Characterization of SAC – x NiO nano-reinforced lead-free solder joint in an ultra-fine package assembly

Fakhrozi Che Ani, Azman Jalar @ Jalil, Abdullah Aziz Saad, Chu Yee Khor, Mohamad Aizat Abas, Zuraihana Bachok, Norinsan Kamil Othman

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Purpose: This study aims to investigate the NiO nano-reinforced solder joint characteristics of ultra-fine electronic package. Design/methodology/approach: Lead-free Sn-Ag-Cu (SAC) solder paste was mixed with various percentages of NiO nanoparticles to prepare the new form of nano-reinforced solder paste. The solder paste was applied to assemble the ultra-fine capacitor using the reflow soldering process. A focussed ion beam, high resolution transmission electron microscopy system equipped with energy dispersive X-ray spectroscopy (EDS) was used in this study. In addition, X-ray inspection system, field emission scanning electron microscopy coupled with EDS, X-ray photoelectron spectroscopy (XPS) and nanoindenter were used to analyse the solder void, microstructure, hardness and fillet height of the solder joint. Findings: The experimental results revealed that the highest fillet height was obtained with the content of 0.01 Wt.% of nano-reinforced NiO, which fulfilled the reliability requirements of the international IPC standard. However, the presence of the NiO in the lead-free solder paste only slightly influenced the changes of the intermetallic layer with the increment of weighted percentage. Moreover, the simulation method was applied to observe the distribution of NiO nanoparticles in the solder joint. Originality/value: The findings are expected to provide a profound understanding of nano-reinforced solder joint’s characteristics of the ultra-fine package.

Original languageEnglish
JournalSoldering and Surface Mount Technology
DOIs
Publication statusAccepted/In press - 1 Jan 2018

Fingerprint

solders
Soldering alloys
assembly
Ointments
fillets
Energy dispersive spectroscopy
Nanoparticles
Lead-free solders
nanoparticles
Soldering
soldering
x rays
High resolution transmission electron microscopy
Field emission
Ion beams
Intermetallics
Capacitors
intermetallics
X ray photoelectron spectroscopy
Lead

Keywords

  • Nano-reinforced lead-free solder
  • Nickel oxide nanoparticle
  • SAC305
  • Ultra-fine package

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Cite this

Characterization of SAC – x NiO nano-reinforced lead-free solder joint in an ultra-fine package assembly. / Che Ani, Fakhrozi; Jalar @ Jalil, Azman; Saad, Abdullah Aziz; Khor, Chu Yee; Abas, Mohamad Aizat; Bachok, Zuraihana; Othman, Norinsan Kamil.

In: Soldering and Surface Mount Technology, 01.01.2018.

Research output: Contribution to journalArticle

@article{63dcc2c8e68a475a9fab74d23672f849,
title = "Characterization of SAC – x NiO nano-reinforced lead-free solder joint in an ultra-fine package assembly",
abstract = "Purpose: This study aims to investigate the NiO nano-reinforced solder joint characteristics of ultra-fine electronic package. Design/methodology/approach: Lead-free Sn-Ag-Cu (SAC) solder paste was mixed with various percentages of NiO nanoparticles to prepare the new form of nano-reinforced solder paste. The solder paste was applied to assemble the ultra-fine capacitor using the reflow soldering process. A focussed ion beam, high resolution transmission electron microscopy system equipped with energy dispersive X-ray spectroscopy (EDS) was used in this study. In addition, X-ray inspection system, field emission scanning electron microscopy coupled with EDS, X-ray photoelectron spectroscopy (XPS) and nanoindenter were used to analyse the solder void, microstructure, hardness and fillet height of the solder joint. Findings: The experimental results revealed that the highest fillet height was obtained with the content of 0.01 Wt.{\%} of nano-reinforced NiO, which fulfilled the reliability requirements of the international IPC standard. However, the presence of the NiO in the lead-free solder paste only slightly influenced the changes of the intermetallic layer with the increment of weighted percentage. Moreover, the simulation method was applied to observe the distribution of NiO nanoparticles in the solder joint. Originality/value: The findings are expected to provide a profound understanding of nano-reinforced solder joint’s characteristics of the ultra-fine package.",
keywords = "Nano-reinforced lead-free solder, Nickel oxide nanoparticle, SAC305, Ultra-fine package",
author = "{Che Ani}, Fakhrozi and {Jalar @ Jalil}, Azman and Saad, {Abdullah Aziz} and Khor, {Chu Yee} and Abas, {Mohamad Aizat} and Zuraihana Bachok and Othman, {Norinsan Kamil}",
year = "2018",
month = "1",
day = "1",
doi = "10.1108/SSMT-08-2018-0024",
language = "English",
journal = "Soldering and Surface Mount Technology",
issn = "0954-0911",
publisher = "Emerald Group Publishing Ltd.",

