Copper(II) and aluminium(III) ion sensors based on gold nanoparticles modified screen-printed carbon electrodes

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Disposal Copper (II) and aluminium (III) sensors based on gold nanoparticles-modified screen-printed carbon electrode were fabricated. The copper ion sensor was fabricated by attaching gold nanoparticles onto the surface of screen-printed carbon electrode through seed mediated growth method followed by assembly of L-cysteine. The aluminium ion sensor was fabricated by attaching gold nanoparticles onto the surface of screen-printed electrode through drop-coating method followed by self-assembly of mercaptosuccinic acid. As demonstrated by differential pulse voltammeter, both sensors exhibited high sensitivity towards copper (II) or aluminium (III) ions down to ppb (parts per billion) levels. Electrochemical behavior of gold nanoparticles attached onto the surface of screen-printed carbon was investigated in details in order to obtain optimum performance for both sensors.

Original languageEnglish
Title of host publicationAIP Conference Proceedings
Pages725-731
Number of pages7
Volume1571
DOIs
Publication statusPublished - 2013
Event2013 UKM Faculty of Science and Technology Post-Graduate Colloquium - Selangor
Duration: 3 Jul 20134 Jul 2013

Other

Other2013 UKM Faculty of Science and Technology Post-Graduate Colloquium
CitySelangor
Period3/7/134/7/13

Fingerprint

gold
aluminum
copper
nanoparticles
electrodes
carbon
sensors
ions
cysteine
disposal
coating
self assembly
seeds
assembly
acids
sensitivity
pulses

Keywords

  • Aluminium
  • Copper
  • Differential pulse voltammetry
  • Gold nanoparticles

ASJC Scopus subject areas

  • Physics and Astronomy(all)

Cite this

Copper(II) and aluminium(III) ion sensors based on gold nanoparticles modified screen-printed carbon electrodes. / See, Wong Pooi; Nathan, Sheila; Lee, Yook Heng.

AIP Conference Proceedings. Vol. 1571 2013. p. 725-731.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

See, WP, Nathan, S & Lee, YH 2013, Copper(II) and aluminium(III) ion sensors based on gold nanoparticles modified screen-printed carbon electrodes. in AIP Conference Proceedings. vol. 1571, pp. 725-731, 2013 UKM Faculty of Science and Technology Post-Graduate Colloquium, Selangor, 3/7/13. https://doi.org/10.1063/1.4858740
@inproceedings{409a0dd0138d45a184798df8663f87af,
title = "Copper(II) and aluminium(III) ion sensors based on gold nanoparticles modified screen-printed carbon electrodes",
abstract = "Disposal Copper (II) and aluminium (III) sensors based on gold nanoparticles-modified screen-printed carbon electrode were fabricated. The copper ion sensor was fabricated by attaching gold nanoparticles onto the surface of screen-printed carbon electrode through seed mediated growth method followed by assembly of L-cysteine. The aluminium ion sensor was fabricated by attaching gold nanoparticles onto the surface of screen-printed electrode through drop-coating method followed by self-assembly of mercaptosuccinic acid. As demonstrated by differential pulse voltammeter, both sensors exhibited high sensitivity towards copper (II) or aluminium (III) ions down to ppb (parts per billion) levels. Electrochemical behavior of gold nanoparticles attached onto the surface of screen-printed carbon was investigated in details in order to obtain optimum performance for both sensors.",
keywords = "Aluminium, Copper, Differential pulse voltammetry, Gold nanoparticles",
author = "See, {Wong Pooi} and Sheila Nathan and Lee, {Yook Heng}",
year = "2013",
doi = "10.1063/1.4858740",
language = "English",
isbn = "9780735411999",
volume = "1571",
pages = "725--731",
booktitle = "AIP Conference Proceedings",

}

TY - GEN

T1 - Copper(II) and aluminium(III) ion sensors based on gold nanoparticles modified screen-printed carbon electrodes

AU - See, Wong Pooi

AU - Nathan, Sheila

AU - Lee, Yook Heng

PY - 2013

Y1 - 2013

N2 - Disposal Copper (II) and aluminium (III) sensors based on gold nanoparticles-modified screen-printed carbon electrode were fabricated. The copper ion sensor was fabricated by attaching gold nanoparticles onto the surface of screen-printed carbon electrode through seed mediated growth method followed by assembly of L-cysteine. The aluminium ion sensor was fabricated by attaching gold nanoparticles onto the surface of screen-printed electrode through drop-coating method followed by self-assembly of mercaptosuccinic acid. As demonstrated by differential pulse voltammeter, both sensors exhibited high sensitivity towards copper (II) or aluminium (III) ions down to ppb (parts per billion) levels. Electrochemical behavior of gold nanoparticles attached onto the surface of screen-printed carbon was investigated in details in order to obtain optimum performance for both sensors.

AB - Disposal Copper (II) and aluminium (III) sensors based on gold nanoparticles-modified screen-printed carbon electrode were fabricated. The copper ion sensor was fabricated by attaching gold nanoparticles onto the surface of screen-printed carbon electrode through seed mediated growth method followed by assembly of L-cysteine. The aluminium ion sensor was fabricated by attaching gold nanoparticles onto the surface of screen-printed electrode through drop-coating method followed by self-assembly of mercaptosuccinic acid. As demonstrated by differential pulse voltammeter, both sensors exhibited high sensitivity towards copper (II) or aluminium (III) ions down to ppb (parts per billion) levels. Electrochemical behavior of gold nanoparticles attached onto the surface of screen-printed carbon was investigated in details in order to obtain optimum performance for both sensors.

KW - Aluminium

KW - Copper

KW - Differential pulse voltammetry

KW - Gold nanoparticles

UR - http://www.scopus.com/inward/record.url?scp=84897806619&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84897806619&partnerID=8YFLogxK

U2 - 10.1063/1.4858740

DO - 10.1063/1.4858740

M3 - Conference contribution

SN - 9780735411999

VL - 1571

SP - 725

EP - 731

BT - AIP Conference Proceedings

ER -