Development of Tire Condition Monitoring System (TCMS) based on MEMS sensors

Willy Tjiu, Ali Ahanchian, Burhanuddin Yeop Majlis

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

The design and demonstration system of Tire Condition Monitoring System (TCMS) is presented. MEMS sensors such as pressure sensor, accelerometer, and temperature sensor are used to measure pressure, vibration, and temperature of the tire. The characteristics of the sensors were observed. Based on the sensors output characteristics, necessary amplification schematic was made for the demonstration system. For the data acquisition, National Instruments Educational Laboratory Virtual Instrumentation Suite (NI ELVIS) bench-top workstation is used. The information obtained was passed to a computer for human interface.

Original languageEnglish
Title of host publicationProceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics
Pages350-353
Number of pages4
Publication statusPublished - 2004
Event2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004 - Kuala Lumpur
Duration: 4 Dec 20049 Dec 2004

Other

Other2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004
CityKuala Lumpur
Period4/12/049/12/04

Fingerprint

Condition monitoring
Tires
MEMS
Sensors
Demonstrations
Schematic diagrams
Pressure sensors
Temperature sensors
Accelerometers
Interfaces (computer)
Amplification
Data acquisition
Temperature

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Tjiu, W., Ahanchian, A., & Yeop Majlis, B. (2004). Development of Tire Condition Monitoring System (TCMS) based on MEMS sensors. In Proceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics (pp. 350-353). [1620903]

Development of Tire Condition Monitoring System (TCMS) based on MEMS sensors. / Tjiu, Willy; Ahanchian, Ali; Yeop Majlis, Burhanuddin.

Proceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics. 2004. p. 350-353 1620903.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Tjiu, W, Ahanchian, A & Yeop Majlis, B 2004, Development of Tire Condition Monitoring System (TCMS) based on MEMS sensors. in Proceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics., 1620903, pp. 350-353, 2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004, Kuala Lumpur, 4/12/04.
Tjiu W, Ahanchian A, Yeop Majlis B. Development of Tire Condition Monitoring System (TCMS) based on MEMS sensors. In Proceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics. 2004. p. 350-353. 1620903
Tjiu, Willy ; Ahanchian, Ali ; Yeop Majlis, Burhanuddin. / Development of Tire Condition Monitoring System (TCMS) based on MEMS sensors. Proceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics. 2004. pp. 350-353
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