Dry transfer bonding of porous silicon membranes to OSTE(+) polymer microfluidic devices

Farizah Saharil, Kristinn B. Gylfason, Yitong Liu, Tommy Haraldsson, Paolo Bettotti, Neeraj Kumar, Wouter Van Der Wijngaart

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

We present low temperature transfer bonding of porous silicon membranes to polymeric microfluidic devices, using neither adhesives nor bond surface treatment. The transfer is enabled by a novel dual cure ternary monomer system containing thiolene and epoxy. The ability of the epoxy to react with almost any dry substrate provides a very versatile fabrication method. We characterize the two stage curing mechanism, describe the device fabrication, and evaluate the bond strength.

Original languageEnglish
Title of host publicationProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Pages232-234
Number of pages3
DOIs
Publication statusPublished - 2012
Externally publishedYes
Event2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012 - Paris
Duration: 29 Jan 20122 Feb 2012

Other

Other2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012
CityParis
Period29/1/122/2/12

Fingerprint

microfluidic devices
Porous silicon
porous silicon
Microfluidics
Polymers
membranes
Membranes
Fabrication
fabrication
polymers
curing
surface treatment
adhesives
Curing
Surface treatment
Adhesives
monomers
Monomers
Substrates
Temperature

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Condensed Matter Physics
  • Electronic, Optical and Magnetic Materials

Cite this

Saharil, F., Gylfason, K. B., Liu, Y., Haraldsson, T., Bettotti, P., Kumar, N., & Van Der Wijngaart, W. (2012). Dry transfer bonding of porous silicon membranes to OSTE(+) polymer microfluidic devices. In Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS) (pp. 232-234). [6170133] https://doi.org/10.1109/MEMSYS.2012.6170133

Dry transfer bonding of porous silicon membranes to OSTE(+) polymer microfluidic devices. / Saharil, Farizah; Gylfason, Kristinn B.; Liu, Yitong; Haraldsson, Tommy; Bettotti, Paolo; Kumar, Neeraj; Van Der Wijngaart, Wouter.

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). 2012. p. 232-234 6170133.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Saharil, F, Gylfason, KB, Liu, Y, Haraldsson, T, Bettotti, P, Kumar, N & Van Der Wijngaart, W 2012, Dry transfer bonding of porous silicon membranes to OSTE(+) polymer microfluidic devices. in Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)., 6170133, pp. 232-234, 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012, Paris, 29/1/12. https://doi.org/10.1109/MEMSYS.2012.6170133
Saharil F, Gylfason KB, Liu Y, Haraldsson T, Bettotti P, Kumar N et al. Dry transfer bonding of porous silicon membranes to OSTE(+) polymer microfluidic devices. In Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). 2012. p. 232-234. 6170133 https://doi.org/10.1109/MEMSYS.2012.6170133
Saharil, Farizah ; Gylfason, Kristinn B. ; Liu, Yitong ; Haraldsson, Tommy ; Bettotti, Paolo ; Kumar, Neeraj ; Van Der Wijngaart, Wouter. / Dry transfer bonding of porous silicon membranes to OSTE(+) polymer microfluidic devices. Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). 2012. pp. 232-234
@inproceedings{e5a2cac11b5449f08e091812792bc358,
title = "Dry transfer bonding of porous silicon membranes to OSTE(+) polymer microfluidic devices",
abstract = "We present low temperature transfer bonding of porous silicon membranes to polymeric microfluidic devices, using neither adhesives nor bond surface treatment. The transfer is enabled by a novel dual cure ternary monomer system containing thiolene and epoxy. The ability of the epoxy to react with almost any dry substrate provides a very versatile fabrication method. We characterize the two stage curing mechanism, describe the device fabrication, and evaluate the bond strength.",
author = "Farizah Saharil and Gylfason, {Kristinn B.} and Yitong Liu and Tommy Haraldsson and Paolo Bettotti and Neeraj Kumar and {Van Der Wijngaart}, Wouter",
year = "2012",
doi = "10.1109/MEMSYS.2012.6170133",
language = "English",
isbn = "9781467303248",
pages = "232--234",
booktitle = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",

}

TY - GEN

T1 - Dry transfer bonding of porous silicon membranes to OSTE(+) polymer microfluidic devices

AU - Saharil, Farizah

AU - Gylfason, Kristinn B.

AU - Liu, Yitong

AU - Haraldsson, Tommy

AU - Bettotti, Paolo

AU - Kumar, Neeraj

AU - Van Der Wijngaart, Wouter

PY - 2012

Y1 - 2012

N2 - We present low temperature transfer bonding of porous silicon membranes to polymeric microfluidic devices, using neither adhesives nor bond surface treatment. The transfer is enabled by a novel dual cure ternary monomer system containing thiolene and epoxy. The ability of the epoxy to react with almost any dry substrate provides a very versatile fabrication method. We characterize the two stage curing mechanism, describe the device fabrication, and evaluate the bond strength.

AB - We present low temperature transfer bonding of porous silicon membranes to polymeric microfluidic devices, using neither adhesives nor bond surface treatment. The transfer is enabled by a novel dual cure ternary monomer system containing thiolene and epoxy. The ability of the epoxy to react with almost any dry substrate provides a very versatile fabrication method. We characterize the two stage curing mechanism, describe the device fabrication, and evaluate the bond strength.

UR - http://www.scopus.com/inward/record.url?scp=84860477442&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84860477442&partnerID=8YFLogxK

U2 - 10.1109/MEMSYS.2012.6170133

DO - 10.1109/MEMSYS.2012.6170133

M3 - Conference contribution

AN - SCOPUS:84860477442

SN - 9781467303248

SP - 232

EP - 234

BT - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

ER -