Die attach film performance in 3D QFN stacked die

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

Consumer demand for smaller and lighter products in wiresless application with maximum functionality had drive the semiconductor industries toward the developement of 3-dimensional stacked die. One of the key technology is relies on die stacking process. A suitable bonding condition and material set are essential to achieve required reliability performance. This study is to relate the effects of variables bonding parameter oil the mechanical adhesion and delamination of the die attach film in QFN stacked die. Samples are deliberately built with nine combination sets of die attach parameters including bonding temperature, force and time to achieve a minimum reliability perforniance.under IPC/ JEDEC Moisture Sensitivity Level 3 at reflow 260°C. Characterisation of die attach film was carried out using differential scanning calorimetry whereas it performance was carried out using shear testing machine and scanning acoustic test (SAT) is used to detect the interfacial delamination between DAF and die. The best die attach process is characterized by stable values of die attach film thermal resistance properties and optimum touch area between die/die attach film and die attach film/die.

Original languageEnglish
Pages (from-to)104-113
Number of pages10
JournalWSEAS Transactions on Applied and Theoretical Mechanics
Volume3
Issue number3
Publication statusPublished - Mar 2008

Fingerprint

Delamination
Heat resistance
Differential scanning calorimetry
Oils
Moisture
Adhesion
Acoustics
Semiconductor materials
Scanning
Testing
Industry
Temperature

Keywords

  • Delamination
  • Die attach film
  • QFN

ASJC Scopus subject areas

  • Mechanical Engineering
  • Mechanics of Materials
  • Materials Science(all)

Cite this

Die attach film performance in 3D QFN stacked die. / Jalar @ Jalil, Azman; Rosle, M. F.; Abdul Hamid, Muhammad Azmi.

In: WSEAS Transactions on Applied and Theoretical Mechanics, Vol. 3, No. 3, 03.2008, p. 104-113.

Research output: Contribution to journalArticle

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