Deflection analysis of epitaxially deposited polysilicon encapsulation for MEMS devices

Research output: Chapter in Book/Report/Conference proceedingConference contribution

15 Citations (Scopus)

Abstract

Numerical and simulation studies are done to determine deflection behavior of epitaxially deposited polysilicon encapsulation. Polysilicon encapsulation, which is used as physical protection for moving parts of MEMS devices, is applied with external pressure to replicate packaging processes. Polysilicon encapsulations of thickness 10, 20, 30, and 40 micron with seal oxide of thickness 2, 4, 6, 8, and 10 micron are analyzed. Ritz's and energy methods are used to numerically approximate surface deflection of polysilicon encapsulation when perpendicularly loaded with a uniform pressure varying from 10 to 100 atm. Simulation was done using CoventorWare ver.2001.3 software. It is observed that numerical analysis values approximate theoretical values for small deflection (W<t). Thus, numerical analysis could be use to predict deflection behavior of encapsulation in that region.

Original languageEnglish
Title of host publicationProceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics
Pages611-614
Number of pages4
Publication statusPublished - 2004
Event2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004 - Kuala Lumpur
Duration: 4 Dec 20049 Dec 2004

Other

Other2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004
CityKuala Lumpur
Period4/12/049/12/04

Fingerprint

Encapsulation
Polysilicon
MEMS
Numerical analysis
Seals
Packaging
Oxides

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Hamzah, A. A., Yeop Majlis, B., & Ahmad, I. (2004). Deflection analysis of epitaxially deposited polysilicon encapsulation for MEMS devices. In Proceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics (pp. 611-614). [1620960]

Deflection analysis of epitaxially deposited polysilicon encapsulation for MEMS devices. / Hamzah, Azrul Azlan; Yeop Majlis, Burhanuddin; Ahmad, Ibrahim.

Proceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics. 2004. p. 611-614 1620960.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Hamzah, AA, Yeop Majlis, B & Ahmad, I 2004, Deflection analysis of epitaxially deposited polysilicon encapsulation for MEMS devices. in Proceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics., 1620960, pp. 611-614, 2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004, Kuala Lumpur, 4/12/04.
Hamzah AA, Yeop Majlis B, Ahmad I. Deflection analysis of epitaxially deposited polysilicon encapsulation for MEMS devices. In Proceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics. 2004. p. 611-614. 1620960
Hamzah, Azrul Azlan ; Yeop Majlis, Burhanuddin ; Ahmad, Ibrahim. / Deflection analysis of epitaxially deposited polysilicon encapsulation for MEMS devices. Proceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics. 2004. pp. 611-614
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