Characterization of HNA etchant for silicon microneedles array fabrication

Research output: Chapter in Book/Report/Conference proceedingConference contribution

20 Citations (Scopus)

Abstract

Research on microneedles has been increasing rapidly to overcome the drawbacks of hypodermic needle which can results in painful injection, tissue damage and uncontrollable delivery rate. This paper presents process characterization of wet isotropic etching for solid microneedles array development. Work has been carried out to investigate the isotropic etching behavior in 17 different compositions of HNA solution. The experimental responses of vertical etch rate and lateral etch rate are presented. Resulting surface profiles from various HNA compositions are also reported. The etching properties will be applied to develop recipe to fabricate the optimum solid microneedles.

Original languageEnglish
Title of host publicationIEEE International Conference on Semiconductor Electronics, Proceedings, ICSE
Pages203-206
Number of pages4
DOIs
Publication statusPublished - 2008
Event2008 IEEE International Conference on Semiconductor Electronics, ICSE 2008 - Johor Bahru, Johor
Duration: 25 Nov 200827 Nov 2008

Other

Other2008 IEEE International Conference on Semiconductor Electronics, ICSE 2008
CityJohor Bahru, Johor
Period25/11/0827/11/08

Fingerprint

Silicon
Etching
Fabrication
Wet etching
Chemical analysis
Needles
Tissue

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Abd Aziz, N., Bais, B., Hamzah, A. A., & Yeop Majlis, B. (2008). Characterization of HNA etchant for silicon microneedles array fabrication. In IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE (pp. 203-206). [4770308] https://doi.org/10.1109/SMELEC.2008.4770308

Characterization of HNA etchant for silicon microneedles array fabrication. / Abd Aziz, Norazreen; Bais, Badariah; Hamzah, Azrul Azlan; Yeop Majlis, Burhanuddin.

IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE. 2008. p. 203-206 4770308.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abd Aziz, N, Bais, B, Hamzah, AA & Yeop Majlis, B 2008, Characterization of HNA etchant for silicon microneedles array fabrication. in IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE., 4770308, pp. 203-206, 2008 IEEE International Conference on Semiconductor Electronics, ICSE 2008, Johor Bahru, Johor, 25/11/08. https://doi.org/10.1109/SMELEC.2008.4770308
Abd Aziz N, Bais B, Hamzah AA, Yeop Majlis B. Characterization of HNA etchant for silicon microneedles array fabrication. In IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE. 2008. p. 203-206. 4770308 https://doi.org/10.1109/SMELEC.2008.4770308
@inproceedings{357bc613034740189db831ea29f1a864,
title = "Characterization of HNA etchant for silicon microneedles array fabrication",
abstract = "Research on microneedles has been increasing rapidly to overcome the drawbacks of hypodermic needle which can results in painful injection, tissue damage and uncontrollable delivery rate. This paper presents process characterization of wet isotropic etching for solid microneedles array development. Work has been carried out to investigate the isotropic etching behavior in 17 different compositions of HNA solution. The experimental responses of vertical etch rate and lateral etch rate are presented. Resulting surface profiles from various HNA compositions are also reported. The etching properties will be applied to develop recipe to fabricate the optimum solid microneedles.",
author = "{Abd Aziz}, Norazreen and Badariah Bais and Hamzah, {Azrul Azlan} and {Yeop Majlis}, Burhanuddin",
year = "2008",
doi = "10.1109/SMELEC.2008.4770308",
language = "English",
isbn = "9781424425617",
pages = "203--206",
booktitle = "IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE",

}

TY - GEN

T1 - Characterization of HNA etchant for silicon microneedles array fabrication

AU - Abd Aziz, Norazreen

AU - Bais, Badariah

AU - Hamzah, Azrul Azlan

AU - Yeop Majlis, Burhanuddin

PY - 2008

Y1 - 2008

N2 - Research on microneedles has been increasing rapidly to overcome the drawbacks of hypodermic needle which can results in painful injection, tissue damage and uncontrollable delivery rate. This paper presents process characterization of wet isotropic etching for solid microneedles array development. Work has been carried out to investigate the isotropic etching behavior in 17 different compositions of HNA solution. The experimental responses of vertical etch rate and lateral etch rate are presented. Resulting surface profiles from various HNA compositions are also reported. The etching properties will be applied to develop recipe to fabricate the optimum solid microneedles.

AB - Research on microneedles has been increasing rapidly to overcome the drawbacks of hypodermic needle which can results in painful injection, tissue damage and uncontrollable delivery rate. This paper presents process characterization of wet isotropic etching for solid microneedles array development. Work has been carried out to investigate the isotropic etching behavior in 17 different compositions of HNA solution. The experimental responses of vertical etch rate and lateral etch rate are presented. Resulting surface profiles from various HNA compositions are also reported. The etching properties will be applied to develop recipe to fabricate the optimum solid microneedles.

UR - http://www.scopus.com/inward/record.url?scp=65949103190&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=65949103190&partnerID=8YFLogxK

U2 - 10.1109/SMELEC.2008.4770308

DO - 10.1109/SMELEC.2008.4770308

M3 - Conference contribution

AN - SCOPUS:65949103190

SN - 9781424425617

SP - 203

EP - 206

BT - IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE

ER -