Correlation of microstructural evolution and hardness properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) lead-free solder under blast wave condition

Wan Yusmawati Wan Yusoff, Norliza Ismail, Nur Shafiqa Safee, Ariffin Ismail, Azman Jalar @ Jalil, Maria Abu Bakar

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Purpose: The purpose of this paper is to discuss the effect of a blast wave on the microstructure, intermetallic layers and hardness properties of Sn0.3Ag0.7Cu (SAC0307) lead-free solder. Design/methodology/approach: Soldered samples were exposed to the blast wave by using trinitrotoluene (TNT) explosive. Microstructure and intermetallic layer thickness were identified using Alicona ® Infinite Focus Measurement software. Hardness properties of investigated solders were determined using a nanoindentation approach. Findings: Microstructure and intermetallic layers changed under blast wave condition. Hardness properties of exposed solders decreased with an increase in the TNT explosive weight. Originality/value: Microstructural evolution and mechanical properties of the exposed solder to the blast wave provide a fundamental understanding on how blast waves can affect the reliability of a solder joint, especially for military applications.

Original languageEnglish
Pages (from-to)102-108
Number of pages7
JournalSoldering and Surface Mount Technology
Volume31
Issue number2
DOIs
Publication statusPublished - 1 Apr 2019

Fingerprint

Microstructural evolution
blasts
solders
hardness
Soldering alloys
Hardness
Trinitrotoluene
Intermetallics
intermetallics
trinitrotoluene
microstructure
Microstructure
Military applications
Nanoindentation
nanoindentation
Lead-free solders
mechanical properties
methodology
computer programs
Mechanical properties

Keywords

  • Blast wave
  • Hardness properties
  • Intermetallic layers
  • Microstructure
  • Sn-Ag-Cu solder

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Cite this

Correlation of microstructural evolution and hardness properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) lead-free solder under blast wave condition. / Wan Yusoff, Wan Yusmawati; Ismail, Norliza; Safee, Nur Shafiqa; Ismail, Ariffin; Jalar @ Jalil, Azman; Abu Bakar, Maria.

In: Soldering and Surface Mount Technology, Vol. 31, No. 2, 01.04.2019, p. 102-108.

Research output: Contribution to journalArticle

Wan Yusoff, Wan Yusmawati ; Ismail, Norliza ; Safee, Nur Shafiqa ; Ismail, Ariffin ; Jalar @ Jalil, Azman ; Abu Bakar, Maria. / Correlation of microstructural evolution and hardness properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) lead-free solder under blast wave condition. In: Soldering and Surface Mount Technology. 2019 ; Vol. 31, No. 2. pp. 102-108.
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AU - Safee, Nur Shafiqa

AU - Ismail, Ariffin

AU - Jalar @ Jalil, Azman

AU - Abu Bakar, Maria

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