Directional growth behaviour of intermetallic compound of Sn3.0Ag0.5Cu/ImSn subjected to thermal cycling

Maria Abu Bakar, Azman Jalar @ Jalil, Roslina Ismail, Abdul Razak Daud

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Directional growth behavior of intermetallic compound (IMC) layer of Sn3.0Ag0.5Cu (SAC305) on immersion tin (ImSn) surface finished Cu substrate was investigated. The samples of SAC305 on ImSn/Cu substrate were subjected to thermal cycling at temperatures between 0 °C and 100 °C for 0 cycle up to 500 cycles. The cross-sectioned microstructures of soldered samples, SAC305 on ImSn/Cu were observed using optical microscope. The shape and orientation of IMC growth on the SAC305 on ImSn/Cu indicates that the orientation of IMC growth were observed to be non-uniform and dispersed throughout the solder joint with longer thermal cycling test.

Original languageEnglish
Title of host publicationMaterials Science Forum
PublisherTrans Tech Publications Ltd
Pages36-39
Number of pages4
Volume857
ISBN (Print)9783035710205
DOIs
Publication statusPublished - 2016
EventInternational Conference on Advanced Materials Engineering and Technology, ICAMET 2015 - Kaohsiung, Taiwan, Province of China
Duration: 4 Dec 20155 Dec 2015

Publication series

NameMaterials Science Forum
Volume857
ISSN (Print)02555476

Other

OtherInternational Conference on Advanced Materials Engineering and Technology, ICAMET 2015
CountryTaiwan, Province of China
CityKaohsiung
Period4/12/155/12/15

Fingerprint

Tin
Thermal cycling
submerging
Intermetallics
intermetallics
tin
cycles
thermal cycling tests
Substrates
solders
optical microscopes
Soldering alloys
Microscopes
microstructure
Microstructure
Temperature
temperature

Keywords

  • Growth behavior
  • Intermetallic
  • Lead free solder
  • Thermal cycling

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanical Engineering
  • Mechanics of Materials

Cite this

Bakar, M. A., Jalar @ Jalil, A., Ismail, R., & Daud, A. R. (2016). Directional growth behaviour of intermetallic compound of Sn3.0Ag0.5Cu/ImSn subjected to thermal cycling. In Materials Science Forum (Vol. 857, pp. 36-39). (Materials Science Forum; Vol. 857). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/MSF.857.36

Directional growth behaviour of intermetallic compound of Sn3.0Ag0.5Cu/ImSn subjected to thermal cycling. / Bakar, Maria Abu; Jalar @ Jalil, Azman; Ismail, Roslina; Daud, Abdul Razak.

Materials Science Forum. Vol. 857 Trans Tech Publications Ltd, 2016. p. 36-39 (Materials Science Forum; Vol. 857).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Bakar, MA, Jalar @ Jalil, A, Ismail, R & Daud, AR 2016, Directional growth behaviour of intermetallic compound of Sn3.0Ag0.5Cu/ImSn subjected to thermal cycling. in Materials Science Forum. vol. 857, Materials Science Forum, vol. 857, Trans Tech Publications Ltd, pp. 36-39, International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, Province of China, 4/12/15. https://doi.org/10.4028/www.scientific.net/MSF.857.36
Bakar MA, Jalar @ Jalil A, Ismail R, Daud AR. Directional growth behaviour of intermetallic compound of Sn3.0Ag0.5Cu/ImSn subjected to thermal cycling. In Materials Science Forum. Vol. 857. Trans Tech Publications Ltd. 2016. p. 36-39. (Materials Science Forum). https://doi.org/10.4028/www.scientific.net/MSF.857.36
Bakar, Maria Abu ; Jalar @ Jalil, Azman ; Ismail, Roslina ; Daud, Abdul Razak. / Directional growth behaviour of intermetallic compound of Sn3.0Ag0.5Cu/ImSn subjected to thermal cycling. Materials Science Forum. Vol. 857 Trans Tech Publications Ltd, 2016. pp. 36-39 (Materials Science Forum).
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abstract = "Directional growth behavior of intermetallic compound (IMC) layer of Sn3.0Ag0.5Cu (SAC305) on immersion tin (ImSn) surface finished Cu substrate was investigated. The samples of SAC305 on ImSn/Cu substrate were subjected to thermal cycling at temperatures between 0 °C and 100 °C for 0 cycle up to 500 cycles. The cross-sectioned microstructures of soldered samples, SAC305 on ImSn/Cu were observed using optical microscope. The shape and orientation of IMC growth on the SAC305 on ImSn/Cu indicates that the orientation of IMC growth were observed to be non-uniform and dispersed throughout the solder joint with longer thermal cycling test.",
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