Cratering on thermosonic copper wire ball bonding

Tan Chee Wei, Abdul Razak Daud

    Research output: Contribution to journalArticle

    20 Citations (Scopus)

    Abstract

    Copper wire bonding offers several mechanical and electrical advantages as well as cost saving compared to its gold wire predecessor. Despite these benefits, silicon cratering, which completes the fracture and removal of bond pad underlayers, has been a major hurdle to overcome in copper wire bonding. Copper wire is harder than gold, and thus needs greater ultrasonic power and bond force to bond it onto metal pads such as aluminum. This paper reports a study on the influence of wire materials, bond pad hardness, and bonding-machine parameters (i.e., ultrasonic power and bond force) on silicon cratering phenomenon. Ultrasonic power and z-axis bond force were identified as the most critical bonding machine parameters in silicon cratering defects. A combination of greater bond force and lower ultrasonic power avoids silicon cratering and gives the desired effects. Results also show that a harder bond pad provides relatively good protection from silicon cratering.

    Original languageEnglish
    Pages (from-to)283-287
    Number of pages5
    JournalJournal of Materials Engineering and Performance
    Volume11
    Issue number3
    DOIs
    Publication statusPublished - Jun 2002

    Fingerprint

    Silicon
    Copper
    Wire
    Ultrasonics
    Gold
    Aluminum
    Metals
    Hardness
    Defects
    Costs

    Keywords

    • Bond force
    • Copper wire bonding
    • Silicon cratering
    • Ultrasonic power

    ASJC Scopus subject areas

    • Materials Science(all)

    Cite this

    Cratering on thermosonic copper wire ball bonding. / Wei, Tan Chee; Daud, Abdul Razak.

    In: Journal of Materials Engineering and Performance, Vol. 11, No. 3, 06.2002, p. 283-287.

    Research output: Contribution to journalArticle

    Wei, Tan Chee ; Daud, Abdul Razak. / Cratering on thermosonic copper wire ball bonding. In: Journal of Materials Engineering and Performance. 2002 ; Vol. 11, No. 3. pp. 283-287.
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