Dicing laminated wafer for QFN 3D stacked die packaging

Shahrum Abdullah, Z. Endut, I. Ahmad, Azman Jalar @ Jalil, S. M. Yusof

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Nowadays, die attach film (DAF) gaining popularity in microelectronic packaging as integral part in facilitating the growth of wafer level packaging and stacked die packaging. DAF applied to the backside of wafers prior to saw have many advantages, such as the elimination of the epoxy dispensed process step and the reduction of epoxy related failure mode. However, the dicing process for DAF wafer usually associated with sidewall chipping, DAF whiskering and crack that will affect reliability of Quad Flat Non-Leaded (QFN) stacked die. Blade properties and characteristics are the crucial factor in analyzing the DAF dicing results. In this paper, we evaluate the blade characteristics before and after DAF wafer dicing process for our stacked die packaging. The qualitative measure by means of the Scanning Electron Microscope (SEM) and Energy Dispersive X-Ray (EDX) analysis were performed in order to understand the lamination and dulling effect on blade surface. The obtained results showed that sawing polymeric material such as wafer laminated with DAF induces lamination of polymeric material onto the blade surface and reduce blade cutting edge. As a result, reduce the quality of DAF dicing process.

Original languageEnglish
Title of host publicationAdvanced Materials Research
Pages202-205
Number of pages4
Volume31
DOIs
Publication statusPublished - 2008
EventInternational Conference on Materials for Advanced Technologies, ICMAT 2007 -
Duration: 1 Jul 20076 Jul 2007

Publication series

NameAdvanced Materials Research
Volume31
ISSN (Print)10226680

Other

OtherInternational Conference on Materials for Advanced Technologies, ICMAT 2007
Period1/7/076/7/07

Fingerprint

Packaging
Sawing
Energy dispersive X ray analysis
Polymers
Microelectronics
Failure modes
Electron microscopes
Cracks
Scanning

Keywords

  • Blade
  • Dicing
  • Die attach film
  • Surface analysis

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Abdullah, S., Endut, Z., Ahmad, I., Jalar @ Jalil, A., & Yusof, S. M. (2008). Dicing laminated wafer for QFN 3D stacked die packaging. In Advanced Materials Research (Vol. 31, pp. 202-205). (Advanced Materials Research; Vol. 31). https://doi.org/10.4028/0-87849-471-5.202

Dicing laminated wafer for QFN 3D stacked die packaging. / Abdullah, Shahrum; Endut, Z.; Ahmad, I.; Jalar @ Jalil, Azman; Yusof, S. M.

Advanced Materials Research. Vol. 31 2008. p. 202-205 (Advanced Materials Research; Vol. 31).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abdullah, S, Endut, Z, Ahmad, I, Jalar @ Jalil, A & Yusof, SM 2008, Dicing laminated wafer for QFN 3D stacked die packaging. in Advanced Materials Research. vol. 31, Advanced Materials Research, vol. 31, pp. 202-205, International Conference on Materials for Advanced Technologies, ICMAT 2007, 1/7/07. https://doi.org/10.4028/0-87849-471-5.202
Abdullah S, Endut Z, Ahmad I, Jalar @ Jalil A, Yusof SM. Dicing laminated wafer for QFN 3D stacked die packaging. In Advanced Materials Research. Vol. 31. 2008. p. 202-205. (Advanced Materials Research). https://doi.org/10.4028/0-87849-471-5.202
Abdullah, Shahrum ; Endut, Z. ; Ahmad, I. ; Jalar @ Jalil, Azman ; Yusof, S. M. / Dicing laminated wafer for QFN 3D stacked die packaging. Advanced Materials Research. Vol. 31 2008. pp. 202-205 (Advanced Materials Research).
@inproceedings{6c96fa765e79473fa3e221a33b9b89a4,
title = "Dicing laminated wafer for QFN 3D stacked die packaging",
abstract = "Nowadays, die attach film (DAF) gaining popularity in microelectronic packaging as integral part in facilitating the growth of wafer level packaging and stacked die packaging. DAF applied to the backside of wafers prior to saw have many advantages, such as the elimination of the epoxy dispensed process step and the reduction of epoxy related failure mode. However, the dicing process for DAF wafer usually associated with sidewall chipping, DAF whiskering and crack that will affect reliability of Quad Flat Non-Leaded (QFN) stacked die. Blade properties and characteristics are the crucial factor in analyzing the DAF dicing results. In this paper, we evaluate the blade characteristics before and after DAF wafer dicing process for our stacked die packaging. The qualitative measure by means of the Scanning Electron Microscope (SEM) and Energy Dispersive X-Ray (EDX) analysis were performed in order to understand the lamination and dulling effect on blade surface. The obtained results showed that sawing polymeric material such as wafer laminated with DAF induces lamination of polymeric material onto the blade surface and reduce blade cutting edge. As a result, reduce the quality of DAF dicing process.",
keywords = "Blade, Dicing, Die attach film, Surface analysis",
author = "Shahrum Abdullah and Z. Endut and I. Ahmad and {Jalar @ Jalil}, Azman and Yusof, {S. M.}",
year = "2008",
doi = "10.4028/0-87849-471-5.202",
language = "English",
isbn = "0878494715",
volume = "31",
series = "Advanced Materials Research",
pages = "202--205",
booktitle = "Advanced Materials Research",

