Dry adhesive bonding of nanoporous inorganic membranes to microfluidic devices using the OSTE(+) dual-cure polymer

Farizah Saharil, Fredrik Forsberg, Yitong Liu, Paolo Bettotti, Neeraj Kumar, Frank Niklaus, Tommy Haraldsson, Wouter Van Der Wijngaart, Kristinn B. Gylfason

Research output: Contribution to journalArticle

30 Citations (Scopus)

Abstract

We present two transfer bonding schemes for incorporating fragile nanoporous inorganic membranes into microdevices. Such membranes are finding increasing use in microfluidics, due to their precisely controllable nanostructure. Both schemes rely on a novel dual-cure dry adhesive bonding method, enabled by a new polymer formulation: OSTE(+), which can form bonds at room temperature. OSTE(+) is a novel dual-cure ternary monomer system containing epoxy. After the first cure, the OSTE(+) is soft and suitable for bonding, while during the second cure it stiffens and obtains a Young's modulus of 1.2 GPa. The ability of the epoxy to react with almost any dry surface provides a very versatile fabrication method. We demonstrate the transfer bonding of porous silicon and porous alumina membranes to polymeric microfluidic chips molded into OSTE(+), and of porous alumina membranes to microstructured silicon wafers, by using the OSTE(+) as a thin bonding layer. We discuss the OSTE(+) dual-cure mechanism, describe the device fabrication and evaluate the bond strength and membrane flow properties after bonding. The membranes bonded to OSTE(+) chips delaminate at 520 kPa, and the membranes bonded to silicon delaminate at 750 kPa, well above typical maximum pressures applied to microfluidic circuits. Furthermore, no change in the membrane flow resistance was observed after bonding.

Original languageEnglish
Article number025021
JournalJournal of Micromechanics and Microengineering
Volume23
Issue number2
DOIs
Publication statusPublished - Feb 2013
Externally publishedYes

Fingerprint

Microfluidics
Adhesives
Polymers
Membranes
Aluminum Oxide
Alumina
Fabrication
Porous silicon
Bond strength (materials)
Silicon
Silicon wafers
Nanostructures
Monomers
Elastic moduli
Networks (circuits)

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering
  • Mechanics of Materials
  • Electronic, Optical and Magnetic Materials

Cite this

Dry adhesive bonding of nanoporous inorganic membranes to microfluidic devices using the OSTE(+) dual-cure polymer. / Saharil, Farizah; Forsberg, Fredrik; Liu, Yitong; Bettotti, Paolo; Kumar, Neeraj; Niklaus, Frank; Haraldsson, Tommy; Van Der Wijngaart, Wouter; Gylfason, Kristinn B.

In: Journal of Micromechanics and Microengineering, Vol. 23, No. 2, 025021, 02.2013.

Research output: Contribution to journalArticle

Saharil, F, Forsberg, F, Liu, Y, Bettotti, P, Kumar, N, Niklaus, F, Haraldsson, T, Van Der Wijngaart, W & Gylfason, KB 2013, 'Dry adhesive bonding of nanoporous inorganic membranes to microfluidic devices using the OSTE(+) dual-cure polymer', Journal of Micromechanics and Microengineering, vol. 23, no. 2, 025021. https://doi.org/10.1088/0960-1317/23/2/025021
Saharil, Farizah ; Forsberg, Fredrik ; Liu, Yitong ; Bettotti, Paolo ; Kumar, Neeraj ; Niklaus, Frank ; Haraldsson, Tommy ; Van Der Wijngaart, Wouter ; Gylfason, Kristinn B. / Dry adhesive bonding of nanoporous inorganic membranes to microfluidic devices using the OSTE(+) dual-cure polymer. In: Journal of Micromechanics and Microengineering. 2013 ; Vol. 23, No. 2.
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