Characterization and optimization of seals-off for Very Low Pressure Sensors (VLPS) fabricated by CMOS MEMS process

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

In the world of MEMS processing today, fabrications of membrane are performed using bulk micromachining (BMM). However these techniques not easiest to integrate with CMOS standard process due to not compatible of the processing flow. An attractive alternative deployment of surface micromachining (SMM). There is a trend to use surface micromachining to their advantage of simplicity in design and fabrication process compatibility. This paper presents process development of thin layer membrane for very low capacitive pressure sensor application. The structure of the membrane consists of parallel plate which both top and bottom electrodes were fixed at both sides. Utilizing CMOS MEMS process compatible fabrication of the thin layer membrane involved in three stages; i) hole opening etch, ii) sacrificial intermediate oxide release etch and iii) closing of etch holes. Therefore seals-off process characterization and optimization experiment are presented in this paper, will spur advancement in the development of a CMOS MEMS product for very low capacitive pressure sensor.

Original languageEnglish
Title of host publicationAdvanced Materials Research
Pages231-234
Number of pages4
Volume74
DOIs
Publication statusPublished - 2009
EventInternational Conference on Materials for Advanced Technologies, ICMAT 2009 - Singpore
Duration: 28 Jun 20093 Jul 2009

Publication series

NameAdvanced Materials Research
Volume74
ISSN (Print)10226680

Other

OtherInternational Conference on Materials for Advanced Technologies, ICMAT 2009
CitySingpore
Period28/6/093/7/09

Fingerprint

Pressure sensors
MEMS
Seals
Membranes
Surface micromachining
Capacitive sensors
Fabrication
Micromachining
Processing
Electrodes
Oxides
Experiments

Keywords

  • Bulk micromachining
  • CMOS MEMS compatible
  • CMOS MEMS product
  • Surface micromachining

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Characterization and optimization of seals-off for Very Low Pressure Sensors (VLPS) fabricated by CMOS MEMS process. / Buyong, Muhamad Ramdzan; Abd Aziz, Norazreen; Yeop Majlis, Burhanuddin.

Advanced Materials Research. Vol. 74 2009. p. 231-234 (Advanced Materials Research; Vol. 74).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Buyong, MR, Abd Aziz, N & Yeop Majlis, B 2009, Characterization and optimization of seals-off for Very Low Pressure Sensors (VLPS) fabricated by CMOS MEMS process. in Advanced Materials Research. vol. 74, Advanced Materials Research, vol. 74, pp. 231-234, International Conference on Materials for Advanced Technologies, ICMAT 2009, Singpore, 28/6/09. https://doi.org/10.4028/www.scientific.net/AMR.74.231
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