Abstract
This study presents the deposition of micro contact probe cell for IC testing deposited by dc sputtering technique on a glass substrate. Micro contact with thickness of 2800-7000 nm were deposited from Copper target at sputtering power of 125 W in argon ambient at a room temperature on a base layer of copper using mask. Then, the micro contacts were investigated by using profilometer. All the obtained results show the potential viability of the novel test fixture and thus solve the limitation of the pogo pin based testing tools by replacing them with the novel IC test fixture as demonstrated in this study.
| Original language | English |
|---|---|
| Pages (from-to) | 2701-2704 |
| Number of pages | 4 |
| Journal | Research Journal of Applied Sciences, Engineering and Technology |
| Volume | 7 |
| Issue number | 13 |
| Publication status | Published - 2014 |
Fingerprint
Keywords
- DC sputtering deposition
- Micro contact
- Pogo pin
- Test socket
ASJC Scopus subject areas
- Engineering(all)
- Computer Science(all)
Cite this
Deposition of micro contact based probe cell for IC testing by Dc magnetron sputtering technique. / Idris, M. Idzdihar; Amin, Nowshad; Arith, Faiz; Chachuli, S. A M.
In: Research Journal of Applied Sciences, Engineering and Technology, Vol. 7, No. 13, 2014, p. 2701-2704.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Deposition of micro contact based probe cell for IC testing by Dc magnetron sputtering technique
AU - Idris, M. Idzdihar
AU - Amin, Nowshad
AU - Arith, Faiz
AU - Chachuli, S. A M
PY - 2014
Y1 - 2014
N2 - This study presents the deposition of micro contact probe cell for IC testing deposited by dc sputtering technique on a glass substrate. Micro contact with thickness of 2800-7000 nm were deposited from Copper target at sputtering power of 125 W in argon ambient at a room temperature on a base layer of copper using mask. Then, the micro contacts were investigated by using profilometer. All the obtained results show the potential viability of the novel test fixture and thus solve the limitation of the pogo pin based testing tools by replacing them with the novel IC test fixture as demonstrated in this study.
AB - This study presents the deposition of micro contact probe cell for IC testing deposited by dc sputtering technique on a glass substrate. Micro contact with thickness of 2800-7000 nm were deposited from Copper target at sputtering power of 125 W in argon ambient at a room temperature on a base layer of copper using mask. Then, the micro contacts were investigated by using profilometer. All the obtained results show the potential viability of the novel test fixture and thus solve the limitation of the pogo pin based testing tools by replacing them with the novel IC test fixture as demonstrated in this study.
KW - DC sputtering deposition
KW - Micro contact
KW - Pogo pin
KW - Test socket
UR - http://www.scopus.com/inward/record.url?scp=84899132462&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84899132462&partnerID=8YFLogxK
M3 - Article
VL - 7
SP - 2701
EP - 2704
JO - Research Journal of Applied Sciences, Engineering and Technology
JF - Research Journal of Applied Sciences, Engineering and Technology
SN - 2040-7459
IS - 13
ER -