Correlation between intermetallic thickness and roughness during solder reflow

A. S. Zuruzi, S. K. Lahiri, P. Burman, Kim Shyong Siow

Research output: Contribution to journalArticle

13 Citations (Scopus)

Abstract

The evolution of Cu-Sn and Ni-Sn intermetallic compound (IM) morphologies during isochronal reflow of a PbSn solder with Cu and electroless-Ni was investigated. The root mean square roughness of the Cu-Sn and Ni-Sn IM layers exhibited a linear dependence on average thickness, with gradients () of 0.33 and 0.65, respectively. The difference in values was attributed to different thickness distributions resulting from morphological dissimilarity of the IM layers. The apparent activation energies for growth and roughness evolution of both IM were found to be similar and suggest that both IM thickness and roughness evolution are controlled by the same mechanism.

Original languageEnglish
Pages (from-to)997-1000
Number of pages4
JournalJournal of Electronic Materials
Volume30
Issue number8
DOIs
Publication statusPublished - Aug 2001
Externally publishedYes

Fingerprint

solders
Soldering alloys
Intermetallics
intermetallics
roughness
Surface roughness
Activation energy
activation energy
gradients

Keywords

  • Intermetallic
  • roughness
  • solders

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)
  • Electronic, Optical and Magnetic Materials
  • Materials Science(all)
  • Electrical and Electronic Engineering

Cite this

Correlation between intermetallic thickness and roughness during solder reflow. / Zuruzi, A. S.; Lahiri, S. K.; Burman, P.; Siow, Kim Shyong.

In: Journal of Electronic Materials, Vol. 30, No. 8, 08.2001, p. 997-1000.

Research output: Contribution to journalArticle

Zuruzi, A. S. ; Lahiri, S. K. ; Burman, P. ; Siow, Kim Shyong. / Correlation between intermetallic thickness and roughness during solder reflow. In: Journal of Electronic Materials. 2001 ; Vol. 30, No. 8. pp. 997-1000.
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