Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability

Norliza Ismail, Roslina Ismail, Azman Jalar @ Jalil, Ghazali Omar, Emee Marina Salleh, Norinsan Kamil Othman, Irman Abdul Rahman

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

The effect of using different flux on wettability of Sn-Ag-Cu lead free solder were investigated. In this study, solder paste Sn-3.0Ag-0.5Cu (SAC305) was used by introducing two types of no-clean flux with different ingredients. The solders namely as SAC305-A and SAC305-B respectively. Then, the both solder paste manually printed on printed circuit board (PCB) using stencil printing and then reflowed at 260 °C temperature. Wettability of Sn-Ag-Cu solder using different flux was determined by contact angle measurement using Alicona ® IFM software. Results show the SAC305-A solder alloys have a good and better wettability with lower contact angle compared to SAC305-B. Functional groups of both solder flux was identified by FTIR analysis. Meanwhile XPS analysis was performed in characterizing the studied fluxes. It was found that no-clean flux solder with aromatic functional groups showed lower contact angle value and better wettability than aliphatic contained functional groups.

Original languageEnglish
Pages (from-to)1-7
Number of pages7
JournalJournal of Materials Science: Materials in Electronics
DOIs
Publication statusAccepted/In press - 19 Jun 2018

Fingerprint

solders
wettability
Soldering alloys
Functional groups
Wetting
Fluxes
Contact angle
interactions
Ointments
Angle measurement
Printed circuit boards
printed circuits
circuit boards
Printing
ingredients
printing
X ray photoelectron spectroscopy
computer programs

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Cite this

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title = "Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability",
abstract = "The effect of using different flux on wettability of Sn-Ag-Cu lead free solder were investigated. In this study, solder paste Sn-3.0Ag-0.5Cu (SAC305) was used by introducing two types of no-clean flux with different ingredients. The solders namely as SAC305-A and SAC305-B respectively. Then, the both solder paste manually printed on printed circuit board (PCB) using stencil printing and then reflowed at 260 °C temperature. Wettability of Sn-Ag-Cu solder using different flux was determined by contact angle measurement using Alicona {\circledR} IFM software. Results show the SAC305-A solder alloys have a good and better wettability with lower contact angle compared to SAC305-B. Functional groups of both solder flux was identified by FTIR analysis. Meanwhile XPS analysis was performed in characterizing the studied fluxes. It was found that no-clean flux solder with aromatic functional groups showed lower contact angle value and better wettability than aliphatic contained functional groups.",
author = "Norliza Ismail and Roslina Ismail and {Jalar @ Jalil}, Azman and Ghazali Omar and Salleh, {Emee Marina} and Othman, {Norinsan Kamil} and {Abdul Rahman}, Irman",
year = "2018",
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doi = "10.1007/s10854-018-9410-8",
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journal = "Journal of Materials Science: Materials in Electronics",
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AU - Ismail, Norliza

AU - Ismail, Roslina

AU - Jalar @ Jalil, Azman

AU - Omar, Ghazali

AU - Salleh, Emee Marina

AU - Othman, Norinsan Kamil

AU - Abdul Rahman, Irman

PY - 2018/6/19

Y1 - 2018/6/19

N2 - The effect of using different flux on wettability of Sn-Ag-Cu lead free solder were investigated. In this study, solder paste Sn-3.0Ag-0.5Cu (SAC305) was used by introducing two types of no-clean flux with different ingredients. The solders namely as SAC305-A and SAC305-B respectively. Then, the both solder paste manually printed on printed circuit board (PCB) using stencil printing and then reflowed at 260 °C temperature. Wettability of Sn-Ag-Cu solder using different flux was determined by contact angle measurement using Alicona ® IFM software. Results show the SAC305-A solder alloys have a good and better wettability with lower contact angle compared to SAC305-B. Functional groups of both solder flux was identified by FTIR analysis. Meanwhile XPS analysis was performed in characterizing the studied fluxes. It was found that no-clean flux solder with aromatic functional groups showed lower contact angle value and better wettability than aliphatic contained functional groups.

AB - The effect of using different flux on wettability of Sn-Ag-Cu lead free solder were investigated. In this study, solder paste Sn-3.0Ag-0.5Cu (SAC305) was used by introducing two types of no-clean flux with different ingredients. The solders namely as SAC305-A and SAC305-B respectively. Then, the both solder paste manually printed on printed circuit board (PCB) using stencil printing and then reflowed at 260 °C temperature. Wettability of Sn-Ag-Cu solder using different flux was determined by contact angle measurement using Alicona ® IFM software. Results show the SAC305-A solder alloys have a good and better wettability with lower contact angle compared to SAC305-B. Functional groups of both solder flux was identified by FTIR analysis. Meanwhile XPS analysis was performed in characterizing the studied fluxes. It was found that no-clean flux solder with aromatic functional groups showed lower contact angle value and better wettability than aliphatic contained functional groups.

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