}

TY - GEN

T1 - Dicing laminated wafer for QFN 3D stacked die packaging

AU - Abdullah, Shahrum

AU - Endut, Z.

AU - Ahmad, I.

AU - Jalar @ Jalil, Azman

AU - Yusof, S. M.

PY - 2008

Y1 - 2008

N2 - Nowadays, die attach film (DAF) gaining popularity in microelectronic packaging as integral part in facilitating the growth of wafer level packaging and stacked die packaging. DAF applied to the backside of wafers prior to saw have many advantages, such as the elimination of the epoxy dispensed process step and the reduction of epoxy related failure mode. However, the dicing process for DAF wafer usually associated with sidewall chipping, DAF whiskering and crack that will affect reliability of Quad Flat Non-Leaded (QFN) stacked die. Blade properties and characteristics are the crucial factor in analyzing the DAF dicing results. In this paper, we evaluate the blade characteristics before and after DAF wafer dicing process for our stacked die packaging. The qualitative measure by means of the Scanning Electron Microscope (SEM) and Energy Dispersive X-Ray (EDX) analysis were performed in order to understand the lamination and dulling effect on blade surface. The obtained results showed that sawing polymeric material such as wafer laminated with DAF induces lamination of polymeric material onto the blade surface and reduce blade cutting edge. As a result, reduce the quality of DAF dicing process.

AB - Nowadays, die attach film (DAF) gaining popularity in microelectronic packaging as integral part in facilitating the growth of wafer level packaging and stacked die packaging. DAF applied to the backside of wafers prior to saw have many advantages, such as the elimination of the epoxy dispensed process step and the reduction of epoxy related failure mode. However, the dicing process for DAF wafer usually associated with sidewall chipping, DAF whiskering and crack that will affect reliability of Quad Flat Non-Leaded (QFN) stacked die. Blade properties and characteristics are the crucial factor in analyzing the DAF dicing results. In this paper, we evaluate the blade characteristics before and after DAF wafer dicing process for our stacked die packaging. The qualitative measure by means of the Scanning Electron Microscope (SEM) and Energy Dispersive X-Ray (EDX) analysis were performed in order to understand the lamination and dulling effect on blade surface. The obtained results showed that sawing polymeric material such as wafer laminated with DAF induces lamination of polymeric material onto the blade surface and reduce blade cutting edge. As a result, reduce the quality of DAF dicing process.

KW - Blade

KW - Dicing

KW - Die attach film

KW - Surface analysis

UR - http://www.scopus.com/inward/record.url?scp=45749129481&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=45749129481&partnerID=8YFLogxK

U2 - 10.4028/0-87849-471-5.202

DO - 10.4028/0-87849-471-5.202

M3 - Conference contribution

SN - 0878494715

SN - 9780878494712

VL - 31

T3 - Advanced Materials Research

SP - 202

EP - 205

BT - Advanced Materials Research

ER -