Pengawalan pertumbuhan sebatian antara logam sambungan pateri-papan litar bercetak menggunakan salutan nikel

Translated title of the contribution: Controlling of intermetallic compound solder interconnection-printed circuit board using nickel coating

Maria Abu Bakar, Azman Jalar @ Jalil, Mohd Zulkifly Abdullah, Najib Saedi Ibrahim, Mohd Ariffin Ambak

Research output: Contribution to journalArticle

Abstract

Solder alloy materials in Sn-Ag-Cu (SAC) group is a lead free soldering materials which widely used in the electronics industry. Solder interconnection act to attach electronic components to printed circuit boards (PCBs). PCB plays an important role in soldering reactions and microstructure solder interconnection-substrate which further affects the reliability of a solder joint. Solder paste of Sn0.3Ag0.7Cu (SAC0307) is soldered on three types of PCB ie PCB without coating (PCB/Cu) as controlled sample, PCB with tin coating (PCB/Sn) and PCB with nickel coating (PCB/Ni). The purpose of this study was to investigate the effect of PCB surface coating on the growth of intermetallic compound (IMC) after different aging tests for 1000 h. The results showed that the average IMC layer thickness ~ 5.7 μm together with lowest IMC layer growth rate is in line with highest activation energy, 41 kJ/mol with the usage of Ni coating as compared to PCB/Cu and PCB/Sn. This means that the Ni coating on PCB is able to control IMC growth up to 40% compared to Sn coating and non-coating.

Original languageMalay
Pages (from-to)2157-2162
Number of pages6
JournalSains Malaysiana
Volume47
Issue number9
DOIs
Publication statusPublished - 1 Jan 2018

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Nickel coatings
Printed circuit boards
Soldering alloys
Intermetallics
Coatings
Soldering
Electronics industry
Tin

ASJC Scopus subject areas

  • General

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Pengawalan pertumbuhan sebatian antara logam sambungan pateri-papan litar bercetak menggunakan salutan nikel. / Bakar, Maria Abu; Jalar @ Jalil, Azman; Abdullah, Mohd Zulkifly; Ibrahim, Najib Saedi; Ambak, Mohd Ariffin.

In: Sains Malaysiana, Vol. 47, No. 9, 01.01.2018, p. 2157-2162.

Research output: Contribution to journalArticle

Bakar, Maria Abu ; Jalar @ Jalil, Azman ; Abdullah, Mohd Zulkifly ; Ibrahim, Najib Saedi ; Ambak, Mohd Ariffin. / Pengawalan pertumbuhan sebatian antara logam sambungan pateri-papan litar bercetak menggunakan salutan nikel. In: Sains Malaysiana. 2018 ; Vol. 47, No. 9. pp. 2157-2162.
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