. It was found that the sinusoidal amplitude pattern of signal response has been obtained during the constant three points bending cyclic test. The obtained response signals were then analysed using the Power Spectral Density.

Original languageEnglish
Title of host publicationKey Engineering Materials
Pages236-240
Number of pages5
Volume462-463
DOIs
Publication statusPublished - 2011
Event8th International Conference on Fracture and Strength of Solids 2010, FEOFS2010 - Kuala Lumpur
Duration: 7 Jun 20109 Jun 2010

Publication series

NameKey Engineering Materials
Volume462-463
ISSN (Print)10139826

Other

Other8th International Conference on Fracture and Strength of Solids 2010, FEOFS2010
CityKuala Lumpur
Period7/6/109/6/10

Fingerprint

Signal analysis
Durability
Lead
Power spectral density
Strain gages
Data acquisition
Fatigue of materials
Elvitegravir, Cobicistat, Emtricitabine, Tenofovir Disoproxil Fumarate Drug Combination

Keywords

  • Durability
  • Power spectral density
  • QFN
  • Strain signal
  • Three point bending test

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Yunoh, M. F. M., Abdullah, S., Jalar @ Jalil, A., Abdullah, L., & Abdullah, M. F. (2011). Durability assessment of quad flat no-lead package using signal analysis. In Key Engineering Materials (Vol. 462-463, pp. 236-240). (Key Engineering Materials; Vol. 462-463). https://doi.org/10.4028/www.scientific.net/KEM.462-463.236

Durability assessment of quad flat no-lead package using signal analysis. / Yunoh, M. F M; Abdullah, Shahrum; Jalar @ Jalil, Azman; Abdullah, L.; Abdullah, M. F.

Key Engineering Materials. Vol. 462-463 2011. p. 236-240 (Key Engineering Materials; Vol. 462-463).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Yunoh, MFM, Abdullah, S, Jalar @ Jalil, A, Abdullah, L & Abdullah, MF 2011, Durability assessment of quad flat no-lead package using signal analysis. in Key Engineering Materials. vol. 462-463, Key Engineering Materials, vol. 462-463, pp. 236-240, 8th International Conference on Fracture and Strength of Solids 2010, FEOFS2010, Kuala Lumpur, 7/6/10. https://doi.org/10.4028/www.scientific.net/KEM.462-463.236
Yunoh MFM, Abdullah S, Jalar @ Jalil A, Abdullah L, Abdullah MF. Durability assessment of quad flat no-lead package using signal analysis. In Key Engineering Materials. Vol. 462-463. 2011. p. 236-240. (Key Engineering Materials). https://doi.org/10.4028/www.scientific.net/KEM.462-463.236
Yunoh, M. F M ; Abdullah, Shahrum ; Jalar @ Jalil, Azman ; Abdullah, L. ; Abdullah, M. F. / Durability assessment of quad flat no-lead package using signal analysis. Key Engineering Materials. Vol. 462-463 2011. pp. 236-240 (Key Engineering Materials).
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