Characterization of silicone gel properties for high power IGBT modules and MEMS

Kim Shyong Siow, T. F. Chen, Y. W. Chan, Azman Jalar @ Jalil, R. M. Vemal, S. T. Chua, F. Husna

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Silicone gels provide the dielectric insulation in insulated gate bipolar transistor (IGBT) power modules to prevent partial discharge, inhibit moisture ingress and keep out contaminants from the internal circuitry. The junction temperatures of these power modules are located between 150°C and 175°C and these temperatures will increase to 200°C in the near future. In addition, power modules are expected to operate for 15 to 20 years. The development time of these power modules is getting shorter to meet the market expectations. Similar demanding conditions are expected for micro-electromechanical systems (MEMS) applications. Hence, there is a need to use characterization tools to short-list silicone gels for further analysis or building of qualification units. Amongst the three silicone gels analysed here, sample C shows the most promise because of its lack of thermal events during the DSC analysis. Sample C also maintains the softness and inertness during the thermal ageing at 150°C for up to 1000 hours. These studies show that judicious use of DSC-TGA, FTIR and gel penetrometer can provide valuable information for the said purpose.

Original languageEnglish
Title of host publication2015 IEEE Conference on Sustainable Utilization and Development in Engineering and Technology, CSUDET 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages23-27
Number of pages5
ISBN (Print)9781479986125
DOIs
Publication statusPublished - 1 Apr 2016
EventIEEE Conference on Sustainable Utilization and Development in Engineering and Technology, CSUDET 2015 - Selangor, Malaysia
Duration: 15 Oct 201517 Oct 2015

Other

OtherIEEE Conference on Sustainable Utilization and Development in Engineering and Technology, CSUDET 2015
CountryMalaysia
CitySelangor
Period15/10/1517/10/15

Fingerprint

Silicone Gels
Insulated gate bipolar transistors (IGBT)
Silicones
MEMS
Gels
Thermal aging
Partial discharges
Insulation
Moisture
Impurities
Temperature
Power bipolar transistors

Keywords

  • power module
  • reliability
  • silicone gel

ASJC Scopus subject areas

  • Computer Science Applications
  • Media Technology
  • Electronic, Optical and Magnetic Materials

Cite this

Siow, K. S., Chen, T. F., Chan, Y. W., Jalar @ Jalil, A., Vemal, R. M., Chua, S. T., & Husna, F. (2016). Characterization of silicone gel properties for high power IGBT modules and MEMS. In 2015 IEEE Conference on Sustainable Utilization and Development in Engineering and Technology, CSUDET 2015 (pp. 23-27). [7446220] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/CSUDET.2015.7446220

Characterization of silicone gel properties for high power IGBT modules and MEMS. / Siow, Kim Shyong; Chen, T. F.; Chan, Y. W.; Jalar @ Jalil, Azman; Vemal, R. M.; Chua, S. T.; Husna, F.

2015 IEEE Conference on Sustainable Utilization and Development in Engineering and Technology, CSUDET 2015. Institute of Electrical and Electronics Engineers Inc., 2016. p. 23-27 7446220.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Siow, KS, Chen, TF, Chan, YW, Jalar @ Jalil, A, Vemal, RM, Chua, ST & Husna, F 2016, Characterization of silicone gel properties for high power IGBT modules and MEMS. in 2015 IEEE Conference on Sustainable Utilization and Development in Engineering and Technology, CSUDET 2015., 7446220, Institute of Electrical and Electronics Engineers Inc., pp. 23-27, IEEE Conference on Sustainable Utilization and Development in Engineering and Technology, CSUDET 2015, Selangor, Malaysia, 15/10/15. https://doi.org/10.1109/CSUDET.2015.7446220
Siow KS, Chen TF, Chan YW, Jalar @ Jalil A, Vemal RM, Chua ST et al. Characterization of silicone gel properties for high power IGBT modules and MEMS. In 2015 IEEE Conference on Sustainable Utilization and Development in Engineering and Technology, CSUDET 2015. Institute of Electrical and Electronics Engineers Inc. 2016. p. 23-27. 7446220 https://doi.org/10.1109/CSUDET.2015.7446220
Siow, Kim Shyong ; Chen, T. F. ; Chan, Y. W. ; Jalar @ Jalil, Azman ; Vemal, R. M. ; Chua, S. T. ; Husna, F. / Characterization of silicone gel properties for high power IGBT modules and MEMS. 2015 IEEE Conference on Sustainable Utilization and Development in Engineering and Technology, CSUDET 2015. Institute of Electrical and Electronics Engineers Inc., 2016. pp. 23-27
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