}

TY - JOUR

T1 - Characterization of SAC – x NiO nano-reinforced lead-free solder joint in an ultra-fine package assembly

AU - Che Ani, Fakhrozi

AU - Jalar @ Jalil, Azman

AU - Saad, Abdullah Aziz

AU - Khor, Chu Yee

AU - Abas, Mohamad Aizat

AU - Bachok, Zuraihana

AU - Othman, Norinsan Kamil

PY - 2018/1/1

Y1 - 2018/1/1

N2 - Purpose: This study aims to investigate the NiO nano-reinforced solder joint characteristics of ultra-fine electronic package. Design/methodology/approach: Lead-free Sn-Ag-Cu (SAC) solder paste was mixed with various percentages of NiO nanoparticles to prepare the new form of nano-reinforced solder paste. The solder paste was applied to assemble the ultra-fine capacitor using the reflow soldering process. A focussed ion beam, high resolution transmission electron microscopy system equipped with energy dispersive X-ray spectroscopy (EDS) was used in this study. In addition, X-ray inspection system, field emission scanning electron microscopy coupled with EDS, X-ray photoelectron spectroscopy (XPS) and nanoindenter were used to analyse the solder void, microstructure, hardness and fillet height of the solder joint. Findings: The experimental results revealed that the highest fillet height was obtained with the content of 0.01 Wt.% of nano-reinforced NiO, which fulfilled the reliability requirements of the international IPC standard. However, the presence of the NiO in the lead-free solder paste only slightly influenced the changes of the intermetallic layer with the increment of weighted percentage. Moreover, the simulation method was applied to observe the distribution of NiO nanoparticles in the solder joint. Originality/value: The findings are expected to provide a profound understanding of nano-reinforced solder joint’s characteristics of the ultra-fine package.

AB - Purpose: This study aims to investigate the NiO nano-reinforced solder joint characteristics of ultra-fine electronic package. Design/methodology/approach: Lead-free Sn-Ag-Cu (SAC) solder paste was mixed with various percentages of NiO nanoparticles to prepare the new form of nano-reinforced solder paste. The solder paste was applied to assemble the ultra-fine capacitor using the reflow soldering process. A focussed ion beam, high resolution transmission electron microscopy system equipped with energy dispersive X-ray spectroscopy (EDS) was used in this study. In addition, X-ray inspection system, field emission scanning electron microscopy coupled with EDS, X-ray photoelectron spectroscopy (XPS) and nanoindenter were used to analyse the solder void, microstructure, hardness and fillet height of the solder joint. Findings: The experimental results revealed that the highest fillet height was obtained with the content of 0.01 Wt.% of nano-reinforced NiO, which fulfilled the reliability requirements of the international IPC standard. However, the presence of the NiO in the lead-free solder paste only slightly influenced the changes of the intermetallic layer with the increment of weighted percentage. Moreover, the simulation method was applied to observe the distribution of NiO nanoparticles in the solder joint. Originality/value: The findings are expected to provide a profound understanding of nano-reinforced solder joint’s characteristics of the ultra-fine package.

KW - Nano-reinforced lead-free solder

KW - Nickel oxide nanoparticle

KW - SAC305

KW - Ultra-fine package

UR - http://www.scopus.com/inward/record.url?scp=85058857734&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85058857734&partnerID=8YFLogxK

U2 - 10.1108/SSMT-08-2018-0024

DO - 10.1108/SSMT-08-2018-0024

M3 - Article

AN - SCOPUS:85058857734

JO - Soldering and Surface Mount Technology

JF - Soldering and Surface Mount Technology

SN - 0954-0911

ER -