Development of a CMOS-compatible electrostatically actuated diaphragm chamber for micropump application

Hing Wah Lee, Muhamad Ramdzan Buyong, Mohd Ismahadi Syono, Ishak Hj Abd Azid

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents the development of a diaphragm chamber actuated electrostatically utilizing CMOS-compatible silicon micromachining fabrication process. The process consists of six photolithography steps and five chemical vapor depositions. Etching of the sacrificial oxide layer for the diaphragm chamber is achieved using etch-release holes perforated on the diaphragm, similar to via holes used in IC-fabrication method. From the analysis, the best encapsulation has been successfully demonstrated by growing LPCVD silicon nitride of thickness 0.9μm. Accomplishing this feat enables electrostatically actuated diaphragm chamber to be developed and in particular, will spur advancement in the development of a CMOS-compatible electrostatically actuated diaphragm micropump.

Original languageEnglish
Title of host publicationInternational Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT
Pages2500-2503
Number of pages4
DOIs
Publication statusPublished - 2008
Externally publishedYes
Event2008 9th International Conference on Solid-State and Integrated-Circuit Technology, ICSICT 2008 - Beijing
Duration: 20 Oct 200823 Oct 2008

Other

Other2008 9th International Conference on Solid-State and Integrated-Circuit Technology, ICSICT 2008
CityBeijing
Period20/10/0823/10/08

Fingerprint

diaphragms
Diaphragms
CMOS
chambers
Fabrication
fabrication
Micromachining
Photolithography
Silicon
micromachining
photolithography
Silicon nitride
Encapsulation
silicon nitrides
Oxides
Chemical vapor deposition
Etching
etching
vapor deposition
oxides

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics
  • Electronic, Optical and Magnetic Materials

Cite this

Lee, H. W., Buyong, M. R., Syono, M. I., & Azid, I. H. A. (2008). Development of a CMOS-compatible electrostatically actuated diaphragm chamber for micropump application. In International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT (pp. 2500-2503). [4735079] https://doi.org/10.1109/ICSICT.2008.4735079

Development of a CMOS-compatible electrostatically actuated diaphragm chamber for micropump application. / Lee, Hing Wah; Buyong, Muhamad Ramdzan; Syono, Mohd Ismahadi; Azid, Ishak Hj Abd.

International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT. 2008. p. 2500-2503 4735079.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Lee, HW, Buyong, MR, Syono, MI & Azid, IHA 2008, Development of a CMOS-compatible electrostatically actuated diaphragm chamber for micropump application. in International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT., 4735079, pp. 2500-2503, 2008 9th International Conference on Solid-State and Integrated-Circuit Technology, ICSICT 2008, Beijing, 20/10/08. https://doi.org/10.1109/ICSICT.2008.4735079
Lee HW, Buyong MR, Syono MI, Azid IHA. Development of a CMOS-compatible electrostatically actuated diaphragm chamber for micropump application. In International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT. 2008. p. 2500-2503. 4735079 https://doi.org/10.1109/ICSICT.2008.4735079
Lee, Hing Wah ; Buyong, Muhamad Ramdzan ; Syono, Mohd Ismahadi ; Azid, Ishak Hj Abd. / Development of a CMOS-compatible electrostatically actuated diaphragm chamber for micropump application. International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT. 2008. pp. 2500-2503
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