Convex-corner undercutting on corrugated diaphragm

Norhayati Soin, Burhanuddin Yeop Majlis

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

KOH process simulation etching of corrugated diaphragm with bossed structure on silicon (100) is presented with emphasis on convex corner behavior. The influence of the KOH etching temperature and concentration on the convex corner undercutting of corrugated diaphragm are observed. The convex corner behavior is analyzed based on the geometrical parameters and the new emergent high index silicon planes. It was found that the convex corner undercutting phenomena is significantly reduced at low etching temperature and high KOH concentration respectively.

Original languageEnglish
Title of host publicationProceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics
Pages393-399
Number of pages7
Publication statusPublished - 2004
Event2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004 - Kuala Lumpur
Duration: 4 Dec 20049 Dec 2004

Other

Other2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004
CityKuala Lumpur
Period4/12/049/12/04

Fingerprint

Diaphragms
Etching
Silicon
Temperature

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Soin, N., & Yeop Majlis, B. (2004). Convex-corner undercutting on corrugated diaphragm. In Proceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics (pp. 393-399). [1620912]

Convex-corner undercutting on corrugated diaphragm. / Soin, Norhayati; Yeop Majlis, Burhanuddin.

Proceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics. 2004. p. 393-399 1620912.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soin, N & Yeop Majlis, B 2004, Convex-corner undercutting on corrugated diaphragm. in Proceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics., 1620912, pp. 393-399, 2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004, Kuala Lumpur, 4/12/04.
Soin N, Yeop Majlis B. Convex-corner undercutting on corrugated diaphragm. In Proceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics. 2004. p. 393-399. 1620912
Soin, Norhayati ; Yeop Majlis, Burhanuddin. / Convex-corner undercutting on corrugated diaphragm. Proceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics. 2004. pp. 393-399
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