Design, fabrication and testing of sandwich coupled inductors

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1 Citation (Scopus)

Abstract

A planar coupled inductor having sandwich coil structure is fabricated using MEMS microfabrication techniques. The structure of the inductor coil is designed to achieve high coupling and high winding number with arelatively small coil area. In this work, the structure is fabricated by bonding two planar on-chip coil fabricated on two different substrates. This method can replace the conventional via connections that cause various problems in output pads interconnection. The functionality of the fabricated device was tested, while the basic characteristics of the fabricated coil were measured at wide range of operating frequency using cascade GSG probe and compared with the simulation. For measurements up to 1 GHz, three resonance frequencies, inductance of 35 nH and resistance of as low as 25 ω were observed. The results show that the proposed technique is a promising alternative method for fabricating a simple and cost effective 3-≪ coupled inductors.

Original languageEnglish
Pages (from-to)739-744
Number of pages6
JournalMicrosystem Technologies
Volume18
Issue number6
DOIs
Publication statusPublished - Jun 2012

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Microfabrication
inductors
Inductance
MEMS
coils
Fabrication
fabrication
Testing
Substrates
Costs
inductance
microelectromechanical systems
cascades
chips
costs
probes
causes
output
simulation

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Hardware and Architecture
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

Cite this

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title = "Design, fabrication and testing of sandwich coupled inductors",
abstract = "A planar coupled inductor having sandwich coil structure is fabricated using MEMS microfabrication techniques. The structure of the inductor coil is designed to achieve high coupling and high winding number with arelatively small coil area. In this work, the structure is fabricated by bonding two planar on-chip coil fabricated on two different substrates. This method can replace the conventional via connections that cause various problems in output pads interconnection. The functionality of the fabricated device was tested, while the basic characteristics of the fabricated coil were measured at wide range of operating frequency using cascade GSG probe and compared with the simulation. For measurements up to 1 GHz, three resonance frequencies, inductance of 35 nH and resistance of as low as 25 ω were observed. The results show that the proposed technique is a promising alternative method for fabricating a simple and cost effective 3-≪ coupled inductors.",
author = "Jumril Yunas and {Yeop Majlis}, Burhanuddin and Hamzah, {Azrul Azlan} and Badariah Bais",
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T1 - Design, fabrication and testing of sandwich coupled inductors

AU - Yunas, Jumril

AU - Yeop Majlis, Burhanuddin

AU - Hamzah, Azrul Azlan

AU - Bais, Badariah

PY - 2012/6

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N2 - A planar coupled inductor having sandwich coil structure is fabricated using MEMS microfabrication techniques. The structure of the inductor coil is designed to achieve high coupling and high winding number with arelatively small coil area. In this work, the structure is fabricated by bonding two planar on-chip coil fabricated on two different substrates. This method can replace the conventional via connections that cause various problems in output pads interconnection. The functionality of the fabricated device was tested, while the basic characteristics of the fabricated coil were measured at wide range of operating frequency using cascade GSG probe and compared with the simulation. For measurements up to 1 GHz, three resonance frequencies, inductance of 35 nH and resistance of as low as 25 ω were observed. The results show that the proposed technique is a promising alternative method for fabricating a simple and cost effective 3-≪ coupled inductors.

AB - A planar coupled inductor having sandwich coil structure is fabricated using MEMS microfabrication techniques. The structure of the inductor coil is designed to achieve high coupling and high winding number with arelatively small coil area. In this work, the structure is fabricated by bonding two planar on-chip coil fabricated on two different substrates. This method can replace the conventional via connections that cause various problems in output pads interconnection. The functionality of the fabricated device was tested, while the basic characteristics of the fabricated coil were measured at wide range of operating frequency using cascade GSG probe and compared with the simulation. For measurements up to 1 GHz, three resonance frequencies, inductance of 35 nH and resistance of as low as 25 ω were observed. The results show that the proposed technique is a promising alternative method for fabricating a simple and cost effective 3-≪ coupled inductors.

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