Control of physical and microstructural properties in molybdenum by direct current magnetron sputtering deposition producing bilayer thin film

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1 Citation (Scopus)

Abstract

Molybdenum (Mo) thin films are widely used in microelectromechanical systems (MEMS) applications. Mo bilayer deposition by direct current (DC) magnetron sputtering has been proposed in order to attain the desired smooth surface, small in-plane tensile stress and high degree crystallisation of Mo thin film for the fabrication of MEMS actuators and electrodes. The influences of sputtering time (10 min–40 min) and sputtering DC power (100 W–250 W) on the physical and microstructural properties of single layer Mo thin film have been evaluated. The optimised sputtering conditions for bottom and top layer of Mo bilayer have been determined and the individual influence of each layer on the resulting Mo bilayer has been discussed. Our studies reveal that the deposition of top Mo layer with small surface roughness but high in-plane tensile stress has reduced the high surface roughness of bottom Mo layer and simultaneously retained the small in-plane tensile stress. Reducing the sputtering time and/or using similar sputtering power for bottom and top layers improved the crystallinity of Mo bilayer along the preferred 〈110〉 direction. Mo bilayer thin films of total thickness < 1 μm, crystallite size >19 nm, surface roughness <2.5 nm and in-plane tensile stress <500 MPa have been attained.

Original languageEnglish
Pages (from-to)17-28
Number of pages12
JournalThin Solid Films
Volume665
DOIs
Publication statusPublished - 1 Nov 2018

Fingerprint

Molybdenum
Magnetron sputtering
molybdenum
magnetron sputtering
physical properties
direct current
Thin films
thin films
plane stress
Sputtering
tensile stress
Tensile stress
sputtering
surface roughness
Surface roughness
microelectromechanical systems
MEMS
Crystallization
crystallinity
Actuators

Keywords

  • Bilayer
  • Magnetron sputtering
  • Microelectromechanical systems
  • Molybdenum
  • Residual stress
  • Surface roughness
  • Thin film
  • X-ray crystallography

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry

Cite this

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title = "Control of physical and microstructural properties in molybdenum by direct current magnetron sputtering deposition producing bilayer thin film",
abstract = "Molybdenum (Mo) thin films are widely used in microelectromechanical systems (MEMS) applications. Mo bilayer deposition by direct current (DC) magnetron sputtering has been proposed in order to attain the desired smooth surface, small in-plane tensile stress and high degree crystallisation of Mo thin film for the fabrication of MEMS actuators and electrodes. The influences of sputtering time (10 min–40 min) and sputtering DC power (100 W–250 W) on the physical and microstructural properties of single layer Mo thin film have been evaluated. The optimised sputtering conditions for bottom and top layer of Mo bilayer have been determined and the individual influence of each layer on the resulting Mo bilayer has been discussed. Our studies reveal that the deposition of top Mo layer with small surface roughness but high in-plane tensile stress has reduced the high surface roughness of bottom Mo layer and simultaneously retained the small in-plane tensile stress. Reducing the sputtering time and/or using similar sputtering power for bottom and top layers improved the crystallinity of Mo bilayer along the preferred 〈110〉 direction. Mo bilayer thin films of total thickness < 1 μm, crystallite size >19 nm, surface roughness <2.5 nm and in-plane tensile stress <500 MPa have been attained.",
keywords = "Bilayer, Magnetron sputtering, Microelectromechanical systems, Molybdenum, Residual stress, Surface roughness, Thin film, X-ray crystallography",
author = "Latif Rhonira and Aziz, {Mohd Faizal} and {Yeop Majlis}, Burhanuddin",
year = "2018",
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T1 - Control of physical and microstructural properties in molybdenum by direct current magnetron sputtering deposition producing bilayer thin film

AU - Rhonira, Latif

AU - Aziz, Mohd Faizal

AU - Yeop Majlis, Burhanuddin

PY - 2018/11/1

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N2 - Molybdenum (Mo) thin films are widely used in microelectromechanical systems (MEMS) applications. Mo bilayer deposition by direct current (DC) magnetron sputtering has been proposed in order to attain the desired smooth surface, small in-plane tensile stress and high degree crystallisation of Mo thin film for the fabrication of MEMS actuators and electrodes. The influences of sputtering time (10 min–40 min) and sputtering DC power (100 W–250 W) on the physical and microstructural properties of single layer Mo thin film have been evaluated. The optimised sputtering conditions for bottom and top layer of Mo bilayer have been determined and the individual influence of each layer on the resulting Mo bilayer has been discussed. Our studies reveal that the deposition of top Mo layer with small surface roughness but high in-plane tensile stress has reduced the high surface roughness of bottom Mo layer and simultaneously retained the small in-plane tensile stress. Reducing the sputtering time and/or using similar sputtering power for bottom and top layers improved the crystallinity of Mo bilayer along the preferred 〈110〉 direction. Mo bilayer thin films of total thickness < 1 μm, crystallite size >19 nm, surface roughness <2.5 nm and in-plane tensile stress <500 MPa have been attained.

AB - Molybdenum (Mo) thin films are widely used in microelectromechanical systems (MEMS) applications. Mo bilayer deposition by direct current (DC) magnetron sputtering has been proposed in order to attain the desired smooth surface, small in-plane tensile stress and high degree crystallisation of Mo thin film for the fabrication of MEMS actuators and electrodes. The influences of sputtering time (10 min–40 min) and sputtering DC power (100 W–250 W) on the physical and microstructural properties of single layer Mo thin film have been evaluated. The optimised sputtering conditions for bottom and top layer of Mo bilayer have been determined and the individual influence of each layer on the resulting Mo bilayer has been discussed. Our studies reveal that the deposition of top Mo layer with small surface roughness but high in-plane tensile stress has reduced the high surface roughness of bottom Mo layer and simultaneously retained the small in-plane tensile stress. Reducing the sputtering time and/or using similar sputtering power for bottom and top layers improved the crystallinity of Mo bilayer along the preferred 〈110〉 direction. Mo bilayer thin films of total thickness < 1 μm, crystallite size >19 nm, surface roughness <2.5 nm and in-plane tensile stress <500 MPa have been attained.

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