Characterization of parasitic residual deposition on passivation layer in electroless nickel immersion gold process

M. K. Md Arshad, Azman Jalar @ Jalil, I. Ahmad

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

The problem of parasitic residual deposition on the passivation layer in electroless deposition process is studied in this paper. The characterization analysis tools involved are focused ion beam (FIB), scanning electron microscopy (SEM), electron dispersive X-ray (EDX) and metallurgical interface analysis. Samples were identified as either good or bad prior to the characterization process via a high power microscope. A good sample is the one without parasitic deposition while a bad sample contains parasitic residual deposition on the passivation surface. Ultrasonic vibration has been able to remove the parasitic deposition and reveal crack presence on the passivation surfaces. Crack was found extended to the aluminum underneath that leads to the formation of the parasitic residual deposition. Additional sacrificial photoresist on top of passivation was able to eliminate this parasitic deposition.

Original languageEnglish
Pages (from-to)1120-1126
Number of pages7
JournalMicroelectronics Reliability
Volume47
Issue number7
DOIs
Publication statusPublished - Jul 2007

Fingerprint

Nickel
Passivation
Gold
submerging
passivity
nickel
gold
cracks
Cracks
electroless deposition
Electroless plating
Focused ion beams
Photoresists
Aluminum
photoresists
Vibrations (mechanical)
Microscopes
ultrasonics
Ultrasonics
ion beams

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Characterization of parasitic residual deposition on passivation layer in electroless nickel immersion gold process. / Md Arshad, M. K.; Jalar @ Jalil, Azman; Ahmad, I.

In: Microelectronics Reliability, Vol. 47, No. 7, 07.2007, p. 1120-1126.

Research output: Contribution to journalArticle

@article{b6b955f5ce78471ca718a41751a49c42,
title = "Characterization of parasitic residual deposition on passivation layer in electroless nickel immersion gold process",
abstract = "The problem of parasitic residual deposition on the passivation layer in electroless deposition process is studied in this paper. The characterization analysis tools involved are focused ion beam (FIB), scanning electron microscopy (SEM), electron dispersive X-ray (EDX) and metallurgical interface analysis. Samples were identified as either good or bad prior to the characterization process via a high power microscope. A good sample is the one without parasitic deposition while a bad sample contains parasitic residual deposition on the passivation surface. Ultrasonic vibration has been able to remove the parasitic deposition and reveal crack presence on the passivation surfaces. Crack was found extended to the aluminum underneath that leads to the formation of the parasitic residual deposition. Additional sacrificial photoresist on top of passivation was able to eliminate this parasitic deposition.",
author = "{Md Arshad}, {M. K.} and {Jalar @ Jalil}, Azman and I. Ahmad",
year = "2007",
month = "7",
doi = "10.1016/j.microrel.2006.07.003",
language = "English",
volume = "47",
pages = "1120--1126",
journal = "Microelectronics and Reliability",
issn = "0026-2714",
publisher = "Elsevier Limited",
number = "7",

}

TY - JOUR

T1 - Characterization of parasitic residual deposition on passivation layer in electroless nickel immersion gold process

AU - Md Arshad, M. K.

AU - Jalar @ Jalil, Azman

AU - Ahmad, I.

PY - 2007/7

Y1 - 2007/7

N2 - The problem of parasitic residual deposition on the passivation layer in electroless deposition process is studied in this paper. The characterization analysis tools involved are focused ion beam (FIB), scanning electron microscopy (SEM), electron dispersive X-ray (EDX) and metallurgical interface analysis. Samples were identified as either good or bad prior to the characterization process via a high power microscope. A good sample is the one without parasitic deposition while a bad sample contains parasitic residual deposition on the passivation surface. Ultrasonic vibration has been able to remove the parasitic deposition and reveal crack presence on the passivation surfaces. Crack was found extended to the aluminum underneath that leads to the formation of the parasitic residual deposition. Additional sacrificial photoresist on top of passivation was able to eliminate this parasitic deposition.

AB - The problem of parasitic residual deposition on the passivation layer in electroless deposition process is studied in this paper. The characterization analysis tools involved are focused ion beam (FIB), scanning electron microscopy (SEM), electron dispersive X-ray (EDX) and metallurgical interface analysis. Samples were identified as either good or bad prior to the characterization process via a high power microscope. A good sample is the one without parasitic deposition while a bad sample contains parasitic residual deposition on the passivation surface. Ultrasonic vibration has been able to remove the parasitic deposition and reveal crack presence on the passivation surfaces. Crack was found extended to the aluminum underneath that leads to the formation of the parasitic residual deposition. Additional sacrificial photoresist on top of passivation was able to eliminate this parasitic deposition.

UR - http://www.scopus.com/inward/record.url?scp=34249801776&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=34249801776&partnerID=8YFLogxK

U2 - 10.1016/j.microrel.2006.07.003

DO - 10.1016/j.microrel.2006.07.003

M3 - Article

AN - SCOPUS:34249801776

VL - 47

SP - 1120

EP - 1126

JO - Microelectronics and Reliability

JF - Microelectronics and Reliability

SN - 0026-2714

IS - 7

ER -